CN213688301U - Detection device for detecting roughness of wafer cutting ring - Google Patents
Detection device for detecting roughness of wafer cutting ring Download PDFInfo
- Publication number
- CN213688301U CN213688301U CN202023155590.5U CN202023155590U CN213688301U CN 213688301 U CN213688301 U CN 213688301U CN 202023155590 U CN202023155590 U CN 202023155590U CN 213688301 U CN213688301 U CN 213688301U
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- Prior art keywords
- cylinder
- sets
- cutting ring
- roughness
- slide rail
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000001514 detection method Methods 0.000 title claims abstract description 22
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 238000005259 measurement Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
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Abstract
The utility model relates to a detection apparatus for be used for detecting roughness of wafer-cutting ring, including determine module and conveyor, conveyor sets up and just is located the thing platform in determine module below, and conveyor includes locating component and drive assembly, and two sets of locating components set up and put thing platform both sides, and two sets of drive assembly set up in the locating component side, and locating component includes first cylinder and clamp plate, and the clamp plate setting is on the telescopic link of first cylinder, the vertical setting of telescopic link, and drive assembly includes the second cylinder, locating plate and slider, slider and horizontal screw threaded connection, horizontal screw are connected with driving motor, the second cylinder sets up on the slider and is connected with the locating plate. The utility model can realize the adjustment and movement of the roughness measuring instrument in the horizontal and vertical directions, and can be suitable for the detection of wafer cutting rings with different sizes and types; in addition, can realize wafer cutting ring automatic movement, make things convenient for many times to measure, promote measurement of efficiency.
Description
Technical Field
The utility model relates to a wafer cutting ring processing technology field, in particular to a detection device for be used for detecting wafer cutting ring roughness.
Background
At present, a film pasting process is required in the wafer processing process. In this process, the wafer is attached to the wafer dicing ring with a chip film, thereby holding the wafer in a stable position during dicing and other processes. After the wafer cutting ring is machined, the roughness of the wafer cutting ring needs to be detected so as to judge whether the product is qualified. The existing detection mode mainly adopts a roughness measuring instrument to manually detect and judge, but the manual detection speed is slow, the measurement consistency is poor, a large number of workers are needed, and the cost is high.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve prior art's problem, provide one kind can be convenient for the roughness measurement, the detection device who is used for detecting the roughness of wafer cutting ring who makes things convenient for the multiple spot to detect.
The specific technical scheme is as follows: the utility model provides a detection apparatus for be used for detecting roughness of wafer-cutting ring, includes determine module and conveyor, and conveyor sets up and just is located to put the thing platform in determine module below, conveyor includes locating component and drive assembly, and two sets of locating components set up and put thing platform both sides, and two sets of drive assembly set up in the locating component side, locating component includes first cylinder and clamp plate, and the clamp plate setting is on the telescopic link of first cylinder, the vertical setting of telescopic link, drive assembly includes the second cylinder, locating plate and slider, slider and horizontal screw threaded connection, horizontal screw are connected with driving motor, the second cylinder sets up on the slider and is connected with the locating plate.
As preferred scheme, the detection subassembly includes base and sliding seat, and the base setting is on putting the thing platform, and the base is equipped with first slide rail, and first slide rail level sets up, and the sliding seat setting is on first slide rail.
As an optimal scheme, a second sliding rail is arranged on the sliding seat and is vertically arranged, a lifting seat is arranged on the second sliding rail, and a roughness measuring instrument is arranged on the lifting seat.
Preferably, a reinforcing plate is arranged on the back of the second slide rail.
Preferably, the lifting seat comprises a sliding part and a supporting part, and the sliding part and the supporting part are connected through a bolt.
The technical effects of the utility model: the detection device for detecting the roughness of the wafer cutting ring can realize the adjustment and the movement of the roughness measuring instrument in the horizontal and vertical directions, and can be suitable for the detection of the wafer cutting rings with different sizes and types; in addition, can realize wafer cutting ring automatic movement, make things convenient for many times to measure, promote measurement of efficiency.
Drawings
Fig. 1 is a schematic diagram of a detection apparatus for detecting roughness of a wafer dicing ring according to an embodiment of the present invention.
Fig. 2 is an enlarged view of a portion a in fig. 1 according to the present invention.
Fig. 3 is a schematic diagram of a detection assembly according to an embodiment of the present invention.
Detailed Description
The essential features and advantages of the invention will be further explained below with reference to examples, but the invention is not limited to the embodiments listed.
As shown in fig. 1 to 3, the detecting device for detecting the roughness of the wafer cutting ring of the embodiment includes a detecting component 1 and a conveying device 2, the conveying device 2 is disposed below the detecting component 1 and located on the object placing table 3, the conveying device 2 includes a positioning component 4 and a driving component 5, two sets of positioning components 4 are disposed on two sides of the object placing table 3, two sets of driving components 5 are disposed on the side of the positioning component 4, the positioning component 4 includes a first cylinder 41 and a pressing plate 42, the pressing plate 42 is disposed on an expansion link 43 of the first cylinder 41, and the expansion link 43 is vertically disposed. The driving assembly 5 comprises a second air cylinder 51, a positioning plate 52 and a sliding block 53, wherein the sliding block 53 is in threaded connection with the horizontal screw 6, and the horizontal screw 6 is connected with the driving motor 7. The second cylinder 51 is disposed on the slider 53 and connected to the positioning plate 52. Among the above-mentioned technical scheme, wafer cutting ring 10 is placed on the processing platform, compresses tightly the wafer cutting ring through second cylinder 51 drive locating plate 52, then drives horizontal screw 6 through driving motor 7 and rotates for slider 53 can remove along horizontal screw, and drive assembly drags the wafer cutting ring and removes to the assigned position. The first air cylinder drives the pressing plate to press the wafer cutting ring tightly, and then roughness detection is carried out on the wafer cutting ring 10 through the detection assembly 1. By the technical scheme, the wafer cutting ring can be conveyed to the lower part of the detection device through the conveying device, so that the wafer cutting ring can be detected; in addition, the position can be adjusted through the conveying device, and multiple times of detection are achieved. During detection, the wafer cutting ring can be positioned through the positioning assembly, and the movement of the wafer cutting ring is avoided.
In this embodiment, the detecting assembly 1 includes a base 11 and a sliding seat 12, the base 11 is disposed on the object placing table 3, the base 11 is provided with a first sliding rail 13, the first sliding rail 13 is horizontally disposed, and the sliding seat 12 is disposed on the first sliding rail 13. Through the technical scheme, the sliding seat 12 can move along the horizontal direction of the first sliding rail 13, so that the horizontal position of the sliding seat can be conveniently adjusted. In this embodiment, the sliding seat 12 is provided with a second sliding rail 14, the second sliding rail 14 is vertically disposed, the second sliding rail 14 is provided with a lifting seat 15, and the lifting seat 15 is provided with a roughness measuring instrument 8. Through the technical scheme, the height of the lifting seat 15 can be adjusted through the second sliding rail 14, so that when a product is detected, the lifting seat 15 can move downwards, and the roughness measuring instrument 8 can be in contact with the product for measurement; after the measurement is completed, the elevating base 15 is raised. In this embodiment, the back surface of the second slide rail 14 is provided with a reinforcing plate 16, so as to support the second slide rail 14, and make the structural stability of the second slide rail better. In this embodiment, the lifting base 15 includes a sliding portion 151 and a supporting portion 152, and the sliding portion 151 and the supporting portion 152 are connected by a bolt 9. Through the technical scheme, the angle between the sliding part 151 and the supporting part 152 can be adjusted, and then the roughness measuring instrument is conveniently adjusted through bolt fastening.
The detection device for detecting the roughness of the wafer cutting ring can realize the adjustment and movement of the roughness measuring instrument in the horizontal and vertical directions, and can be suitable for the detection of the wafer cutting rings with different sizes and types; in addition, can realize wafer cutting ring automatic movement, make things convenient for many times to measure, promote measurement of efficiency.
It should be noted that the above-mentioned preferred embodiments are only for illustrating the technical concepts and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention accordingly, and the protection scope of the present invention cannot be limited thereby. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (5)
1. The utility model provides a detection device for detecting roughness of wafer cutting ring, its characterized in that, includes determine module and conveyor, and conveyor sets up in determine module below and is located puts the thing platform, conveyor includes locating component and drive assembly, and two sets of locating component set up and put thing platform both sides, and two sets of drive assembly set up in the locating component side, locating component includes first cylinder and clamp plate, and the clamp plate setting is on the telescopic link of first cylinder, the vertical setting of telescopic link, drive assembly includes the second cylinder, locating plate and slider, slider and horizontal screw threaded connection, horizontal screw are connected with driving motor, the second cylinder sets up on the slider and is connected with the locating plate.
2. The apparatus as claimed in claim 1, wherein the detecting assembly includes a base and a sliding seat, the base is disposed on the object stage, the base has a first slide rail, the first slide rail is disposed horizontally, and the sliding seat is disposed on the first slide rail.
3. The apparatus as claimed in claim 2, wherein the sliding base has a second slide rail, the second slide rail is vertically disposed, the second slide rail has a lifting base, and the lifting base has a roughness measuring instrument.
4. The detecting device for detecting the roughness of the wafer cutting ring as claimed in claim 3, wherein a reinforcing plate is arranged on the back surface of the second slide rail.
5. The detecting device for detecting the roughness of the wafer cutting ring as claimed in claim 4, wherein the lifting seat comprises a sliding part and a supporting part, and the sliding part and the supporting part are connected through a bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023155590.5U CN213688301U (en) | 2020-12-24 | 2020-12-24 | Detection device for detecting roughness of wafer cutting ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023155590.5U CN213688301U (en) | 2020-12-24 | 2020-12-24 | Detection device for detecting roughness of wafer cutting ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213688301U true CN213688301U (en) | 2021-07-13 |
Family
ID=76739988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023155590.5U Expired - Fee Related CN213688301U (en) | 2020-12-24 | 2020-12-24 | Detection device for detecting roughness of wafer cutting ring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213688301U (en) |
-
2020
- 2020-12-24 CN CN202023155590.5U patent/CN213688301U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210713 |