TWI718721B - Circuit board manufacturing method - Google Patents

Abstract

The present invention provides a circuit board manufacturing method. The circuit board manufacturing method includes a preliminary step, a placing step, an adsorption step, and a processing step. The preliminary step: a processing station is disposed a plurality of adsorption holes. A mesa of the processing station is disposed a plurality of fixed pins. The placing step: A circuit substrate is prepared, and a plurality of fixing holes is formed in the circuit substrate. The plurality of the fixing holes is respectively sleeved with the plurality of the fixing pins, so that the circuit substrate is disposed on the processing table. The adsorption step: A negative pressure airflow is generated on the circuit substrate through a plurality of the adsorption holes by a negative pressure device, so that the circuit substrate is positioned on the processing station. The processing step: A portion of the circuit substrate provided with the plurality of fixing holes is removed by a processing device, and the remaining circuit substrate is cut to form a plurality of circuit boards.

Description

Manufacturing method of circuit board

The invention relates to a manufacturing method of a circuit board, in particular to a manufacturing method of a circuit board that can make the finished product not have positioning holes.

During the manufacturing process of the existing circuit board manufacturing method, in order to be able to position the circuit substrate (not yet processed) on the table surface of the workbench, a plurality of positioning holes are respectively opened on the edge of the circuit substrate and the edge of the circuit board area to be formed. Then, the circuit board is sleeved with the positioning member on the workbench through a plurality of positioning holes, so that the circuit board is positioned on the workbench; accordingly, it is ensured that the circuit board will not move during processing and affect the accuracy of processing.

However, the circuit board manufactured by the above-mentioned manufacturing method will retain two reserved edges with positioning holes on its side to prevent the circuit board from moving during the processing of the circuit board. However, the circuit board manufactured by the above-mentioned manufacturing method When the board is shipped, additional equipment is required to remove the reserved edge on the circuit board before the circuit board can be shipped and sold, which not only increases the equipment cost but also takes time.

Therefore, the inventor believes that the above-mentioned shortcomings can be improved, and with great concentration of research and the application of scientific principles, we finally propose an invention with reasonable design and effective improvement of the above-mentioned shortcomings.

The technical problem to be solved by the present invention is to provide a method for manufacturing a circuit board in view of the shortcomings of the prior art, which can effectively improve the time-consuming method of manufacturing a circuit board and requires additional additions. The disadvantage of purchasing equipment for processing (removing the reserved edges).

The embodiment of the present invention discloses a method for manufacturing a circuit board, which includes: implementing a pre-step: a processing table is provided with a plurality of first suction holes, and a plurality of fixing pins are arranged on a table of the processing table, And the plurality of first suction holes and the plurality of fixing pins do not block each other; a placement step is implemented: a circuit substrate is set on the processing table; wherein the circuit substrate is provided with a plurality of first fixed holes , A plurality of the first fixing holes are respectively sleeved with a plurality of the fixing pins, so that the circuit substrate is arranged on the processing table; a suction step is performed: a negative pressure device is used to apply a negative pressure to the plurality of the first suction The hole generates a negative pressure air flow flowing toward the table surface, and the circuit substrate is adsorbed and positioned by the negative pressure air flow to maintain the relative position of the circuit substrate and the processing table; and a processing step is implemented: A processing device processes the circuit board to remove the portion of the circuit board provided with the plurality of first fixing holes, and cuts the remaining circuit board to separate the cut and separated portions of the circuit board. Parts of the circuit board form a plurality of circuit boards.

Preferably, in the preceding step, a backing plate is provided on the work surface, wherein the backing plate has a plurality of second suction holes and a plurality of second fixing holes, and the backing plate passes through a plurality of The second fixing holes are respectively sleeved with a plurality of the fixing pins, so that the backing plate is arranged on the processing table, and the plurality of second suction holes communicate with the plurality of first suction holes; , The circuit substrate is respectively sleeved on the plurality of fixing pins through the plurality of first fixing holes, so that the circuit substrate is located on the backing plate and does not contact the processing table.

Preferably, the backing plate is made of soft material, and the area of the backing plate is not less than the area of the circuit substrate, so that the circuit substrate is separated by the backing plate without contacting the processing table Of the countertop.

Preferably, in the placing step, a cover plate is used to cover the circuit substrate on the processing table; wherein the cover plate has a plurality of socket holes, and a plurality of the socket holes A plurality of the fixing pins are sleeved so that the cover plate covers the circuit substrate and is fixed to the work As a countertop.

Preferably, the area of the cover plate is not less than the area of the circuit substrate, so that the cover plate completely covers the circuit substrate.

Preferably, the processing table has a work area, and a plurality of predetermined processing areas are defined in the work area, and a plurality of the fixing pins are respectively arranged in the work area and the plurality of predetermined processing areas. edge.

Preferably, the working area and the plurality of predetermined processing areas are rectangular respectively, and the first fixing holes are respectively provided at the four corners of the working area and the plurality of predetermined processing areas.

Preferably, the working area is defined with a first direction and a second direction perpendicular to each other, and a plurality of the predetermined processing areas are arranged in M rows parallel to the first direction and parallel to the second direction. N column, M and N are each a positive integer greater than 1.

Preferably, in the processing step, the processing device processes the portions of the circuit substrate corresponding to the plurality of predetermined processing regions in the first direction or the second direction, so that the portions corresponding to the plurality of predetermined processing regions are processed. Two grooves are formed in the portion of the circuit board in the predetermined processing area to remove the portion of the circuit board provided with the plurality of first fixing holes, so that the remaining circuit board forms the plurality of circuits board.

The embodiment of the present invention discloses a circuit board structure, which is made by the above-mentioned manufacturing method of the circuit board.

To sum up, in the method for manufacturing the circuit board disclosed in the embodiment of the present invention, the plurality of fixing pins are sleeved with the first fixing holes of the circuit board, so that the circuit board is preliminarily positioned on the processing table, and Cooperating with the negative pressure device to generate the negative pressure airflow to the circuit substrate through the plurality of first suction holes, according to this, when the circuit substrate is in the process of the processing step, it can be firmly positioned on the Processing on the processing table and processing, so that the processed circuit board does not have a reserved edge Or positioning holes, thereby greatly reducing the time and equipment cost required for the production of the circuit board.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the provided drawings are only for reference and description, and are not used to limit the present invention.

1: Processing table

11: Countertop

12: fixed pin

13: The first adsorption hole

2: Circuit board

21: The first fixing hole

22: Optical positioning point

23: circuit board

24: part of the circuit board

4: Pad

41: The second adsorption hole

42: second fixing hole

5: Cover

51: socket hole

52: part of the cover

A: Work area

B: Scheduled processing area

C: negative pressure airflow

D1: First direction

D2: second direction

S110: Preliminary steps

S120: Placement steps

S130: Adsorption step

S140: Processing steps

FIG. 1 is a schematic flowchart of a manufacturing method of a circuit board according to a first embodiment of the present invention.

2 is a three-dimensional schematic diagram of the manufacturing method of the circuit board according to the first embodiment of the present invention when the pre-steps are implemented.

3 is a three-dimensional schematic diagram of the manufacturing method of the circuit board according to the first embodiment of the present invention during the placing step.

4 is a schematic cross-sectional view of the manufacturing method of the circuit board according to the first embodiment of the present invention during the adsorption step.

FIG. 5 is a three-dimensional schematic diagram of the manufacturing method of the circuit board according to the first embodiment of the present invention during the processing steps.

6 is a schematic diagram of the manufacturing method of the circuit board according to the second embodiment of the present invention during the pre-step and placement steps.

7 is a schematic cross-sectional view of the manufacturing method of the circuit board according to the second embodiment of the present invention during the adsorption step.

FIG. 8 is a three-dimensional schematic diagram of the manufacturing method of the circuit board according to the second embodiment of the present invention during the processing steps.

The following is a specific specific embodiment to illustrate the "circuit" disclosed in the present invention Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented through other different specific embodiments or Application, the various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are only schematic illustrations, not based on actual dimensions. Depicted, declared in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another, or one signal from another signal. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

[First Embodiment]

As shown in FIGS. 1 to 5, which are the first embodiment of the present invention, this embodiment discloses a method for manufacturing a circuit board, which is used to manufacture a plurality of circuit boards without reserved edges and positioning holes. In order to reduce the time and equipment cost of the production process. The manufacturing method of the circuit board includes: a pre-step S110, a placement step S120, an adsorption step S130, and a processing step S140.

Of course, any one of the above multiple steps can be omitted or replaced with a reasonable change according to the needs of the designer. Among them, it should be explained first that, in order to facilitate the understanding of this embodiment, the drawings are illustrated by a top plan view.

As shown in FIG. 2, the pre-step S110: A plurality of first suction holes 13 are opened on a processing table 1, and a plurality of fixing pins 12 are arranged on a table 11 of the processing table 1, and more The first suction holes 13 and the plurality of fixing pins 12 do not block each other. Specifically, a plurality of the first adsorption holes 13 are evenly distributed on the processing table 1, and the plurality of the first adsorption holes 13 may have the same pore diameter or different pore diameters, and a plurality of the fixed pores 13 The pins 12 are respectively set on the table 11 and located between the plurality of first suction holes 13 without blocking the plurality of first suction holes 13. It should be noted that in other embodiments not shown in the present invention, the plurality of first suction holes 13 may also be arranged in the area enclosed by the plurality of fixing pins 12, but is not limited to Contained in this example.

In addition, a working area A is formed on the table surface 11 of the processing table 1, and a first direction D1 and a second direction D2 are defined perpendicular to each other. A plurality of predetermined processing areas are formed in the working area A. B, and a plurality of the predetermined processing regions B are arranged in M rows parallel to the first direction D1 and N columns parallel to the second direction D2. M and N are each a positive integer greater than 1, and are arranged in the A plurality of the fixing pins 12 are respectively provided on the edges of the working area A and each of the predetermined processing areas B.

That is to say, the plurality of predetermined processing areas B are arranged in a matrix in the working area A, but the arrangement of the plurality of predetermined processing areas B is not limited to that described in this embodiment. Specifically, in other embodiments not shown in the present invention, the arrangement of the plurality of predetermined processing areas B can be arbitrarily changed according to the needs of the designer, for example, a staggered arrangement.

In addition, as shown in FIG. 3, the placing step S120: a circuit substrate 2 is set on the processing table 1; wherein the circuit substrate 2 is provided with a plurality of first fixing holes 21, and a plurality of the first fixing holes 21 are respectively sleeved with a plurality of the fixing pins 12 so that the circuit board 2 is set on the processing table 1.

In more detail, the circuit substrate 2 in this embodiment may be a printed circuit board (PCB) and has a rectangular shape, and the first fixing holes 21 are opened on the four corners of the circuit substrate 2 The first fixing holes 21 on its four corners are respectively sleeved on the plurality of fixing pins 12, so that the plurality of fixing pins 12 are separated from the inner edges of the plurality of first fixing holes 21 Don't get stuck against each other, so that the circuit substrate 2 is preliminarily positioned on the processing table 1 accordingly.

In addition, the portions of the circuit substrate 2 corresponding to the plurality of predetermined processing regions B are rectangular in this embodiment, and are located on four of the portions of each of the aforementioned circuit substrate 2 (corresponding to the plurality of predetermined processing regions B). Each corner is provided with the first fixing holes 21, and a plurality of optical positioning points 22 are provided beside each of the first fixing holes 21 for subsequent identification and processing.

Specifically, the contour of the circuit substrate 2 corresponds to the shape of the working area A, and the shapes of the plurality of predetermined processing areas B correspond to the shape of the circuit board to be manufactured. That is to say, the shapes of the working area A and the plurality of predetermined processing areas B can be adjusted according to the production requirements, and the working area A and the plurality of predetermined processing areas B respectively correspond to each other in this embodiment. The shape of the circuit substrate 2 and the plurality of circuit boards is rectangular, and the plurality of first fixing holes 21 are arranged according to the contour edges of the circuit substrate 2 and the plurality of circuit boards to be manufactured, But it is not limited to what is contained in this embodiment.

As shown in FIG. 4, the adsorption step S130: a negative pressure device (not shown in the figure) is used to generate a negative pressure airflow C flowing toward the inside of the table 11 on a plurality of the first adsorption holes 13 and pass The negative pressure airflow C sucks and positions the circuit substrate 2 on the processing table 1 to maintain the relative position of the circuit substrate 2 and the processing table 1.

Specifically, the negative pressure device is set in the processing table 1, and generates the negative pressure airflow C toward the circuit board 2 through the plurality of first suction holes 13, thereby making the circuit The substrate 2 is firmly adsorbed and positioned on the processing table 1, but is not limited to what is contained in this embodiment. For example, the negative pressure device may be arranged beside the processing table 1 and connected to a plurality of the first adsorption holes 13 through a draft tube, so that the negative pressure device can be used for the processing table 1 The circuit board 2 on 1 generates the negative pressure airflow C.

5, the processing step S140: processing the circuit substrate 2 (not shown in the figure, such as a milling machine) with a processing device to remove the plurality of first fixing holes 21 The part of the circuit board 2 is cut, and the remaining circuit board 2 is cut, so that the cut and separated parts of the circuit board 2 form a plurality of circuit boards 23.

In detail, the processing device recognizes the plurality of optical positioning points 22 on the portion of the circuit substrate 2 (that is, the portion corresponding to the predetermined processing area B) to confirm the plurality of optical positioning points 22 on the circuit substrate 2. The first fixing hole 21 is located, and the circuit board 2 is processed for the first time in the first direction D1 or the second direction D2 so as to correspond to all the predetermined processing regions B The portion of the circuit substrate 2 forms two grooves, and the position of each groove corresponds to the position of the plurality of first fixing holes 21 on the same side of the circuit board 23, so as to remove the plurality of first fixing holes 21. Fixing hole 21 The portion 24 of the circuit board 2; then, the processing device performs a second processing on the remaining circuit board 2, and cuts the portion of the circuit board 2 corresponding to each of the predetermined processing regions B to make The portion of the circuit board 2 separated by cutting forms a plurality of the circuit boards 23.

Based on the above, this embodiment also discloses a circuit board structure. The circuit board structure is made by the above-mentioned circuit board manufacturing method after performing the above-mentioned multiple steps S110 to S140, and the circuit board structure can not be There are any positioning holes, but the manufacturing of the circuit board structure of the present invention (that is, the circuit board 23) is not limited to the implementation of the above steps S110 to S140.

[Second Embodiment]

As shown in Figures 6 to 8, it is the second embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, and the similarities between the two embodiments will not be repeated. However, this embodiment is compared with the above-mentioned first embodiment. The main differences of the first embodiment are: As shown in FIG. 6, in the pre-step S110, a backing plate 4 is provided on the processing table 1, wherein the backing plate 4 has a plurality of second suction holes 41 and a plurality of second fixing holes 42 , The backing plate 4 is respectively sleeved with a plurality of the fixing pins 12 through a plurality of the second fixing holes 42 so that the backing plate 4 is set on the processing table 1 and a plurality of the second suction The hole 41 communicates with the plurality of first suction holes 13; then, the circuit substrate 2 is sleeved on the plurality of fixing pins 12 through the plurality of first fixing holes 21, so that the circuit substrate 2 It is located on the backing plate 4 and is not in contact with the processing table 1.

Specifically, the backing plate 4 in this embodiment may be made of a soft material, the backing plate 4 is evenly provided with a plurality of the second suction holes 41, and each of the second suction holes 41 It corresponds to and communicates with each of the first adsorption holes 13, and the pore size of the plurality of first adsorption holes 13 may be the same or different, and is not limited to what is described in this embodiment. In addition, a plurality of second fixing holes 42 are opened on the edge of the backing plate 4, and the backing plate 4 is respectively sleeved on the plurality of fixing pins 12 through the plurality of second fixing holes 42 to make The inner edges of the plurality of second fixing holes 42 and the plurality of fixing pins 12 are engaged with each other, so that the backing plate 4 is positioned on the table top 11 accordingly.

Following the placing step S120, the circuit substrate 2 is sleeved on the plurality of fixing pins 12 through the plurality of first fixing holes 21, so that the circuit substrate 2 is located on the backing plate 4 Without contact with the processing table 1; in detail, the area of the circuit substrate 2 is smaller than the area of the backing plate 4 (that is, the area of the backing plate 4 is not less than the area of the circuit substrate 2) , The circuit board 2 is completely separated from the table top 11 of the processing table 1 by the backing plate 4, thereby protecting the table top 11 of the processing table 1 to maintain the service life.

Then, a cover plate 5 is used to cover the circuit substrate 2 on the processing table 1 to end the placing step S120; wherein, the cover plate 5 has a plurality of socket holes 51, and a plurality of socket holes 51 are provided. The socket hole 51 is sleeved with a plurality of the fixing pins 12 so that the cover plate 5 covers the circuit substrate 2 and is fixed on the processing table 1.

In detail, the edge of the cover plate 5 is provided with a plurality of socket holes 51, and the cover plate 5 is respectively sleeved on the plurality of fixing pins 12 through the plurality of socket holes 51, so that The inner edges of the plurality of socket holes 51 and the plurality of fixing pins 12 are engaged with each other, so that the cover plate 5 is positioned on the circuit substrate 2, wherein the area of the cover plate 5 is different. It is smaller than the area of the circuit substrate 2 so that the cover plate 5 can completely cover the circuit substrate 2. Accordingly, when dust is removed by a cleaning mechanism (not shown in the figure), the cover plate 5 can be used for protection The circuit substrate 2 is used to prevent the cleaning mechanism from damaging the circuit substrate 2 during the cleaning process.

Next, as shown in Figure 7, the suction step S130 is performed, and the negative pressure device generates the said circuit board 2 through the plurality of first suction holes 13 and the plurality of second suction holes 41. The negative pressure air flow C is used to adsorb and position the circuit substrate 2 on the processing table 1 through the negative pressure air flow C to maintain the relative position of the circuit substrate 2 and the processing table 1.

Following the processing step S140, the circuit board 2 is processed by the processing device to remove the portion of the circuit board 2 provided with the plurality of first fixing holes 21, and remove the remaining portion of the circuit board 2 The circuit board 2 is cut, and a portion of the circuit board 2 separated by the cut is formed into a plurality of circuit boards 23. It should be noted that the cover plate 5 located on the circuit substrate 2 is When the device is processed, it will also be processed and removed at the same time as the circuit board 2. That is to say, the part 52 of the cover 5 in FIG. 8 will be removed from the circuit board 2 after the processing is completed. The part 24 (that is, the part of the circuit board 2 provided with the plurality of first fixing holes 21) is removed together, and only the circuit board 23 is left.

Based on the above, this embodiment also discloses a circuit board structure. The circuit board structure is made by the above-mentioned circuit board manufacturing method after performing the above-mentioned multiple steps S110 to S140, and the circuit board structure can not be There are any positioning holes, but the manufacturing of the circuit board structure of the present invention (that is, the circuit board 23) is not limited to the implementation of the above steps S110 to S140.

[Technical Effects of Embodiments of the Invention]

To sum up, in the method for manufacturing the circuit board disclosed in the embodiment of the present invention, the plurality of fixing pins 12 are sleeved with the first fixing holes 21 of the circuit board 2, so that the circuit board 2 is preliminarily positioned for processing. On the stage 1, and cooperate with the negative pressure device to generate the negative pressure airflow C on the circuit substrate 2 through the plurality of first suction holes 13, according to which when the circuit substrate 2 is in the processing step S140 During the process, it can be firmly positioned on the processing table 1 and processed, so that the processed circuit board does not have reserved edges or positioning holes, thereby greatly reducing the time and equipment cost required for the production of the circuit board .

The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the description and schematic content of the present invention are included in the application of the present invention. Within the scope of the patent.

S110: Preliminary steps

S120: Placement steps

S130: Adsorption step

S140: Processing steps

Claims (8)

A method for manufacturing a circuit board includes: implementing a pre-step: a processing table is provided with a plurality of first suction holes, and a plurality of fixing pins are arranged on a table of the processing table, and a plurality of said The first suction hole and the plurality of fixing pins do not block each other; a placement step is implemented: a circuit substrate is set on the processing table, and a cover plate is used to cover the circuit substrate on the processing table; wherein The circuit substrate is provided with a plurality of first fixing holes, and the plurality of first fixing holes are respectively sleeved with a plurality of the fixing pins, so that the circuit substrate is set on the processing table; wherein, the cover The board has a plurality of socket holes, the plurality of socket holes are sleeved with a plurality of the fixing pins, so that the cover plate covers the circuit substrate and is fixed on the processing table; implement a suction step: A negative pressure device generates a negative pressure air flow toward the inside of the table for the plurality of first suction holes, and the circuit substrate is adsorbed and positioned by the negative pressure air flow to maintain the circuit substrate and the processing The relative position of the stage; and implementing a processing step: processing the circuit substrate and the cover plate with a processing device to remove the portion of the circuit substrate provided with the plurality of first fixing holes and the corresponding Part of the cover plate is cut, and the remaining circuit substrate is cut, so that the cut and separated part of the circuit substrate forms a plurality of circuit boards. The method for manufacturing a circuit board according to claim 1, wherein in the pre-step, a backing plate is provided on the work surface, wherein the backing plate has a plurality of second suction holes and a plurality of second suction holes Two fixing holes, the backing plate is respectively sleeved with a plurality of the fixing pins through the plurality of second fixing holes, so that the backing plate is set on the processing table, and the plurality of second suction holes are connected to A plurality of the first suction holes communicate; then, the circuit substrate is respectively sleeved on the plurality of the fixed holes through the plurality of the first fixing holes The pins are fixed so that the circuit substrate is located on the backing plate and does not contact the processing table. The method for manufacturing a circuit board according to claim 2, wherein the backing board is made of soft material, and the area of the backing board is not less than the area of the circuit board, so that the circuit board is covered by the backing board. The plates are spaced apart without touching the table surface of the processing table. The manufacturing method of the circuit board according to claim 1, wherein the area of the cover plate is not less than the area of the circuit substrate, so that the cover plate completely covers the circuit substrate. The method for manufacturing a circuit board according to claim 1, wherein the processing table has a work area, and a plurality of predetermined processing areas are defined in the work area, and a plurality of the fixing pins are respectively arranged on the The working area and the edges of the plurality of predetermined processing areas. The method for manufacturing a circuit board according to claim 5, wherein the working area and the plurality of predetermined processing areas are rectangular respectively, and are located at four corners of the working area and the plurality of predetermined processing areas The first fixing holes are respectively provided. The method for manufacturing a circuit board according to claim 5, wherein the working area is defined with a first direction and a second direction perpendicular to each other, and a plurality of the predetermined processing areas are arranged parallel to the first direction M rows of and N columns parallel to the second direction, M and N are each a positive integer greater than 1. The method for manufacturing a circuit board according to claim 7, wherein, in the processing step, the processing device corresponds to the plurality of predetermined processings on the circuit board in the first direction and the second direction The part of the area is processed so that the part of the circuit board corresponding to the plurality of predetermined processing areas is formed with two grooves to remove the part of the circuit board provided with the plurality of first fixing holes, and the remaining The lower circuit board is cut, so that the cut and separated portions of the circuit board form a plurality of the circuit boards.

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