CN110560328B - Automatic glue mixing and scraping system - Google Patents
Automatic glue mixing and scraping system Download PDFInfo
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- CN110560328B CN110560328B CN201910775785.2A CN201910775785A CN110560328B CN 110560328 B CN110560328 B CN 110560328B CN 201910775785 A CN201910775785 A CN 201910775785A CN 110560328 B CN110560328 B CN 110560328B
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- glue
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- scraping
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- 239000003292 glue Substances 0.000 title claims abstract description 107
- 238000007790 scraping Methods 0.000 title claims abstract description 58
- 235000012431 wafers Nutrition 0.000 claims abstract description 60
- 239000000463 material Substances 0.000 claims abstract description 25
- 229910000831 Steel Inorganic materials 0.000 claims description 20
- 239000010959 steel Substances 0.000 claims description 20
- 238000003860 storage Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000011068 loading method Methods 0.000 description 35
- 238000010586 diagram Methods 0.000 description 21
- 230000009286 beneficial effect Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/04—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
Landscapes
- Coating Apparatus (AREA)
Abstract
Description
技术领域Technical Field
本发明属于混胶刮胶加工技术领域，尤其涉及一种自动混胶刮胶系统。The invention belongs to the technical field of glue mixing and scraping processing, and in particular relates to an automatic glue mixing and scraping system.
背景技术Background technique
目前，某些产品的完整自动化工序需进行储料、上料、上胶等多个工序，目前不同工序需不同的设备来进行实现，这中间的物料转移需通过人来手工进行物料转移，以进行下一个工序，大大降低生产效率、且这种转移过程，速度太慢，大大影响上胶效果。At present, the complete automation process of some products requires multiple processes such as material storage, loading, and gluing. Different processes require different equipment to implement. The material transfer in the middle needs to be manually transferred by people to proceed to the next process, which greatly reduces production efficiency. In addition, the transfer process is too slow, which greatly affects the gluing effect.
因此，现有技术有待于改善。Therefore, the prior art needs to be improved.
发明内容Summary of the invention
本发明的主要目的在于提出一种自动混胶刮胶系统，旨在解决背景技术中所提及的技术问题，提高生产效率，能够避免人工转移物料的问题，能够自动实现多种工艺。The main purpose of the present invention is to propose an automatic glue mixing and scraping system, aiming to solve the technical problems mentioned in the background technology, improve production efficiency, avoid the problem of manual material transfer, and automatically realize a variety of processes.
本发明一种自动混胶刮胶系统，其特征在于，包括可转动的设置有若干物料夹具的转盘、晶片上料机构、第一混胶刮胶机构、绝缘片上料机构和第二混胶刮胶机构，物料夹具上设置有待加工产品，第一混胶刮胶机构输出混合胶至待加工产品上，绝缘片上料机构将绝缘片输出至待加工产品的混合胶上，第二混胶刮胶机构输出混合胶至绝缘片上，晶片上料机构输出晶片至位于绝缘片上的混合胶上。The present invention discloses an automatic glue mixing and scraping system, which is characterized by comprising a rotatable turntable provided with a plurality of material clamps, a chip loading mechanism, a first glue mixing and scraping mechanism, an insulating sheet loading mechanism and a second glue mixing and scraping mechanism, wherein the material clamp is provided with a product to be processed, the first glue mixing and scraping mechanism outputs the mixed glue to the product to be processed, the insulating sheet loading mechanism outputs the insulating sheet to the mixed glue of the product to be processed, the second glue mixing and scraping mechanism outputs the mixed glue to the insulating sheet, and the chip loading mechanism outputs the chip to the mixed glue located on the insulating sheet.
优选地，晶片上料机构包括第一底座、铰接于底座上的立柱结构、第一晶片夹具、第二晶片夹具、第三晶片夹具、第四晶片夹具、设置于第一底座顶部的第一电机、设置于第一底座上的用于将晶片进行竖直方向移动的顶升组件和设置于顶升组件上的气缸移动组件，第一电机上的第一转轴位于第一底座底部并通过传动带与立柱底部连接，第一晶片夹具、第二晶片夹具、第三晶片夹具和第四晶片夹具均设置于立柱结构上。Preferably, the wafer loading mechanism includes a first base, a column structure hinged on the base, a first wafer clamp, a second wafer clamp, a third wafer clamp, a fourth wafer clamp, a first motor arranged on the top of the first base, a lifting assembly arranged on the first base for moving the wafer in a vertical direction, and a cylinder moving assembly arranged on the lifting assembly, the first rotating shaft on the first motor is located at the bottom of the first base and is connected to the bottom of the column through a transmission belt, and the first wafer clamp, the second wafer clamp, the third wafer clamp and the fourth wafer clamp are all arranged on the column structure.
优选地，绝缘片上料机构包括第二底座、第五气缸、开设有第一凹槽的盒体、可在第一凹槽上移动的推杆、设置于盒体上的存储有绝缘片的储料筒、第二真空吸盘、设置于第二底座上的固定板、第二滑块、第二Z轴气缸和第二X轴气缸，固定板上设置有第二X轴导轨，第二滑块可在第二X轴导轨上移动，第二Z轴气缸固定于第二滑块上，第二真空吸盘与第二Z轴气缸连接，第二X轴气缸与第二滑块连接，第五气缸与推杆连接。Preferably, the insulating sheet feeding mechanism includes a second base, a fifth cylinder, a box body with a first groove, a push rod movable on the first groove, a storage barrel for storing insulating sheets arranged on the box body, a second vacuum suction cup, a fixed plate arranged on the second base, a second slider, a second Z-axis cylinder and a second X-axis cylinder, a second X-axis guide rail is arranged on the fixed plate, the second slider can move on the second X-axis guide rail, the second Z-axis cylinder is fixed on the second slider, the second vacuum suction cup is connected to the second Z-axis cylinder, the second X-axis cylinder is connected to the second slider, and the fifth cylinder is connected to the push rod.
优选地，第一混胶刮胶机构包括第三支架、第一立柱、第二立柱、第一储胶筒、第二储胶筒、第三X轴导轨、设置于第三X轴导轨上的混胶阀、与混胶阀连接的第六气缸、设置于第三X轴导轨上的第七气缸和与第七气缸连接的第一刮刀，第三X轴导轨底部设置有钢网，钢网顶部开设有第十通孔，第一立柱和第二立柱均设置于第三支架和第三X轴导轨之间。Preferably, the first glue mixing and scraping mechanism includes a third bracket, a first column, a second column, a first glue storage cylinder, a second glue storage cylinder, a third X-axis guide rail, a glue mixing valve arranged on the third X-axis guide rail, a sixth cylinder connected to the glue mixing valve, a seventh cylinder arranged on the third X-axis guide rail and a first scraper connected to the seventh cylinder, a steel mesh is arranged at the bottom of the third X-axis guide rail, a tenth through hole is opened at the top of the steel mesh, and the first column and the second column are both arranged between the third bracket and the third X-axis guide rail.
优选地，待加工产品包括钢槽。Preferably, the product to be processed comprises a steel tank.
优选地，第一混胶刮胶机构和晶片上料机构分别位于转盘的左右两侧，绝缘片上料机构和第二混胶刮胶机构均位于第一混胶刮胶机构和晶片上料机构之间。Preferably, the first glue mixing and scraping mechanism and the wafer loading mechanism are respectively located on the left and right sides of the turntable, and the insulating sheet loading mechanism and the second glue mixing and scraping mechanism are both located between the first glue mixing and scraping mechanism and the wafer loading mechanism.
本发明的自动混胶刮胶系统，有益效果如下：将晶片上料机构、第一混胶刮胶机构、绝缘片上料机构和第二混胶刮胶机构分别置于可转动的转盘周边，利用转盘可转动的优势，避免人工转移物料的问题；转盘上设置有若干物料夹具，每个物料夹具均可放置待加工产品，保证生产效率。The automatic glue mixing and scraping system of the present invention has the following beneficial effects: the chip loading mechanism, the first glue mixing and scraping mechanism, the insulating sheet loading mechanism and the second glue mixing and scraping mechanism are respectively placed around the rotatable turntable, and the advantage of the rotatable turntable is utilized to avoid the problem of manual material transfer; a plurality of material clamps are arranged on the turntable, and each material clamp can hold the product to be processed to ensure production efficiency.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为本发明自动混胶刮胶系统的三维示意图；FIG1 is a three-dimensional schematic diagram of an automatic glue mixing and scraping system of the present invention;
图2为本发明自动混胶刮胶系统中晶片上料机构的第一三维示意图；FIG2 is a first three-dimensional schematic diagram of a wafer loading mechanism in the automatic glue mixing and scraping system of the present invention;
图3为晶片上料机构中立柱结构和晶片的结构示意图；FIG3 is a schematic diagram of the structure of the pillar structure and the wafer in the wafer loading mechanism;
图4为晶片上料机构中立柱结构和四个晶片夹具的结构示意图；FIG4 is a schematic diagram of the structure of the column structure and four wafer clamps in the wafer loading mechanism;
图5为晶片上料机构中第一底座的底部示意图；FIG5 is a bottom schematic diagram of a first base in a wafer loading mechanism;
图6为晶片上料机构中气缸移动组件的结构示意图；FIG6 is a schematic diagram of the structure of the cylinder moving assembly in the wafer loading mechanism;
图7为晶片上料机构中顶升组件的结构示意图；FIG7 is a schematic diagram of the structure of a lifting assembly in a wafer loading mechanism;
图8为绝缘片上料机构的结构示意图；FIG8 is a schematic structural diagram of an insulating sheet feeding mechanism;
图9为第一混胶刮胶机构的主视图；FIG9 is a front view of the first glue mixing and scraping mechanism;
图10为第一混胶刮胶机构的三维示意图；FIG10 is a three-dimensional schematic diagram of a first glue mixing and scraping mechanism;
图11为第一混胶刮胶机构中钢网的结构示意图；FIG11 is a schematic diagram of the structure of the steel mesh in the first glue mixing and scraping mechanism;
图12为本发明自动混胶刮胶系统中待加工产品的三维示意图。FIG. 12 is a three-dimensional schematic diagram of a product to be processed in the automatic glue mixing and scraping system of the present invention.
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings.
具体实施方式Detailed ways
应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。需要注意的是，相关术语如“第一”、“第二”等可以用于描述各种组件，但是这些术语并不限制该组件。这些术语仅用于区分一个组件和另一组件。例如，不脱离本发明的范围，第一组件可以被称为第二组件，并且第二组件类似地也可以被称为第一组件。术语“和/或”是指相关项和描述项的任何一个或多个的组合。It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. It should be noted that related terms such as "first", "second", etc. can be used to describe various components, but these terms do not limit the components. These terms are only used to distinguish one component from another component. For example, without departing from the scope of the present invention, the first component can be referred to as the second component, and the second component can also be referred to as the first component similarly. The term "and/or" refers to any one or more combinations of related items and description items.
如图1所示，图1为本发明自动混胶刮胶系统的三维示意图。As shown in FIG. 1 , FIG. 1 is a three-dimensional schematic diagram of the automatic glue mixing and scraping system of the present invention.
本发明的自动混胶刮胶系统，包括可转动的设置有若干物料夹具的转盘5000、晶片上料机构5005、第一混胶刮胶机构5002、绝缘片上料机构5003和第二混胶刮胶机构5004，晶片上料机构、第一混胶刮胶机构、绝缘片上料机构和第二混胶刮胶机构均设置于转盘上，物料夹具上设置有待加工产品，第一混胶刮胶机构输出混合胶至待加工产品6025上，绝缘片上料机构将绝缘片输出至待加工产品的混合胶上，第二混胶刮胶机构输出混合胶至绝缘片上，晶片上料机构输出晶片至位于绝缘片上的混合胶上；对于物料夹具的具体结构不做限定，可以是一个凹槽5001，待加工产品能够放置于凹槽内；可以是夹紧机构，以将待加工产品固定住；对于转盘，可理解为旋转工作台，由凸轮分割器驱动，多工位，属于现有的结构，不做具体结构限定。本发明的自动混胶刮胶系统，有益效果如下：将晶片上料机构、第一混胶刮胶机构、绝缘片上料机构和第二混胶刮胶机构集成于可转动的圆盘上，避免人工转移物料的问题；转动转盘上设置有若干物料夹具，每个物料夹具均可放置待加工产品，保证生产效率。The automatic glue mixing and scraping system of the present invention comprises a rotatable turntable 5000 provided with a plurality of material clamps, a chip loading mechanism 5005, a first glue mixing and scraping mechanism 5002, an insulating sheet loading mechanism 5003 and a second glue mixing and scraping mechanism 5004. The chip loading mechanism, the first glue mixing and scraping mechanism, the insulating sheet loading mechanism and the second glue mixing and scraping mechanism are all arranged on the turntable, and the material clamp is provided with the product to be processed. The first glue mixing and scraping mechanism outputs the mixed glue to the product to be processed 6025, the insulating sheet loading mechanism outputs the insulating sheet to the mixed glue of the product to be processed, the second glue mixing and scraping mechanism outputs the mixed glue to the insulating sheet, and the chip loading mechanism outputs the chip to the mixed glue located on the insulating sheet. There is no limitation on the specific structure of the material clamp, which can be a groove 5001, and the product to be processed can be placed in the groove; it can be a clamping mechanism to fix the product to be processed; the turntable can be understood as a rotating workbench driven by a cam divider, with multiple stations, which belongs to the existing structure and is not limited to the specific structure. The automatic glue mixing and scraping system of the present invention has the following beneficial effects: the chip loading mechanism, the first glue mixing and scraping mechanism, the insulating sheet loading mechanism and the second glue mixing and scraping mechanism are integrated on a rotatable disc to avoid the problem of manual material transfer; a plurality of material clamps are arranged on the rotating turntable, and each material clamp can hold the product to be processed to ensure production efficiency.
如图2、图3、图4、图5、图6、图7所示，图2为本发明自动混胶刮胶系统中晶片上料机构的第一三维示意图；图3为晶片上料机构中立柱结构和晶片的结构示意图；图4为晶片上料机构中立柱结构和四个晶片夹具的结构示意图；图5为晶片上料机构中第一底座的底部示意图；图6为晶片上料机构中气缸移动组件的结构示意图；图7为晶片上料机构中顶升组件的结构示意图。As shown in Figures 2, 3, 4, 5, 6 and 7, Figure 2 is the first three-dimensional schematic diagram of the chip loading mechanism in the automatic glue mixing and scraping system of the present invention; Figure 3 is a structural schematic diagram of the column structure and the chip in the chip loading mechanism; Figure 4 is a structural schematic diagram of the column structure and four chip clamps in the chip loading mechanism; Figure 5 is a bottom schematic diagram of the first base in the chip loading mechanism; Figure 6 is a structural schematic diagram of the cylinder moving assembly in the chip loading mechanism; Figure 7 is a structural schematic diagram of the lifting assembly in the chip loading mechanism.
对于晶片上料机构，包括第一底座10、铰接于第一底座10上的立柱结构20、第一晶片夹具91、第二晶片夹具92、第三晶片夹具93、第四晶片夹具94、设置于底座顶部的第一电机30、设置于第一底座上的用于将晶片99进行竖直方向移动的顶升组件40和设置于顶升组件上的气缸移动组件50，第一电机30上的第一转轴191位于第一底座底部并通过传动带190与立柱底部192连接，第一晶片夹具、第二晶片夹具、第三晶片夹具和第四晶片夹具均设置于立柱20上。本优选实施例对于晶片上料机构进行具体结构限定，有益效果如下：通过四个晶片夹具设置，能够存储更多的晶片99，通过第一电机带动立柱转动，每一个晶片夹具能够旋转以到达顶升组件40所在位置，以让顶升组件进行顶升操作，将晶片往竖直向上方向进行移动，以便于快速上料。第一电机上的第一转轴位于底座底部并通过传动带190与立柱底部连接，实现立柱的转动，传动带的连接方式便于维护。本优选实施例对于晶片夹具如何夹住晶片不进行具体限定，可以为凹槽放置、可以为夹持；晶片包括有线晶片，表示现有的超声换能器。如图7所示，优选地，顶升组件包括第二电机290、丝杆292、设置于第二电机上的第一Y轴导轨293、固定板296和设置于第一Y轴导轨293上的第一滑块295，固定板296设置于第一滑块295上，第二电机上的第二转轴通过同步带291与丝杆292一端连接，丝杆另一端穿过固定板296上通孔后与螺母295固定，固定板上设置有支撑块294。更具体地，丝杆292一端穿过顶板297的安装孔后与带轮连接，带轮与第二转轴之间通过同步带291连接。本优选实施例对于顶升组件进行具体限定，以实现支撑块能够在Y轴导轨上实现移动，以将晶片顶起。如图6所示，优选地，气缸移动组件包括第一真空吸盘491、用于将第一真空吸盘进行Y轴方向移动的第一气缸490、设置在第一气缸490上的第一X轴导轨494和与用于将第一气缸在第一X轴导轨494移动的第二气缸493；本优选实施例对于气缸移动组件进行具体限定，以通过第一气缸490将第一真空吸盘491在Y轴方向移动，以吸附住晶片，再通过第二气缸和第一X轴导轨494设置，实现将晶片在X轴方向移动，以实现上料。The wafer loading mechanism includes a first base 10, a column structure 20 hinged on the first base 10, a first wafer clamp 91, a second wafer clamp 92, a third wafer clamp 93, a fourth wafer clamp 94, a first motor 30 arranged on the top of the base, a lifting assembly 40 arranged on the first base for moving the wafer 99 in the vertical direction, and a cylinder moving assembly 50 arranged on the lifting assembly. The first rotating shaft 191 on the first motor 30 is located at the bottom of the first base and is connected to the bottom 192 of the column through a transmission belt 190. The first wafer clamp, the second wafer clamp, the third wafer clamp and the fourth wafer clamp are all arranged on the column 20. This preferred embodiment makes specific structural limitations on the wafer loading mechanism, and the beneficial effects are as follows: by setting four wafer clamps, more wafers 99 can be stored, and by driving the column to rotate by the first motor, each wafer clamp can rotate to reach the position of the lifting assembly 40, so that the lifting assembly can perform a lifting operation to move the wafer in a vertical upward direction for fast loading. The first rotating shaft on the first motor is located at the bottom of the base and connected to the bottom of the column through a transmission belt 190 to realize the rotation of the column. The connection method of the transmission belt is convenient for maintenance. This preferred embodiment does not specifically limit how the wafer clamp clamps the wafer, which can be placed in a groove or clamped; the wafer includes a wired wafer, which represents an existing ultrasonic transducer. As shown in Figure 7, preferably, the lifting assembly includes a second motor 290, a screw rod 292, a first Y-axis guide rail 293 arranged on the second motor, a fixed plate 296 and a first slider 295 arranged on the first Y-axis guide rail 293, the fixed plate 296 is arranged on the first slider 295, the second rotating shaft on the second motor is connected to one end of the screw rod 292 through a synchronous belt 291, and the other end of the screw rod is fixed to the nut 295 after passing through the through hole on the fixed plate 296, and a support block 294 is arranged on the fixed plate. More specifically, one end of the screw rod 292 passes through the mounting hole of the top plate 297 and is connected to the pulley, and the pulley and the second rotating shaft are connected through a synchronous belt 291. This preferred embodiment specifically defines the lifting assembly so that the support block can move on the Y-axis guide rail to lift the wafer. As shown in Figure 6, preferably, the cylinder moving assembly includes a first vacuum suction cup 491, a first cylinder 490 for moving the first vacuum suction cup in the Y-axis direction, a first X-axis guide rail 494 arranged on the first cylinder 490, and a second cylinder 493 for moving the first cylinder on the first X-axis guide rail 494; this preferred embodiment specifically defines the cylinder moving assembly so that the first vacuum suction cup 491 is moved in the Y-axis direction by the first cylinder 490 to absorb the wafer, and then the wafer is moved in the X-axis direction by the second cylinder and the first X-axis guide rail 494 to achieve loading.
如图8所示，图8为绝缘片上料机构的结构示意图；绝缘片上料机构包括第二底座6022、第五气缸6019、开设有第一凹槽的盒体6021、可在第一凹槽上移动的推杆6020、设置于盒体上的存储有绝缘片的储料筒6010、第二真空吸盘6015、设置于第二底座上的固定板6033、第二滑块6013、第二Z轴气缸6012和第二X轴气缸6011，固定板上设置有第二X轴导轨6014，第二滑块6013可在第二X轴导轨6014上移动，第二Z轴气缸6012固定于第二滑块6013上，第二真空吸盘与第二Z轴气缸连接，第二X轴气缸与第二滑块连接；第五气缸6019与推杆6020连接；本优选实施例对绝缘片上料机构进行具体结构限定，有益效果如下：基于第二真空吸盘设置，提高对于绝缘片的夹紧牢固性，基于第二滑块带动第二真空吸盘在第二X轴导轨移动，以及基于第二X轴气缸、第二Z轴气缸的动力源设置，大大提高上料效率、上料稳定性。优选地，第二X轴导轨包括第一转轴和第二转轴，第二滑块上开设有第一通孔和第二通孔，第一转轴嵌入第一通孔中，第二转轴嵌入第二通孔中(图中未标注)；本优选实施例对于第二X轴导轨进行具体结构限定，通过两个转轴嵌入滑块中两个通孔中，以提高两者连接的牢固性的同时，实现第二滑块能够在第一转轴和第二转轴上移动，以实现绝缘片的移动、上料。优选地，储料筒上开设有开口6088，以便于让工位有料检测机构进行绝缘片检测；优选地，还包括设置于底座上的报警器6018。优选地，还包括设置于真空吸盘上的抓料传感器6016。优选地，还包括设置于盒体上的工位有料检测机构17。工位有料检测机构包括光电传感器；抓料传感器包括光电传感器。As shown in FIG8 , FIG8 is a schematic diagram of the structure of the insulating sheet feeding mechanism; the insulating sheet feeding mechanism includes a second base 6022, a fifth cylinder 6019, a box body 6021 with a first groove, a push rod 6020 movable on the first groove, a storage barrel 6010 storing insulating sheets arranged on the box body, a second vacuum suction cup 6015, a fixed plate 6033 arranged on the second base, a second slider 6013, a second Z-axis cylinder 6012 and a second X-axis cylinder 6011, a second X-axis guide rail 6014 is arranged on the fixed plate, and the second slider 6013 can be moved on the second X-axis guide rail 6014 moves, the second Z-axis cylinder 6012 is fixed on the second slider 6013, the second vacuum suction cup is connected to the second Z-axis cylinder, and the second X-axis cylinder is connected to the second slider; the fifth cylinder 6019 is connected to the push rod 6020; this preferred embodiment makes a specific structural definition of the insulating sheet feeding mechanism, and the beneficial effects are as follows: based on the second vacuum suction cup setting, the clamping firmness of the insulating sheet is improved, based on the second slider driving the second vacuum suction cup to move on the second X-axis guide rail, and based on the power source setting of the second X-axis cylinder and the second Z-axis cylinder, the feeding efficiency and feeding stability are greatly improved. Preferably, the second X-axis guide rail includes a first rotating shaft and a second rotating shaft, the second slider is provided with a first through hole and a second through hole, the first rotating shaft is embedded in the first through hole, and the second rotating shaft is embedded in the second through hole (not marked in the figure); this preferred embodiment makes a specific structural definition of the second X-axis guide rail, and the two rotating shafts are embedded in the two through holes in the slider to improve the firmness of the connection between the two, and at the same time, the second slider can move on the first rotating shaft and the second rotating shaft to realize the movement and feeding of the insulating sheet. Preferably, an opening 6088 is provided on the material storage barrel to facilitate the workstation material detection mechanism to detect the insulating sheet; preferably, an alarm 6018 is provided on the base. Preferably, a material grabbing sensor 6016 is provided on the vacuum suction cup. Preferably, a workstation material detection mechanism 17 is provided on the box body. The workstation material detection mechanism includes a photoelectric sensor; the material grabbing sensor includes a photoelectric sensor.
如图9、图10、图11所示，图9为第一混胶刮胶机构的主视图；图10为第一混胶刮胶机构的三维示意图；图11为第一混胶刮胶机构中钢网的结构示意图；第一混胶刮胶机构包括第三支架7010、第一立柱7043、第二立柱7044、第一储胶筒7041、第二储胶筒7042、第三X轴导轨7088、设置于第三X轴导轨上的混胶阀7021、与混胶阀连接的第六气缸7023、设置于第三X轴导轨上的第七气缸7027和与第七气缸连接的第一刮刀7022，第三X轴导轨底部设置有钢网7026，钢网顶部开设有第十通孔70261，第一立柱和第二立柱均设置于第三支架7010和第三X轴导轨之间。本优选实施例对第一混胶刮胶装置进行具体结构限定，有益效果如下：1、基于第一储胶筒、第二储胶筒、混胶阀设置，实现将两种不同的胶进行混合，具备混胶功能。2、基于第六气缸设置、混胶阀与第六气缸连接、第三X轴导轨，使得第六气缸推动混胶阀在第三X轴导轨上左右移动，以将混胶阀所输出的混合胶均匀地掉落于位于待加工产品6025上方的钢网上，再经钢网上的第十通孔70261流动至待加工产品6025的底盖上；3、第一立柱和第二立柱均设置于第三支架和第三X轴导轨之间，以提高整体结构强度，保证气缸推动时整体结构的稳定性。优选地，第一储胶筒通过第一导管与混胶阀连接，第二储胶筒通过第二导管与混胶阀连接(图中未标注导管)。优选地，待加工产品包括钢槽，钢槽应用于超声波清洗容器内；第一混胶刮胶装置的工作流程：首先将存储于第一储胶筒内的A胶和存储于第二储胶筒内的B胶经各自导管输入至混胶阀，电机供能给混胶阀以进行混胶操作，六气缸推动混胶阀在第三X轴导轨上左右移动，以将混胶阀所输出的混合胶均匀输出至钢网上，七气缸27带动第一刮刀22在钢网上左右移动，以将混合胶经第十通孔输入至待加工产品的底盖上，即钢槽的底盖上(如图12所示)。优选地，还包括托链24，拖链一端与混胶阀固定，另一端与X轴导轨固定，以提供一定限位作用。其中，钢槽表示钢结构，钢结构上开设有内槽。需注意的是，对于第二混胶刮胶机构，其具体结构与第一混胶刮胶机构相同，其作用是将两种不同种类的胶混合后，输出至钢槽底盖上的绝缘片上，以待下一个工位中的晶片粘合在绝缘片上。As shown in Figures 9, 10 and 11, Figure 9 is a front view of the first mixing and scraping mechanism; Figure 10 is a three-dimensional schematic diagram of the first mixing and scraping mechanism; Figure 11 is a structural schematic diagram of the steel mesh in the first mixing and scraping mechanism; the first mixing and scraping mechanism includes a third bracket 7010, a first column 7043, a second column 7044, a first glue storage cylinder 7041, a second glue storage cylinder 7042, a third X-axis guide rail 7088, a mixing valve 7021 arranged on the third X-axis guide rail, a sixth cylinder 7023 connected to the mixing valve, a seventh cylinder 7027 arranged on the third X-axis guide rail and a first scraper 7022 connected to the seventh cylinder, a steel mesh 7026 is arranged at the bottom of the third X-axis guide rail, a tenth through hole 70261 is opened at the top of the steel mesh, and the first column and the second column are both arranged between the third bracket 7010 and the third X-axis guide rail. This preferred embodiment makes specific structural limitations on the first glue mixing and scraping device, and the beneficial effects are as follows: 1. Based on the first glue storage cylinder, the second glue storage cylinder, and the glue mixing valve, two different glues can be mixed and have a glue mixing function. 2. Based on the sixth cylinder setting, the glue mixing valve is connected to the sixth cylinder, and the third X-axis guide rail, the sixth cylinder pushes the glue mixing valve to move left and right on the third X-axis guide rail, so that the mixed glue output by the glue mixing valve is evenly dropped on the steel net located above the product to be processed 6025, and then flows to the bottom cover of the product to be processed 6025 through the tenth through hole 70261 on the steel net; 3. The first column and the second column are both arranged between the third bracket and the third X-axis guide rail to improve the overall structural strength and ensure the stability of the overall structure when the cylinder is pushed. Preferably, the first glue storage cylinder is connected to the glue mixing valve through the first conduit, and the second glue storage cylinder is connected to the glue mixing valve through the second conduit (the conduit is not marked in the figure). Preferably, the product to be processed includes a steel trough, which is used in an ultrasonic cleaning container; the working process of the first glue mixing and scraping device is as follows: first, glue A stored in the first glue storage cylinder and glue B stored in the second glue storage cylinder are input into the glue mixing valve through their respective conduits, and the motor supplies energy to the glue mixing valve to perform the glue mixing operation, and the six cylinders push the glue mixing valve to move left and right on the third X-axis guide rail to evenly output the mixed glue output by the glue mixing valve to the steel net, and the seven cylinders 27 drive the first scraper 22 to move left and right on the steel net to input the mixed glue through the tenth through hole to the bottom cover of the product to be processed, that is, the bottom cover of the steel trough (as shown in Figure 12). Preferably, it also includes a support chain 24, one end of which is fixed to the glue mixing valve, and the other end is fixed to the X-axis guide rail to provide a certain limiting effect. Among them, the steel trough represents a steel structure, and an inner groove is opened on the steel structure. It should be noted that the specific structure of the second glue mixing and scraping mechanism is the same as that of the first glue mixing and scraping mechanism. Its function is to mix two different types of glue and output them to the insulating sheet on the bottom cover of the steel trough, so that the chip in the next workstation can be bonded to the insulating sheet.
以上仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
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