CN112654150B - Manufacturing method of circuit board and circuit board structure manufactured by same - Google Patents
Manufacturing method of circuit board and circuit board structure manufactured by same Download PDFInfo
- Publication number
- CN112654150B CN112654150B CN201910957260.0A CN201910957260A CN112654150B CN 112654150 B CN112654150 B CN 112654150B CN 201910957260 A CN201910957260 A CN 201910957260A CN 112654150 B CN112654150 B CN 112654150B
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- circuit board
- circuit substrate
- processing
- holes
- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 88
- 238000001179 sorption measurement Methods 0.000 claims abstract description 42
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 21
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000007779 soft material Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001668 ameliorated effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a manufacturing method of a circuit board and the circuit board structure manufactured by the manufacturing method. The manufacturing method of the circuit board comprises a pre-step, a placing step, an adsorbing step and a processing step. The pre-step comprises the following steps: a plurality of adsorption holes are formed in a processing table, and a plurality of fixing pins are arranged on the processing table; the placing step comprises the following steps: preparing a circuit substrate, wherein a plurality of fixing holes are formed in the circuit substrate, and a plurality of fixing pins are sleeved in the plurality of fixing holes respectively, so that the circuit substrate is arranged on the processing table; the adsorption step comprises the following steps: generating a negative pressure air flow to the circuit substrate through a plurality of the adsorption holes by a negative pressure device; the processing steps are as follows: and removing the part of the circuit substrate provided with the plurality of fixing holes by a processing device, and cutting the rest circuit substrate to form a plurality of circuit boards.
Description
Technical Field
The present invention relates to a method for manufacturing a circuit board, and more particularly, to a method for manufacturing a circuit board capable of making a finished product have no positioning holes and a circuit board structure manufactured by the method.
Background
In the conventional circuit board manufacturing method, in order to position a circuit substrate (not yet processed) on a table surface of a workbench, a plurality of positioning holes are respectively formed on the edge of the circuit substrate and the edge of a circuit board area to be formed, and then the circuit substrate is sleeved with a positioning piece positioned on the workbench through the plurality of positioning holes, so that the circuit substrate is positioned on the workbench; accordingly, the circuit board is ensured not to move during processing and the processing precision is not affected.
However, the circuit board manufactured by the manufacturing method can reserve two reserved edges with positioning holes at the side edges of the circuit board so as to prevent the circuit board from moving in the process of processing the circuit board, but when the circuit board manufactured by the manufacturing method is shipped, extra preparation equipment is needed to remove the reserved edges on the circuit board, so that the circuit board can be sold for shipment, and the equipment cost is increased and the time is consumed.
Accordingly, the present inventors considered that the above-mentioned drawbacks could be ameliorated, and have intensively studied and combined with the application of scientific principles, and finally, have proposed an invention which is reasonable in design and effectively ameliorates the above-mentioned drawbacks.
Disclosure of Invention
The invention aims to solve the technical problem of providing a manufacturing method of a circuit board and a circuit board structure manufactured by the same aiming at the defects of the prior art, and can effectively overcome the defects that the existing circuit board manufacturing method is time-consuming and additional purchasing equipment is needed for processing (removing reserved edges).
The embodiment of the invention discloses a manufacturing method of a circuit board, which comprises the following steps: implementing a pre-step: a plurality of first adsorption holes are formed in a processing table, a plurality of fixing pins are arranged on a table top of the processing table, and the first adsorption holes and the fixing pins are not blocked; a placing step is implemented: setting a circuit substrate on the processing table; the circuit substrate is provided with a plurality of first fixing holes, and a plurality of fixing pins are sleeved in the first fixing holes respectively, so that the circuit substrate is arranged on the processing table; an adsorption step is carried out: generating negative pressure air flow which flows towards the interior of the table top through a negative pressure device to a plurality of first adsorption holes, and adsorbing and positioning the circuit substrate through the negative pressure air flow so as to maintain the relative positions of the circuit substrate and the processing table; and performing a processing step: and processing the circuit substrate by a processing device to remove the part of the circuit substrate provided with the plurality of first fixing holes, and cutting the rest circuit substrate to form a plurality of circuit boards on the separated part of the circuit substrate after cutting.
Preferably, in the pre-step, a pad is disposed on the working table, where the pad has a plurality of second adsorption holes and a plurality of second fixing holes, and the pad is respectively sleeved with a plurality of fixing pins through the plurality of second fixing holes, so that the pad is disposed on the working table, and the plurality of second adsorption holes are communicated with the plurality of first adsorption holes; and then, sleeving the circuit substrate on the plurality of fixing pins through the plurality of first fixing holes respectively, so that the circuit substrate is positioned on the backing plate and is not contacted with the processing table.
Preferably, the pad is made of soft material, and the area of the pad is not smaller than the area of the circuit substrate, so that the circuit substrate is separated by the pad without contacting the table top of the processing table.
Preferably, in the placing step, a cover plate is used to cover the circuit substrate on the processing table; the cover plate is provided with a plurality of sleeve holes, and a plurality of fixing pins are sleeved in the sleeve holes, so that the cover plate covers the circuit substrate and is fixed on the working table surface.
Preferably, the area of the cover plate is not smaller than the area of the circuit substrate, so that the cover plate completely covers the circuit substrate.
Preferably, the processing table has a working area, and a plurality of predetermined processing areas are defined in the working area, and the plurality of fixing pins are respectively configured at edges of the working area and the plurality of predetermined processing areas.
Preferably, the working area and the plurality of predetermined processing areas are respectively rectangular, and the four corners of the working area and the plurality of predetermined processing areas are respectively provided with the first fixing holes.
Preferably, the working area defines a first direction and a second direction perpendicular to each other, and the predetermined processing areas are arranged in M rows parallel to the first direction and N columns parallel to the second direction, where M and N are positive integers greater than 1.
Preferably, in the processing step, the processing device processes the portion of the circuit substrate corresponding to the plurality of predetermined processing regions in the first direction or the second direction, so that two grooves are formed in the portion of the circuit substrate corresponding to the plurality of predetermined processing regions, and the portion of the circuit substrate provided with the plurality of first fixing holes is removed, so that a plurality of circuit boards are formed in the remaining circuit substrate.
The embodiment of the invention discloses a circuit board structure which is manufactured by the manufacturing method of the circuit board.
In summary, according to the method for manufacturing a circuit board disclosed in the embodiments of the present invention, the plurality of fixing pins are sleeved with the first fixing holes of the circuit board, so that the circuit board is initially positioned on the processing table, and the negative pressure device is matched to generate the negative pressure air flow for the circuit board through the plurality of first adsorption holes, so that the circuit board can be stably positioned on the processing table and processed in the processing step, and the processed circuit board does not have a reserved edge or positioning hole, thereby greatly reducing the time and equipment cost required for manufacturing the circuit board.
For a further understanding of the nature and the technical aspects of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for purposes of reference only and are not intended to limit the invention.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a circuit board according to a first embodiment of the present invention;
fig. 2 is a schematic perspective view of a circuit board manufacturing method according to a first embodiment of the invention when a pre-step is performed;
fig. 3 is a schematic perspective view of a circuit board manufacturing method according to a first embodiment of the present invention when a placing step is performed;
fig. 4 is a schematic cross-sectional view of a circuit board manufacturing method according to a first embodiment of the invention when an adsorption step is performed;
fig. 5 is a schematic perspective view of a manufacturing method of a circuit board according to a first embodiment of the invention when a processing step is performed;
fig. 6 is a schematic diagram of a circuit board manufacturing method according to a second embodiment of the invention when implementing a pre-step and a placing step;
fig. 7 is a schematic cross-sectional view of a circuit board manufacturing method according to a second embodiment of the invention when an adsorption step is performed;
fig. 8 is a schematic perspective view of a manufacturing method of a circuit board according to a second embodiment of the invention when a processing step is performed.
Symbol description
1: processing table
11: table top
12: fixing pin
13: first adsorption hole
2: circuit substrate
21: first fixing hole
22: optical positioning point
23: circuit board
24: part of circuit substrate
4: backing plate
41: second adsorption hole
42: second fixing hole
5: cover plate
51: socket hole
52: part of the cover plate
A: work area
B: predetermined processing region
C: negative pressure air flow
D1: first direction
D2: second direction
S110: the preceding step S120: placing step S130: adsorption step S140: processing steps
Detailed Description
The following specific embodiments are presented to illustrate the embodiments of the present invention related to a method for manufacturing a circuit board and a circuit board structure manufactured by the method, and those skilled in the art will appreciate the advantages and effects of the present invention from the disclosure herein. The invention is capable of other and different embodiments and its several details are capable of modifications and various other uses and applications, all of which are obvious from the description, without departing from the spirit of the invention. The drawings of the present invention are merely schematic illustrations, and are not intended to be drawn to actual dimensions. The following embodiments will further illustrate the related art content of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or signal from another signal. In addition, the term "or" as used herein shall include any one or combination of more of the associated listed items as the case may be.
First embodiment
Fig. 1 to 5 show a first embodiment of the present invention, which discloses a method for manufacturing a plurality of circuit boards without reserved edges and positioning holes, so as to reduce the time and equipment cost consumed in the manufacturing process. The manufacturing method of the circuit board comprises the following steps: a pre-stage S110, a placement stage S120, an adsorption stage S130 and a processing stage S140.
Of course, any one of the steps can be omitted or replaced in a reasonably varied manner according to the needs of the designer. It should be noted that, for the sake of understanding the present embodiment, the drawings are schematic top plan views.
With reference to fig. 2, the preceding step S110: a plurality of first adsorption holes 13 are formed in a processing table 1, a plurality of fixing pins 12 are disposed on a table top 11 of the processing table 1, and the plurality of first adsorption holes 13 and the plurality of fixing pins 12 are not blocked. Specifically, the plurality of first adsorption holes 13 are uniformly distributed on the processing table 1, and the plurality of first adsorption holes 13 may have the same aperture or different apertures, and the plurality of fixing pins 12 are respectively disposed on the table top 11 and located between the plurality of first adsorption holes 13 without shielding the plurality of first adsorption holes 13. In other embodiments of the present invention, the first suction holes 13 may be disposed in the area surrounded by the fixing pins 12, but is not limited to this embodiment.
In addition, a working area a is formed on the table top 11 of the processing table 1, a first direction D1 and a second direction D2 perpendicular to each other are defined, a plurality of predetermined processing areas B are formed in the working area a, the predetermined processing areas B are arranged in M rows parallel to the first direction D1 and N columns parallel to the second direction D2, M and N are positive integers greater than 1, and a plurality of fixing pins 12 are respectively disposed at edges of the working area a and each of the predetermined processing areas B.
That is, the plurality of predetermined processing regions B are arranged in a matrix in the working region a, but the arrangement of the plurality of predetermined processing regions B is not limited to the embodiment. Specifically, in other embodiments of the present invention, which are not shown, the arrangement of the predetermined processing regions B may be arbitrarily changed according to the needs of the designer, for example: a staggered arrangement mode.
In addition, as shown in fig. 3, the placing step S120: a circuit substrate 2 is arranged on the processing table 1; the circuit board 2 is provided with a plurality of first fixing holes 21, and the plurality of first fixing holes 21 are respectively sleeved with a plurality of fixing pins 12, so that the circuit board 2 is arranged on the processing table 1.
In more detail, the circuit board 2 may be a Printed Circuit Board (PCB) and have a rectangular shape, and the four corners of the circuit board are provided with the first fixing holes 21, and the circuit board 2 is respectively sleeved on the plurality of fixing pins 12 through the first fixing holes 21 on the four corners of the circuit board, so that the plurality of fixing pins 12 are respectively clamped with the inner edges of the plurality of first fixing holes 21, and accordingly, the circuit board 2 is primarily positioned on the processing table 1.
In addition, the portion of the circuit substrate 2 corresponding to the predetermined processing regions B is rectangular in this embodiment, the first fixing holes 21 are respectively disposed at four corners of the portion of the circuit substrate 2 (corresponding to the predetermined processing regions B), and a plurality of optical positioning points 22 are disposed beside each first fixing hole 21 for subsequent identification processing.
Specifically, the contour of the circuit board 2 corresponds to the shape of the working area a, and the shapes of the plurality of predetermined processing areas B correspond to the shape of the circuit board to be manufactured. That is, the shapes of the working area a and the predetermined processing areas B can be adjusted according to the manufacturing requirement, and the working area a and the predetermined processing areas B are rectangular corresponding to the shapes of the circuit substrate 2 and the circuit boards respectively in the present embodiment, and the first fixing holes 21 are disposed according to the contour edges of the circuit substrate 2 and the circuit boards to be manufactured, but are not limited to the present embodiment.
As shown in fig. 4, the adsorption step S130: a negative pressure device (not shown) is used to generate a negative pressure air flow C flowing into the table 11 for the first adsorption holes 13, and the circuit substrate 2 is adsorbed and positioned on the processing table 1 by the negative pressure air flow C so as to maintain the relative positions of the circuit substrate 2 and the processing table 1.
Specifically, the negative pressure device is disposed in the processing table 1, and generates the negative pressure air flow C toward the circuit substrate 2 through the plurality of first adsorption holes 13, so that the circuit substrate 2 is firmly adsorbed and positioned on the processing table 1, but is not limited to the embodiment. For example, the negative pressure device may be disposed beside the processing table 1 and connected to the plurality of first adsorption holes 13 through a flow guiding tube, so that the negative pressure device can generate the negative pressure air flow C for the circuit substrate 2 on the processing table 1.
Referring to fig. 5, the processing step S140: the circuit board 2 is processed by a processing device (not shown), such as a milling machine, to remove the portion of the circuit board 2 provided with the plurality of first fixing holes 21, and the remaining circuit board 2 is cut, so that the cut and separated portion of the circuit board 2 forms a plurality of circuit boards 23.
In detail, the processing device identifies a plurality of optical positioning points 22 on a portion of the circuit substrate 2 (i.e., a portion corresponding to the predetermined processing area B) to confirm positions of a plurality of the first fixing holes 21 on the circuit substrate 2, and performs a first process on the circuit substrate 2 in the first direction D1 or the second direction D2, so that two grooves are formed on the portion of the circuit substrate 2 corresponding to each of the predetermined processing areas B, and each groove position is a position corresponding to a plurality of the first fixing holes 21 on the same side of the circuit substrate 23 to remove a portion 24 of the circuit substrate 2 provided with a plurality of the first fixing holes 21; next, the processing device performs a second process on the remaining circuit board 2, cuts the portion of the circuit board 2 corresponding to each predetermined processing region B, and forms a plurality of circuit boards 23 from the cut portion of the circuit board 2.
As mentioned above, the present embodiment also discloses a circuit board structure, which is manufactured by the manufacturing method of the circuit board after implementing the steps S110 to S140, but the manufacturing of the circuit board structure (i.e. the circuit board 23) of the present invention is not limited to implementing the steps S110 to S140.
Second embodiment
As shown in fig. 6 to 8, which are a second embodiment of the present invention, the present embodiment is similar to the first embodiment, and the same parts of the two embodiments are not repeated, but the difference between the present embodiment and the first embodiment is that:
as shown in fig. 6, in the pre-step S110, a backing plate 4 is disposed on the processing table 1, wherein the backing plate 4 has a plurality of second adsorption holes 41 and a plurality of second fixing holes 42, the backing plate 4 is respectively sleeved with a plurality of fixing pins 12 through the plurality of second fixing holes 42, so that the backing plate 4 is disposed on the processing table 1, and the plurality of second adsorption holes 41 are communicated with the plurality of first adsorption holes 13; next, the circuit board 2 is respectively fitted to the plurality of fixing pins 12 through the plurality of first fixing holes 21 so that the circuit board 2 is positioned on the backing plate 4 without being in contact with the processing table 1.
Specifically, the pad 4 may be made of a soft material in the present embodiment, the pad 4 is uniformly provided with a plurality of the second adsorption holes 41, each of the second adsorption holes 41 is correspondingly communicated with each of the first adsorption holes 13, and the pore sizes of the plurality of first adsorption holes 13 may be the same or different, which is not limited to the present embodiment. In addition, a plurality of second fixing holes 42 are formed in the edge of the backing plate 4, the backing plate 4 is respectively sleeved on the plurality of fixing pins 12 through the plurality of second fixing holes 42, so that the inner edges of the plurality of second fixing holes 42 are mutually clamped with the plurality of fixing pins 12, and the backing plate 4 is positioned on the table top 11.
Continuing the placing step S120, the circuit substrate 2 is respectively sleeved on the fixing pins 12 through the first fixing holes 21, so that the circuit substrate 2 is positioned on the backing plate 4 and is not contacted with the processing table 1; in detail, the area of the circuit substrate 2 is smaller than the area of the pad 4 (i.e., the area of the pad 4 is not smaller than the area of the circuit substrate 2), so that the circuit substrate 2 is completely separated from the table top 11 of the processing table 1 by the pad 4, thereby protecting the table top 11 of the processing table 1 to maintain the service life.
Next, a cover plate 5 is used to cover the circuit substrate 2 on the processing table 1, so as to end the placing step S120; the cover plate 5 has a plurality of sleeve holes 51, and a plurality of fixing pins 12 are sleeved in the sleeve holes 51, so that the cover plate 5 covers the circuit substrate 2 and is fixed on the workbench 1.
In detail, the edge of the cover plate 5 is provided with a plurality of sleeve holes 51, the cover plate 5 is respectively sleeved on a plurality of fixing pins 12 through a plurality of sleeve holes 51, so that the inner edges of the sleeve holes 51 and the fixing pins 12 are mutually blocked, and accordingly the cover plate 5 is positioned on the circuit substrate 2, wherein the area of the cover plate 5 is not smaller than that of the circuit substrate 2, so that the cover plate 5 can completely cover the circuit substrate 2, and accordingly, when dust is removed through a cleaning mechanism (not shown in the figure), the circuit substrate 2 can be protected through the cover plate 5, so that the circuit substrate 2 is prevented from being damaged in the cleaning process by the cleaning mechanism.
Next, as shown in fig. 7, the suction step S130 is performed, and the negative pressure device generates the negative pressure air flow C through the plurality of first suction holes 13 and the plurality of second suction holes 41 to the circuit substrate 2, and suctions and positions the circuit substrate 2 on the table 1 through the negative pressure air flow C, so as to maintain the relative positions of the circuit substrate 2 and the processing table 1.
In the processing step S140, the circuit board 2 is processed by the processing device to remove the portion of the circuit board 2 provided with the plurality of first fixing holes 21, and the remaining circuit board 2 is cut to form a plurality of circuit boards 23 from the cut and separated portion of the circuit board 2. It should be noted that, when the processing device processes the cover plate 5 on the circuit substrate 2, the cover plate is also processed and removed together with the circuit substrate 2, that is, after the processing is completed, the portion 52 of the cover plate 5 is removed together with the portion 24 of the circuit substrate 2 (that is, the portion of the circuit substrate 2 provided with the plurality of first fixing holes 21) as shown in fig. 8, and only the circuit board 23 remains.
As mentioned above, the present embodiment also discloses a circuit board structure, which is manufactured by the manufacturing method of the circuit board after implementing the steps S110 to S140, but the manufacturing of the circuit board structure (i.e. the circuit board 23) of the present invention is not limited to implementing the steps S110 to S140.
[ technical Effect of embodiments of the invention ]
In summary, in the method for manufacturing a circuit board according to the embodiment of the present invention, the plurality of fixing pins 12 are sleeved with the first fixing holes 21 of the circuit board 2, so that the circuit board 2 is initially positioned on the processing table 1, and the negative pressure device is matched to generate the negative pressure air flow C for the circuit board 2 through the plurality of first adsorption holes 13, so that the circuit board 2 can be stably positioned on the processing table 1 and processed in the processing step S140, and the processed circuit board does not have a reserved edge or a positioning hole, thereby greatly reducing the time and equipment cost required for manufacturing the circuit board.
The foregoing disclosure is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the appended claims, and all changes that come within the meaning and range of equivalency of the description and drawings are therefore intended to be embraced therein.
Claims (10)
1. A manufacturing method of a circuit board comprises the following steps:
the method comprises the following steps: a plurality of first adsorption holes are formed in a processing table, a plurality of fixing pins are arranged on a table top of the processing table, the first adsorption holes and the fixing pins do not block each other, the processing table is provided with a working area, a plurality of preset processing areas are defined in the working area, and the fixing pins are respectively arranged at the edges of the working area and the edges of the preset processing areas;
the implementation and placement steps are as follows: setting a circuit substrate on the processing table; the circuit substrate is provided with a plurality of first fixing holes, the plurality of first fixing holes are respectively sleeved with a plurality of fixing pins, the circuit substrate is arranged on the processing table, the circuit substrate comprises a part corresponding to the plurality of preset processing areas, and the plurality of first fixing holes are respectively arranged at the edge of the circuit substrate and the edge of the part corresponding to the plurality of preset processing areas;
and (3) implementing an adsorption step: generating negative pressure air flow flowing into the table top through the plurality of first adsorption holes by using a negative pressure device, and adsorbing and positioning the circuit substrate through the negative pressure air flow so as to maintain the relative positions of the circuit substrate and the processing table; and
the processing steps are implemented: and processing the circuit substrate by a processing device, forming two grooves on the parts of the circuit substrate corresponding to a plurality of preset processing areas, removing the parts of the circuit substrate provided with a plurality of first fixing holes, cutting the rest circuit substrate, and forming a plurality of circuit boards on the parts of the circuit substrate separated by cutting, wherein the circuit boards do not have the first fixing holes.
2. The method of manufacturing a circuit board according to claim 1, wherein in the pre-step, a pad is disposed on the table top, wherein the pad has a plurality of second adsorption holes and a plurality of second fixing holes, the pad is respectively sleeved with a plurality of fixing pins through the plurality of second fixing holes, the pad is disposed on the processing table, and the plurality of second adsorption holes are communicated with the plurality of first adsorption holes; and then, sleeving the circuit substrate on the plurality of fixing pins through the plurality of first fixing holes respectively, so that the circuit substrate is positioned on the backing plate and is not contacted with the processing table.
3. The method of claim 2, wherein the pad is made of soft material, and the area of the pad is not smaller than the area of the circuit substrate, so that the circuit substrate is separated by the pad without contacting the table surface of the processing table.
4. The method of manufacturing a circuit board according to claim 1, wherein in the placing step, the circuit board on the processing table is covered with a cover plate; the cover plate is provided with a plurality of sleeve holes, and a plurality of fixing pins are sleeved in the sleeve holes, so that the cover plate covers the circuit substrate and is fixed on the table top.
5. The method of claim 4, wherein the area of the cover plate is not smaller than the area of the circuit substrate, so that the cover plate completely covers the circuit substrate.
6. The method for manufacturing a circuit board according to claim 1, wherein the circuit substrate further comprises: a plurality of optical locating points located beside the first fixing holes of the edges of the portions corresponding to the plurality of predetermined processing regions, the manufacturing method further comprising:
the processing device recognizes the plurality of optical positioning points to confirm positions of the first fixing holes of edges of portions corresponding to the plurality of predetermined processing regions.
7. The method of claim 1, wherein the working area and the predetermined processing areas are respectively rectangular, and the first fixing holes are respectively formed at four corners of the working area and the predetermined processing areas.
8. The method of manufacturing a circuit board as defined in claim 1, wherein the working area defines a first direction and a second direction perpendicular to each other, and the plurality of predetermined processing areas are arranged in M rows parallel to the first direction and N columns parallel to the second direction, M and N each being a positive integer greater than 1.
9. The method of manufacturing a circuit board according to claim 8, wherein in the processing step, the processing means processes portions of the circuit board corresponding to the plurality of predetermined processing regions in the first direction or the second direction, forms two grooves in the portions of the circuit board corresponding to the plurality of predetermined processing regions, removes the portions of the circuit board provided with the plurality of first fixing holes, and cuts the remaining circuit board, so that the portions of the circuit board separated by the cutting form the plurality of circuit boards.
10. A circuit board structure made by the method of manufacturing a circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910957260.0A CN112654150B (en) | 2019-10-10 | 2019-10-10 | Manufacturing method of circuit board and circuit board structure manufactured by same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910957260.0A CN112654150B (en) | 2019-10-10 | 2019-10-10 | Manufacturing method of circuit board and circuit board structure manufactured by same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112654150A CN112654150A (en) | 2021-04-13 |
| CN112654150B true CN112654150B (en) | 2024-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910957260.0A Active CN112654150B (en) | 2019-10-10 | 2019-10-10 | Manufacturing method of circuit board and circuit board structure manufactured by same |
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| CN (1) | CN112654150B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113905530B (en) * | 2021-10-22 | 2023-11-21 | 深圳市众博信发展有限公司 | Positioning and manufacturing method of printed circuit board |
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|---|---|---|---|---|
| CN201115323Y (en) * | 2007-07-31 | 2008-09-10 | 比亚迪股份有限公司 | A location device with pasted FPC board |
| CN102223763A (en) * | 2010-04-16 | 2011-10-19 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of connecting sheet circuit board |
| CN206302638U (en) * | 2016-11-30 | 2017-07-04 | 江苏正桥影像科技股份有限公司 | Circuit board laser point plate special fixture |
| CN109807659A (en) * | 2017-11-22 | 2019-05-28 | 广东工业大学 | A kind of vacuum suction backing plate and application method |
-
2019
- 2019-10-10 CN CN201910957260.0A patent/CN112654150B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201115323Y (en) * | 2007-07-31 | 2008-09-10 | 比亚迪股份有限公司 | A location device with pasted FPC board |
| CN102223763A (en) * | 2010-04-16 | 2011-10-19 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of connecting sheet circuit board |
| CN206302638U (en) * | 2016-11-30 | 2017-07-04 | 江苏正桥影像科技股份有限公司 | Circuit board laser point plate special fixture |
| CN109807659A (en) * | 2017-11-22 | 2019-05-28 | 广东工业大学 | A kind of vacuum suction backing plate and application method |
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| Publication number | Publication date |
|---|---|
| CN112654150A (en) | 2021-04-13 |
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