JP7221778B2 - Wafer processing method - Google Patents

Description

In the present invention, a wafer having a plurality of chips partitioned by a plurality of first planned division lines and a plurality of second planned division lines intersecting the first planned division lines is cut and chamfered. The present invention relates to a method of processing a wafer to produce a chip with a thickness.

A wafer in which a plurality of devices such as ICs and LSIs are partitioned by dividing lines and formed on the surface is divided into individual device chips by a dicing machine, and each of the divided device chips is applied to electrical equipment such as mobile phones and personal computers. It is utilized (for example, see Patent Document 1).

In addition, a small lens of a camera built in a mobile phone, a smart phone, etc. is also in the form of a wafer in which a small lens is formed in each of a plurality of regions partitioned by a plurality of planned division lines, and the planned division lines are cut. to produce individual lenslets.

JP-A-7-45556

However, since the perimeter of the hemispherical small lens is square, there is a problem that chipping or cracking occurs at the corners of the perimeter due to impact or the like, leading to deterioration in quality.

Therefore, the planned dividing line of the wafer on which the square small lenses are arranged in a checkered pattern is cut, and the wafer is cut from the direction of 45 degrees with respect to the planned dividing line to chamfer the corners of the square outer periphery of the chip. However, since the square lenslets are arranged in a checkered pattern, the number of lenslets that can be produced from one wafer is small, resulting in poor productivity.

SUMMARY OF THE INVENTION An object of the present invention, which has been made in view of the above facts, is to provide a wafer processing method capable of efficiently producing chamfered chips.

To solve the above problems, the present invention provides the following wafer processing method. That is, a wafer having a plurality of chips partitioned by a plurality of first planned division lines and a plurality of second planned division lines intersecting the first planned division lines is cut and chamfered. A method of processing a wafer for producing chips, comprising: a strip-shaped member forming step of cutting the first planned division line to form a strip-shaped member having a first cut surface and a second cut surface; The first cut surfaces of the plurality of strip-shaped members are arranged on a first substrate so that the second dividing lines of the strip-shaped members are arranged in a straight line, and the second cut surfaces are directed upward. and a cutting blade having a cutting edge formed in a shape corresponding to the chamfering process applied to the chip is positioned on the second dividing line to cut and chamfer the second cut surface. a first chamfering process for machining, a second substrate is disposed on the second cut surface, and the first substrate is removed to expose the first cut surface upward so that the cutting edge is a chip a second chamfering step of chamfering the first cut surface by positioning a cutting blade formed in a shape corresponding to the chamfering performed on the second dividing line and chamfering the first cut surface. It is a processing method of a wafer to be processed.

The tip of the cutting blade formed in a shape corresponding to the chamfering is preferably V-shaped. The cutting edge of the cutting blade formed in a shape corresponding to the chamfering may have a concave circular arc shape. After the second chamfering step, the plurality of strip-shaped members are removed from the second substrate and arranged on the third substrate such that the second planned division lines are aligned in a straight line. , and then cutting the second dividing line to generate chips.

A wafer processing method provided by the present invention provides a wafer having a plurality of chips partitioned by a plurality of first planned division lines and a plurality of second planned division lines intersecting the first planned division lines. A method of processing a wafer for producing chamfered chips by cutting, wherein the strip-shaped member having a first cut surface and a second cut surface is cut by cutting the first dividing line. forming strip-shaped members, and arranging the first cut surfaces of the plurality of strip-shaped members on a first substrate so that the second planned division lines of the strip-shaped members are aligned in a straight line. a strip-shaped member disposing step for exposing the second cut surface upward; A first chamfering step of cutting and chamfering two cut surfaces, and disposing a second substrate on the second cut surface, removing the first substrate, and performing the first cutting. A cutting blade whose surface is exposed upward and whose cutting edge is formed in a shape corresponding to chamfering applied to the chip is positioned on the second dividing line, and the first cut surface is cut to perform chamfering. and chamfering process, chamfered chips can be efficiently produced, and the problem of deterioration of quality caused by cracks in the chips due to impact or the like is solved.

1 is a perspective view of a wafer; FIG. (a) A perspective view showing a state in which a strip-shaped member forming step is being performed, (b) a perspective view of a strip-shaped member. The perspective view which shows the state which implemented the strip-shaped member arrangement|positioning process. (a) Perspective view showing a state in which the first chamfering process is being performed, (b) Front view showing a state in which the first chamfering process is being performed. (a) A perspective view showing a state in which the second chamfering process is being performed, (b) A front view showing a state in which the second chamfering process is being performed. (a) A perspective view showing a state in which a chip generation process is being performed, (b) a perspective view of a generated chip. (a) A front view showing a state in which the first chamfering process is being performed using the cutting blade of the first modification, (b) Rotating the strip-shaped member by 180 degrees and performing the first chamfering process Front view showing the state being implemented, (c) Front view showing the state where the second chamfering process is being performed using the cutting blade of the first modification, (d) The strip-shaped member is turned 180 degrees The front view which shows the state which rotates and is implementing the 2nd chamfering process, (e) The perspective view of the produced|generated chip|tip. (a) Front view showing a state in which the first chamfering process is performed using the cutting blade of the second modification, (b) Second chamfering using the cutting blade of the second modification The front view which shows the state which is implementing the process. (a) Front view showing a state in which the first chamfering process is performed using the cutting blade of the third modification, (b) Second chamfering using the cutting blade of the third modification The front view which shows the state which is implementing the process. (a) Front view showing a state in which the first chamfering process is performed using the cutting blade of the fourth modification, (b) Second chamfering using the cutting blade of the fourth modification The front view which shows the state which is implementing the process.

Preferred embodiments of the wafer processing method of the present invention will be described below with reference to the drawings.

FIG. 1 shows a wafer 2 to be processed by the wafer processing method of the present invention. The wafer 2 has a rectangular shape, and the surface 2a of the wafer 2 is partitioned into a plurality of square regions by grid-like dividing lines 4 . The grid-like division lines 4 are composed of a plurality of first division lines 4a extending in a first direction indicated by arrow D1 in FIG. 1 and a first division line extending in a second direction indicated by arrow D2 in FIG. It has a plurality of second planned division lines 4b that intersect with the planned lines 4a. A hemispherical lens 6 of a camera built in a mobile phone, a smart phone, or the like is formed in each square region partitioned by grid-like division lines 4 .

In the illustrated embodiment, as shown in FIG. 1, first, the back surface 2b of the wafer 2 is attached to the dicing tape 10 whose peripheral edge is fixed to the annular frame 8, and the wafer 2 is supported by the annular frame 8 via the dicing tape 10. do.

After the wafer 2 is supported by the annular frame 8, a strip-shaped member forming step is performed in which strip-shaped members having a first cut surface and a second cut surface are formed by cutting the first dividing line 4a. . The strip-shaped member forming step can be performed using, for example, a dicing machine 12 partly shown in FIG.

The dicing apparatus 12 includes a chuck table (not shown) that holds a workpiece, a cutting means 14 that cuts the workpiece held by the chuck table, and an image of the workpiece held by the chuck table. and an imaging means (not shown). A chuck table for sucking and holding a workpiece on its upper surface is rotatable and movable in the X-axis direction indicated by the arrow X in FIG.

The cutting means 14 moves in the Y-axis direction (perpendicular to the X-axis direction) indicated by arrow Y in FIG. 2 and in the Z-axis direction (perpendicular to the X-axis direction and the Y-axis direction) indicated by arrow Z in FIG. A freely configured spindle housing 16, a spindle 18 rotatably supported by the spindle housing 16 about the Y-axis direction, an annular cutting blade 20 fixed to the tip of the spindle 18, and cutting together with the spindle 18. and a motor (not shown) that rotates the blades 20 . The cutting blade 20 used in the strip-shaped member forming step is not formed in a shape corresponding to the chamfering of the chip, and the thickness of the cutting edge of the cutting blade 20 is substantially uniform. A plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

When performing the strip-shaped member forming process using such a dicing apparatus 12, first, the surface 2a of the wafer 2 is directed upward, and the wafer 2 is held by suction on the upper surface of the chuck table. Next, the imaging means picks up an image of the wafer 2 from above, and based on the image of the wafer 2 picked up by the imaging means, the first planned division line 4a is aligned in the X-axis direction, and the first planned division line 4a is aligned. A cutting blade 20 is positioned above one end.

Next, as shown in FIG. 2, the spindle housing 16 is lowered, and the edge of the cutting blade 20 rotated in the direction indicated by the arrow A in FIG. The chuck table is fed in the X-axis direction at a predetermined feed rate relative to the spindle housing 16 to cut the wafer 2 along the first dividing lines 4a.

Next, the cutting blade 20 is positioned on the first planned division line 4a while indexing the spindle housing 16 relative to the chuck table in the Y-axis direction by the distance of the first planned division line 4a. , cut the wafer 2 along all of the first dividing lines 4a. Thereby, as shown in FIG. 2(b), a strip-shaped member 22 having a first cut surface 22a and a second cut surface 22b can be formed. After the strip-shaped members 22 are formed, the suction-holding of the strip-shaped members 22 by the chuck table is released, and each strip-shaped member 22 is separated from the dicing tape 10 .

After performing the strip-shaped member forming step, the first cut surfaces 22a of the plurality of strip-shaped members 22 are arranged on the first substrate so that the second dividing lines 4b of the strip-shaped members 22 are aligned in a straight line. Then, a strip-shaped member arranging step is performed to expose the second cut surface 22b upward.

The first substrate 24 in the illustrated embodiment comprises an annular frame 26 and a dicing tape 28 having a peripheral edge secured to the annular frame 26, as shown in FIG. Four straight portions 26a are formed on the outer periphery of the annular frame 26, and each straight portion 26a is perpendicular to the adjacent straight portions 26a. Notches 26b are formed at both ends of one straight portion 26a out of the four straight portions 26a. A rigid substrate may be used as the first substrate.

As shown in FIG. 3, in the strip-shaped member arrangement step, a plurality of strip-shaped members 22 are attached to a dicing tape 28 with the first cut surface 22a facing downward, and the second cut surface 22b is exposed upward. Let At this time, each strip-shaped member 22 is arranged so as to be perpendicular to the straight portion 26a of the annular frame 26 (for example, the straight portion 26a sandwiched between the pair of notches 26b). By arranging the members 22 so as to be parallel to each other and aligning the longitudinal ends of the plurality of strip-shaped members 22, the second planned division lines 4b are arranged in a straight line.

After performing the strip-shaped member disposing step, a cutting blade having a cutting edge formed in a shape corresponding to chamfering to be applied to the chip is positioned on the second dividing line 4b to cut and chamfer the second cut surface 22b. A first chamfering process for processing is performed. The first chamfering process can also be performed using the dicing device 12, but the annular cutting blade used in the first chamfering process has a cutting edge formed in a shape corresponding to the chamfering performed on the chip. is. In the illustrated embodiment, as shown in FIG. 4(b), the cutting edge 30a of the cutting blade 30 used in the first chamfering process is V-shaped, and the thickness gradually decreases toward the tip.

In the first chamfering process, first, the plurality of strip-shaped members 22 are held by suction on the upper surface of the chuck table with the second cut surface 22b facing upward. Next, the strip-shaped member 22 is imaged from above by the imaging means, and the strip-shaped member 22 is positioned so as to be orthogonal to the X-axis direction based on the image of the strip-shaped member 22 imaged by the imaging means. The cutting edge 30a of the cutting blade 30 is positioned above one end in the longitudinal direction (one end in the Y-axis direction).

Next, the spindle housing 16 is lowered, and as shown in FIG. 4B, the cutting edge 30a of the cutting blade 30 rotated in the direction A is attached to the strip-shaped member 22 at a predetermined depth from the second cutting surface 22b. While cutting, the chuck table is relatively fed in the X-axis direction with respect to the spindle housing 16 at a predetermined processing feed rate. As a result, the cutting blade 30 can be positioned on the second dividing line 4b to cut the second cut surface 22b, and the tip of the lens 6 on the second cut surface 22b side can be chamfered. Reference numeral 32 denotes the chamfered portion.

Next, as shown in FIG. 4A, the cutting blade 30 is moved to the second position while indexing the spindle housing 16 relative to the chuck table in the Y-axis direction by the distance of the second dividing line 4b. The second cut surface 22b is cut at the second dividing line 4b, and all the chips of the lens 6 on the second cut surface 22b side are chamfered. After that, the suction and holding of the strip-shaped member 22 by the chuck table is released.

After performing the first chamfering step, a second substrate is provided on the second cut surface 22b, and the first substrate 24 is removed to expose the first cut surface 22a upward, thereby exposing the cutting edge 30a. A second chamfering step is performed in which a cutting blade 30 formed in a shape corresponding to the chamfering of the chip is positioned on the second dividing line 4b, and the first cut surface 22a is cut and chamfered. . The second chamfering process can also be performed using the dicing device 12 equipped with the cutting blade 30 in the same manner as the first chamfering process.

The second substrate 24' (see FIG. 5A) used in the second chamfering process of the illustrated embodiment may have the same configuration as the first substrate 24 used in the first chamfering process. , an annular frame 26' and a dicing tape 28' having a peripheral edge fixed to the annular frame 26'. The second substrate may also be made of a hard substrate like the first substrate.

In the second chamfering process, first, the dicing tape 28' of the second substrate 24' is attached to the second cut surface 22b of each strip-shaped member 22 arranged on the first substrate 24. . Next, the dicing tape 28 of the first substrate 24 is peeled off from the first cut surface 22a of each strip-shaped member 22 with the first substrate 24 side facing upward. As a result, the first cut surface 22a of the strip-shaped member 22 is exposed upward (see FIG. 5(a)). When the strip-shaped members 22 are moved from the first substrate 24 to the second substrate 24', the positional relationship between the plurality of strip-shaped members 22 is maintained, and the second dividing line 4b is formed. align in a straight line.

Next, with the first cut surface 22a facing upward, the plurality of strip-shaped members 22 are held by suction on the upper surface of the chuck table. Next, the strip-shaped member 22 is imaged from above by the imaging means, and the strip-shaped member 22 is positioned so as to be orthogonal to the X-axis direction based on the image of the strip-shaped member 22 imaged by the imaging means. The cutting edge 30a of the cutting blade 30 is positioned above one end in the longitudinal direction (one end in the Y-axis direction).

Then, the spindle housing 16 is lowered, and as shown in FIG. While cutting, the chuck table is relatively fed in the X-axis direction with respect to the spindle housing 16 at a predetermined processing feed rate. As a result, the cutting blade 30 can be positioned at the second dividing line 4b to cut the first cut surface 22a, and the tip of the lens 6 on the first cut surface 22a side can be chamfered.

Next, as shown in FIG. 5(a), the cutting blade 30 is moved to the second position while the spindle housing 16 is index-fed relative to the chuck table in the Y-axis direction by the interval of the second dividing line 4b. The first cut surface 22a is cut while being positioned on the second dividing line 4b, and all the chips of the lens 6 on the side of the first cut surface 22a are chamfered. After that, the suction and holding of the strip-shaped member 22 by the chuck table is released.

In the illustrated embodiment, after the second chamfering step is performed, the plurality of strip-shaped members 22 are removed from the second substrate 24', and the third substrate is formed so that the second dividing lines 4b are aligned in a straight line. The wafer 2 is arranged straight to return to the state of the wafer 2, and then the second dividing line 4b is cut to form chips, which is a step of forming chips. As in the strip-shaped member forming process, the chip forming process can be performed using the dicing device 12 equipped with a cutting blade 20 having a uniform cutting edge thickness.

The third substrate 24'' (see FIG. 6(a)) used in the chip forming process of the illustrated embodiment is the same as the first and second substrates 24, 24' used in the first and second chamfering processes. may have the same configuration as that of the first embodiment, comprising an annular frame 26'' and a dicing tape 28'' having a peripheral edge fixed to the annular frame 26''. Incidentally, the third substrate may also be composed of a hard substrate like the first and second substrates.

In the chip production process, first, each strip-shaped member 22 is separated from the dicing tape 28' of the second substrate 24'. Next, each strip-shaped member 22 is attached to the dicing tape 28 ″ of the third substrate 24 ″ so that the second division lines 4 b are aligned in a straight line, and the rectangular wafer 2 is restored (FIG. 6). (a)).

Next, the plurality of strip-shaped members 22 are held by suction on the upper surface of the chuck table. Next, the strip-shaped member 22 is imaged from above by the imaging means, and based on the image of the strip-shaped member 22 imaged by the imaging means, the second planned division line 4b is aligned in the X-axis direction, and the second division is performed. A cutting blade 20 is positioned above one end of the planned line 4b.

Next, the spindle housing 16 is lowered, and as shown in FIG. 6A, the cutting edge of the cutting blade 20 rotated in the direction A cuts from the upper surface to the lower surface of the strip-shaped member 22, and the spindle housing 16 The chuck table is relatively fed in the X-axis direction at a predetermined processing feed rate to cut the strip-shaped member 22 along the second dividing line 4b.

Next, while indexing the spindle housing 16 relative to the chuck table in the Y-axis direction by the interval of the second planned dividing line 4b, strip-shaped strips are formed along all of the second planned dividing line 4b. The member 22 is cut. As a result, as shown in FIG. 6B, a chamfered chip 34 having an octagonal cross section can be produced.

As described above, in the illustrated embodiment, the first and second chamfering steps are performed using the cutting blade 30 whose cutting edge 30a is formed in a shape corresponding to the chamfering performed on the chip 34. The chamfered tip 34 can be produced efficiently, and the problem that the tip 34 cracks due to an impact or the like and causes deterioration in quality is solved. After performing the second chamfering process, the cutting blade 20 is cut along the second dividing line 4b with the first cut surface 22a facing upward (the state shown in FIG. 5(b)). However, considering the structure of the wafer 2, from the viewpoint of reducing the occurrence of chipping, in the chip generation process of the illustrated embodiment, the original wafer 2 is cut into chips 34. , the strip-shaped member 22 is cut into chips 34 .

Next, FIGS. 7 to 7 show the case where the first and second chamfering processes are carried out using the first to fourth modified examples of the cutting blade whose cutting edge is formed in a shape corresponding to the chamfering performed on the chip. Description will be made with reference to FIG.

First, referring to FIG. 7, a first modification of the cutting blade indicated by reference numeral 36 will be described. As shown in FIG. 7, the cutting edge 36a of the cutting blade 36 has a concave arc shape. there is

As in the above-described embodiment, the first chamfering process is performed after the strip-shaped member forming process and the strip-shaped member disposing process are performed. In the first chamfering process using the cutting blade 36, as shown in FIG. 7A, first, one side of the tip of the lens 6 on the side of the second cut surface 22b is chamfered. A chamfered portion on one side of the chip of the lens 6 is indicated by reference numeral 38a. Next, as shown in FIG. 7(b), each strip-shaped member 22 is rotated 180 degrees around the axis extending in the vertical direction, and the other side of the chip of the lens 6 on the side of the second cut surface 22b is also chamfered. apply. A chamfered portion on the other side of the chip of the lens 6 is denoted by reference numeral 38b.

In the second chamfering process using the cutting blade 36, as shown in FIG. 7C, first, one side of the tip of the lens 6 on the side of the first cut surface 22a is chamfered, and then the chamfering process shown in FIG. As shown in (d), each strip-shaped member 22 is rotated 180 degrees around the axis extending in the vertical direction, and the other side of the chip of the lens 6 on the side of the first cut surface 22a is also chamfered. Then, after performing the second chamfering process, a chip forming process is performed using a cutting blade 20 having a uniform cutting edge thickness, so that chamfering is performed as shown in FIG. A chip 40 (with rounded corners) can be produced.

Next, referring to FIG. 8, a second modification of the cutting blade designated by reference numeral 42 will be described. As shown in FIG. 8, the cutting edge 42a of the cutting blade 42 has a concave arc shape. The thickness of one side and the other side in the thickness direction of the cutting edge 42a of 42 gradually decreases toward the tip. Further, the thickness T2 of the cutting blade 42 other than the cutting edge 42a is substantially the same as the width of the second planned division line 4b.

After performing the strip-shaped member forming step and the strip-shaped member disposing step, when the first chamfering step is performed using the cutting blade 42, as shown in FIG. Both sides of the chip of the lens 6 can be chamfered. As in the description of the cutting blade 36 of the first modified example, the chamfered portions on one side and the other side of the tip of the lens 6 are denoted by reference numerals 38a and 38b, respectively.

Next, a second chamfering process is performed using the cutting blade 42 to chamfer both sides of the tip of the lens 6 on the side of the first cut surface 22a, as shown in FIG. 8(b). Then, after performing the second chamfering process, a chip forming process is performed using a cutting blade 20 having a uniform cutting edge thickness, resulting in a chip 40 with rounded corners (Fig. 7(e) ) can be generated.

Next, with reference to FIG. 9, a third modification of the cutting blade indicated by reference numeral 44 will be described. As shown in FIG. 9, the cutting edge 44a of the cutting blade 44 has a concave arc shape. The intermediate portion in the thickness direction protrudes radially outward. The thickness T3 of the cutting blade 44 other than the cutting edge 44a is substantially the same as the width of the second dividing line 4b. More than half (L3≧W/2).

After performing the strip-shaped member forming step and the strip-shaped member disposing step, when the first chamfering step is performed using the cutting blade 44, as shown in FIG. can be formed on the second dividing line 4b, and the tip of the lens 6 on the side of the second cut surface 22b can be chamfered by cutting it into a semicircular shape.

Further, when the second chamfering process is performed using the cutting blade 44, the length L3 of the cutting edge 44a of the cutting blade 44 is more than half the width W of the tip of the lens 6 to be formed. As shown in (b), the processed portion in the second chamfering process reaches the groove 46 formed in the first chamfering process to generate a chamfered tip 48 with a circular cross section (cylindrical shape). be able to. That is, when the first and second chamfering processes are performed using the cutting blade 44 of the third modification, the chip generation process is performed using the dicing device 12 equipped with the cutting blade 20 having a uniform cutting edge thickness. The chamfered chip 48 can be produced without performing the chamfering process, and the productivity can be improved.

Next, with reference to FIG. 10, a fourth modification of the cutting blade indicated by reference numeral 50 will be described. As shown in FIG. 10, the cutting edge 52 of the cutting blade 50 includes a V-shaped first portion 52a whose thickness gradually decreases toward the tip, and a second portion 52a with a uniform thickness extending from the tip of the first portion 52a. and a portion 52b. The length L4 of the cutting edge 52 of the cutting blade 50 is at least half the width W of the chip to be formed (L4≧W/2).

After performing the strip-shaped member forming step and the strip-shaped member disposing step, when the first chamfering step is performed using the cutting blade 50, the cutting edge 52 of the cutting blade 50 has a shape as shown in FIG. A groove 54 corresponding to the second dividing line 4b can be formed, and both sides of the chip of the lens 6 on the second cut surface 22b side can be chamfered.

Further, when the second chamfering process is performed using the cutting blade 50, the length L4 of the cutting edge 52 of the cutting blade 50 is more than half the width W of the tip of the lens 6 to be formed. As shown in (b), the processed portion in the second chamfering process reaches the groove 54 formed in the first chamfering process, and a chamfered tip 56 having an octagonal cross section can be produced. . That is, even when the cutting blade 50 of the fourth modification is used to perform the first and second chamfering processes, the thickness of the cutting edge is the same as in the case of using the cutting blade 44 of the third modification. The chamfered chips 56 can be produced without performing the chip producing process using the dicing device 12 equipped with the cutting blade 20 having a similar shape, and productivity can be improved.

In the cutting blade 36 of the first modification and the cutting blade 42 of the second modification, the length L1 of the cutting edge 36a (see FIG. 7(a)) and the length L2 of the cutting edge 42a (see FIG. 8(a) )) is more than half the width W of the chip of the lens 6 to be formed (L1≧W/2, L2≧W/2), the cutting blade is the same as the cutting blades of the third and fourth modifications. In addition, chamfered chips can be produced without performing the chip producing process using the dicing device 12 equipped with the uniform cutting blade 20 .

2: Wafer 4: Planned division line 4a: First planned division line 4b: Second planned division line 22: Strip-shaped member 22a: First cut surface 22b: Second cut surface 24: First substrate 24′: Second substrate 24″: Third substrate 30: Cutting blade (shape corresponding to chamfering performed by the cutting edge on the chip)
30a: cutting edge 34: chip 36: cutting blade of the first modification 36a: cutting edge 42: cutting blade of the second modification 42a: cutting edge 44: cutting blade of the third modification 44a: cutting edge 50: fourth Modified cutting blade 52: cutting edge 52a: first portion of cutting edge 52b: second portion of cutting edge

Claims (4)

Chamfered chips are obtained by cutting a wafer having a plurality of chips partitioned by a plurality of first planned division lines and a plurality of second planned division lines intersecting the first planned division lines. A method for processing a wafer to be produced,
a strip-shaped member forming step of cutting the first planned division line to form a strip-shaped member having a first cut surface and a second cut surface;
The first cut surfaces of the plurality of strip-shaped members are arranged on a first substrate so that the second dividing lines of the strip-shaped members are arranged in a straight line, and the second cut surfaces are directed upward. A strip-shaped member arranging step exposed to
a first chamfering step of chamfering the second cut surface by positioning a cutting blade having a cutting edge formed in a shape corresponding to chamfering applied to the chip on the second dividing line;
A second substrate is disposed on the second cut surface, the first substrate is removed to expose the first cut surface upward, and the cutting edge is formed into a shape corresponding to chamfering applied to the chip. a second chamfering step of positioning the cutting blade on the second dividing line and cutting the first cut surface to perform chamfering;
A wafer processing method comprising at least: 2. The method of processing a wafer according to claim 1, wherein the cutting edge of the cutting blade formed in a shape corresponding to the chamfering is V-shaped. 2. The method of processing a wafer according to claim 1, wherein the cutting edge of the cutting blade formed in a shape corresponding to the chamfering has a concave circular arc shape. After the second chamfering step, the plurality of strip-shaped members are removed from the second substrate and arranged on the third substrate such that the second planned division lines are aligned in a straight line. 4. The method of processing a wafer according to any one of claims 1 to 3, wherein the wafer is returned to the state of (1), and then the chips are produced by cutting the second dividing lines.

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