KR102286476B1 - Glass substrate cutting method and light guide plate manufacturing method - Google Patents

Abstract

The technical idea of the present invention is to form a resin pattern including a lenticular pattern on the first surface of the glass substrate on the first surface; removing a portion of the resin pattern using laser light; forming scribe lines on a portion of the glass substrate where the resin pattern is exposed by removal; and cutting the glass substrate along the scribe lines.

Description

Glass substrate cutting method and light guide plate manufacturing method

The technical idea of the present invention relates to a method for cutting a glass substrate and a method for manufacturing a light guide plate using the same, and more particularly, to a method for cutting a glass substrate on which a resin pattern is formed and a method for manufacturing a light guide plate using the same.

A light guide plate used in a display device is a device for uniformly scattering and diffusing light incident on the light guide plate from a light source over the entire surface of the display. In general, a light guide plate is employed in an optical device such as a backlight unit (BLU). At least one light source may be disposed on a side surface of the light guide plate. The light of the light source incident on the light guide plate may be guided in a total internal reflection method. The light traveling inside the light guide plate may be emitted to the outside by a light extraction pattern formed on one surface of the light guide plate.

The problem to be solved by the technical idea of the present invention is to provide a method for cutting a glass substrate and a method for manufacturing a light guide plate with improved productivity and reliability

In order to solve the above problems, embodiments of the technical idea of the present invention provide a method for cutting a glass substrate. The method for cutting the glass substrate includes: forming a resin pattern including a lenticular pattern on a first surface of the glass substrate; removing a portion of the resin pattern using laser light; forming scribe lines on the first surface exposed by removing the resin pattern; and cutting the glass substrate along the scribe lines.

In the forming of the resin pattern, reference marks are formed at corners of the glass substrate at the same time as forming the resin pattern.

The transmittance of the laser light to the glass substrate is higher than the transmittance to the resin pattern.

The step of removing a portion of the resin pattern selectively removes only a portion of the resin pattern without substantially removing the glass substrate.

Effective optical regions and an outer region surrounding the effective optical regions are defined on the glass substrate.

The resin pattern further includes a light extraction pattern formed on the effective optical area.

The lenticular pattern extends from the effective optical areas to the outer area.

The scribe lines include at least one first scribe line disposed adjacent to an edge of the glass substrate and at least one second scribe line disposed adjacent to a central portion of the glass substrate.

Cutting the glass substrate may include: point-pressing the glass substrate along the first scribe line; and pre-pressing the glass substrate along the second scribe line.

The angle between the cut surface formed by cutting the glass substrate and the normal line of the first surface is 1° or less.

SUMMARY Embodiments of the technical idea of the present invention provide a method of manufacturing a light guide plate. A method of manufacturing a light guide plate includes forming a resin pattern on a first surface of a glass substrate, wherein the resin pattern extends in a first direction parallel to the first surface and is parallel to the first surface and the first surface a lenticular pattern disposed in a row along a second direction substantially perpendicular to the direction and a light extraction pattern recessed from the lenticular pattern in a third direction perpendicular to the first and second directions; removing at least a portion of the resin pattern to form first and second scheduled scribing portions exposing a first surface of the glass substrate; forming a scribe line extending on the first and second planned scribing portions on the glass substrate; and cutting the glass substrate along the scribe line.

In the forming of the first and second planned scribing portions, laser light having a wavelength that is transparent to the glass substrate is used.

The cut surface of the glass substrate formed in the step of cutting the glass substrate is substantially perpendicular to the first surface.

The selectively removing the resin pattern selectively removes the resin pattern without damaging the glass substrate.

In the forming of the resin pattern, reference marks are further formed at corners of the glass substrate.

The forming of the first and second planned scribing portions may include removing the resin pattern disposed on a straight line connecting the reference marks spaced apart in the first direction or the second direction with the resin pattern interposed therebetween. do.

In the forming of the first and second scribing scheduled portions, reference marks are further removed.

The first scribing schedule portion extends along the first direction, and the second scribing schedule portion extends along the second direction.

SUMMARY Embodiments of the technical idea of the present invention provide a method of manufacturing a light guide plate. A method of manufacturing a light guide plate includes: forming a resin pattern and reference marks on a first surface of a glass substrate; removing at least a portion of the reference marks and the resin pattern using laser light; forming scribe lines on the glass substrate in the portion from which the resin pattern is removed; and cutting the glass substrate along the scribe lines.

The depth of field of the laser light is smaller than -3 mm.

In the step of removing at least a portion of the resin pattern, laser light traveling at a speed of 100 mm/s or less is irradiated onto the resin pattern.

The wavelength of the laser light is 8 μm to 12 μm.

According to the technical idea of the present invention, a resin pattern is formed on a glass substrate, and a scribe scheduled portion is formed by partially removing the resin pattern. Then, by cutting the glass substrate along the scribe line formed on the scribe planned portion, it is possible to improve productivity and improve reliability at the same time.

1 is a schematic perspective view for explaining a scribing equipment SA according to some embodiments.
2A to 2D are diagrams for explaining the effect according to the technical idea of the present invention.
3A is a view showing a result of cutting a glass substrate according to a comparative example;
3B is a view showing a result of cutting a glass substrate according to an experimental example.
4 is a flowchart for explaining a method for cutting a glass substrate according to some embodiments of the present invention.
5A is a plan view for explaining a method for cutting a glass substrate according to some embodiments.
5B is an enlarged perspective view of 5E of FIG. 5A.
5C is a partial cross-sectional view taken along the cut line of FIG. 5A, 5I-5I', 5II-5II' and 5III-5III'.
6A is a plan view for explaining a method of cutting a glass substrate according to some embodiments.
6B is a partial cross-sectional view taken along the cut line of FIG. 6A, 6I-6I', 6II-4II' and 6III-6III'.
7A is a plan view for explaining a method for cutting a glass substrate according to some embodiments.
7B to 7D are partial cross-sectional views taken along the cut line of FIG. 7A, 7I-7I', 7II-7II' and 7III-7III'.
8 is a flowchart illustrating a method of manufacturing a glass according to some embodiments.
9 is a cross-sectional view for explaining a method of manufacturing a glass according to some embodiments.

Hereinafter, preferred embodiments of the present invention concept will be described in detail with reference to the accompanying drawings. However, embodiments of the inventive concept may be modified in various other forms, and the scope of the inventive concept should not be construed as being limited by the embodiments described below. The embodiments of the inventive concept are preferably interpreted as being provided in order to more completely explain the inventive concept to those of ordinary skill in the art. The same symbols refer to the same elements from beginning to end. Furthermore, various elements and regions in the drawings are schematically drawn. Accordingly, the inventive concept is not limited by the relative size or spacing drawn in the accompanying drawings.

Terms such as first, second, etc. may be used to describe various elements, but the elements are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the inventive concept, the first component may be referred to as the second component, and conversely, the second component may be referred to as the first component.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the inventive concept. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, expressions such as “comprises” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification is present, but one or more other features or It should be understood that the existence or addition of numbers, operations, components, parts or combinations thereof is not precluded in advance.

Unless defined otherwise, all terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept belongs, including technical and scientific terms. Also, commonly used terms as defined in the dictionary should be construed as having a meaning consistent with what they mean in the context of the relevant technology, and unless explicitly defined herein, in an overly formal sense. It will be understood that they should not be construed.

Where certain embodiments are otherwise feasible, a specific process sequence may be performed different from the described sequence. For example, two processes described in succession may be performed substantially simultaneously, or may be performed in an order opposite to the described order.

Light guide plates containing glass have much better strength and CTE properties than plastics, and can reduce the thickness of LCD TV sets. The light guide plates may include a lenticular pattern and a light extraction pattern. A conventional light guide plate includes a lenticular pattern and a light extraction pattern on opposite surfaces. According to some embodiments, on the other hand, the light guide plate may be formed on the same side of the glass substrate and include an integrated pattern of a lenticular pattern and a light extraction pattern. The integrated pattern included in the light guide plate according to some embodiments may be formed of resin, and has superior optical performance than the light guide plate in which the lenticular pattern and the light extraction pattern are formed on opposite surfaces. In addition, since the lenticular pattern and the light extraction pattern are simultaneously formed by one imprint process, the productivity of the light guide plate can also be greatly improved.

1 is a schematic perspective view for explaining a scribing equipment SA according to some embodiments.

Referring to FIG. 1 , the scribing equipment SA may be an apparatus for processing the resin pattern 120 and the glass substrate 110 . According to some embodiments, the scribing equipment SA may be a device for partially and selectively removing the resin pattern 120 . According to some embodiments, the scribing equipment SA may be an apparatus for forming a scribe line SL (refer to FIGS. 7B and 7C ) on the glass substrate 110 . The structures of the resin pattern 120 and the glass substrate 110 processed by the scribing equipment SA will be described in detail later with reference to FIGS. 5A to 5D .

According to some embodiments, first to third scribing tools ST1 , ST2 , and ST3 may be included. According to some embodiments, any one of the second and third scribe devices ST2 and ST3 may be omitted. According to some embodiments, in the scribing device SA, the third scribing device ST3 is omitted so that the first and second scribing devices ST1 and ST1 are disposed adjacent to the first surface of the glass substrate 110 . ST2) only. Here, the first surface refers to the surface of the glass substrate 110 in contact with the resin pattern 120 , and the second surface refers to the opposite surface. According to some embodiments, in the scribing device SA, the second scribing device ST2 is omitted so that the first scribing device ST and the second surface are disposed adjacent to the first surface of the glass substrate 110 . It may include only the third scribe device ST3 disposed in the .

According to some embodiments, the first scribing device ST1 may be a laser scribing device. According to some embodiments, the first scribing apparatus ST1 may partially remove the resin pattern 120 (refer to FIG. 2A ). According to some embodiments, the second and third scribe devices ST2 and ST3 may be mechanical scribing devices such as a diamond scribe device. According to some embodiments, the second and third scribe devices ST2 and ST3 may form a scribe line SL (refer to FIG. 7A ), which will be described later.

According to some embodiments, the first to third scribe devices ST1 , ST2 , and ST3 may be connected to the same driving means or may be connected to a synchronized driving means to operate at the same time. In this case, while the first scribe device ST1 partially removes the resin pattern 120 and moves, the second scribe device ST2 and/or the third scribe device ST3 also moves in synchronization with the scribe line ( SL, see FIG. 7a) can be formed. Accordingly, a scribe line SL (refer to FIG. 7A ) may be formed on the first surface of the glass substrate 110 or the second surface corresponding to the portion exposed by removing the resin pattern 120 .

According to some other embodiments, the first to third scribe devices ST1 , ST2 , and ST3 may be connected to separate driving means to operate at different times. In this case, after the partial removal of the resin pattern 120 by the first scribing apparatus ST1 is completed, scribing may be performed. According to some other embodiments, when only the first and third scribing apparatuses ST1 and ST3 are provided, scribing is first performed using the reference marks 123 ( FIG. 5A ), and then the resin pattern 120 is provided. ) can be selectively removed.

2A to 2D are diagrams for explaining effects according to one or more embodiments. More specifically, FIGS. 2A to 2D are views for explaining the processing of the resin pattern 120 by the scribing equipment SA shown in FIG. 4 shows the results of the experimental example.

The resin pattern 120 was formed by imprinting a polycarbonate UV resin layer provided by screen printing. In the first to fourth experimental examples, the resin pattern 120 has a thickness of about 31 μm. At this time, the resin pattern 120 includes the lenticular pattern LT as described with reference to FIG. 5A , and the thickness of the resin pattern 120 is the highest point of the lenticular pattern LT, that is, the glass substrate 110 . It may be a distance between a point farthest away from and the lower surface of the resin pattern 120 .

The laser used for the processing of the resin pattern 120 is a CO ₂ laser and output light having a wavelength of about 10 μm. The power of the laser used in the experiment was about 48.4W.

Yes laser setup removal area evaluation Depth of Field (mm) speed
(mm/s) depth
(μm) width
(μm) Experiment 1 5.4 1500 32 100-200 surface damage 2nd Experimental Example -3 500 22 500 Resin pattern not removed 3rd Experimental Example -3 200 31 400-800 some not removed Example 4 -8 100 31 670~1170 clean removal

Referring to FIG. 2A and Table 1, when the resin pattern 120 was removed using laser light having a depth of field of about 5.4 mm and a progress rate of about 1500 mm/s in the first experimental example, the depth of the removed portion was about 32 μm. , it was confirmed that the upper portion of the glass substrate 100 was partially removed (ie, damaged) in addition to the removal of the resin pattern 120 having a thickness of about 31 μm. Damage to the glass substrate 100 is that the upper portion of the glass substrate 100 is partially removed by the removal of the resin pattern 120 , or the upper portion of the glass substrate is not partially removed during the removal of the resin pattern 120 . , may mean that an excessive stress exceeding an allowable value is applied to the glass substrate 100 . Referring to FIG. 2B and Table 1, in the second experimental example, when the resin pattern 120 was removed using laser light having a depth of field of about -3 mm and a progress rate of about 500 mm/s, the depth of the removed portion was about 22 μm. , it was confirmed that the resin pattern 120 remained without being completely removed. Accordingly, the first surface of the glass substrate 110 disposed under the resin pattern 120 was not exposed.

Referring to FIG. 2C and Table 1, in the third experimental example, when the resin pattern 120 was removed using laser light having a depth of field of about -3 mm and a progress rate of about 200 mm/s, the depth of the removed portion was about 31 μm. , it was confirmed that the glass substrate 110 was not damaged. Although the first surface of the glass substrate 110 was partially exposed, there was a region that was not completely removed as bubbles were formed in the resin pattern in some regions of the first surface. The horizontal width of the portion from which the resin pattern 120 was removed was about 400 μm to about 800 μm.

Referring to FIG. 2D and Table 1, in the fourth experimental example, when the resin pattern 120 was removed using laser light having a depth of field of about -8 mm and a progress rate of about 100 mm/s, the depth of the removed portion was about 31 μm. , it can be seen that the resin pattern 120 has been completely removed, and the glass substrate 110 is not damaged. Accordingly, the undamaged first surface of the glass substrate 110 was exposed. In addition, the width of the portion from which the resin pattern 120 is removed was about 670 μm to about 1170 μm.

Figure 3a is a view showing the cutting result of the glass substrate according to the comparative example, Figure 3b is a view showing the cutting result of the glass substrate according to an experimental example.

Referring to FIG. 3A , without removing the resin pattern 120 , a scribe line SL, FIG. 7a), the result of cutting and separating the glass substrate 110 is shown. The scribe line SL (refer to FIG. 7A ) was formed by the third scribe device ST3, and the glass substrate 110 was cut by a point pressing method. Referring to FIG. 3A , it was confirmed that the resin pattern 120 was peeled from the glass substrate 110 during the separation process of the glass substrate 110 .

FIG. 3B shows a process in which the resin pattern 120 is removed, a scribe line SL (refer to FIG. 7A ) is formed on the second surface, and the glass substrate 110 is cut along the scribe line SL (refer to FIG. 7A ). The results are shown. Referring to FIG. 3B , it can be seen that the resin pattern 120 is not peeled from the glass substrate 110 during the separation process of the glass substrate 110 .

Referring to FIGS. 1 to 3B , when the resin pattern 120 is partially removed, a scribe line SL (refer to FIG. 7A ) is formed, and then the glass substrate 110 is cut, the resin pattern 120 is glass. It can be seen that it is not separated from the substrate 110 . Accordingly, the reliability of cutting and manufacturing the glass substrate 110 may be improved.

4 is a flowchart for explaining a method for cutting a glass substrate according to some embodiments of the present invention.

5A is a plan view for explaining a method of cutting a glass substrate according to some embodiments, FIG. 5B is an enlarged perspective view of 5E of FIG. 5A, and FIG. 5C is a cut line of FIG. 5A, 5I-5I', 5II Partial cross-sectional views taken along -5II' and 5III-5III'.

Referring to FIGS. 4 to 5C , the resin pattern 120 including the integrated pattern IP and the reference marks 123 may be formed on the glass substrate 110 at P10 .

According to some embodiments, the glass substrate 110 may have a flat plate shape. Hereinafter, for convenience of description, the glass substrate 110 will be described based on the shape of a substantially rectangular flat plate, but this does not limit the embodiments disclosed herein in any sense. For example, the glass substrate 110 may have any of various flat plate shapes, such as a circle, an ellipse, a triangle, a polygon of a pentagon or more.

Forming the resin pattern 120 and the reference marks 123 on the glass substrate 110 includes coating a resin layer (not shown) on the substrate, and patterning the resin layer by imprinting or the like. can do. According to some embodiments, the resin layer is made of a material such as PMMA (Poly Methyl Meth Acrylate), MS (MMA-Styrene copolymer), PS (poly-styrene), PC (poly-carbonate), PET (polyethylene-terephthalate), etc. It may include, but is not limited to. The resin layer may include an ultraviolet curable material. According to some embodiments, curing using ultraviolet and/or infrared rays may be additionally performed on the resin pattern 120 . The strength of the resin pattern 120 and adhesion to the glass substrate 110 may be enhanced by UV and/or infrared curing.

Hereinafter, as defined in FIG. 1 , a surface in contact with the resin pattern 120 is referred to as a first surface, and an opposite surface is referred to as a second surface. In addition, two directions parallel to the first surface of the glass substrate 110 and substantially perpendicular to each other are defined as first and second directions (X-direction, Y-direction) in order, respectively, and substantially perpendicular to the first surface. One direction is defined as a third direction (Z direction).

According to some embodiments, an effective optical area 110E and an outer area 110R may be defined on the glass substrate 110 . According to some embodiments, the outer region 110R may surround the effective optical region 110E. According to some embodiments, the effective optical area 110E has a substantial optical function (eg, high uniformity of light extraction) when a glass article made by the methods described herein is applied to any optical article (eg, a display). It may be an area in which

According to some embodiments, the resin pattern 120 may include an integrated pattern (IP). According to some embodiments, the integrated pattern IP may include a lenticular pattern LT and a light extraction pattern EP. According to some embodiments, integrated patterns IP may be formed on the effective optical area 110E. According to some embodiments, the integrated patterns IP may not be formed on the outer region 110R. According to some embodiments, only the lenticular pattern LT is formed in the outer region 110R, but the light extraction pattern EP may not be formed. According to some embodiments, the lenticular pattern LT may extend from the effective optical area 110E to the outer area 110R.

A thickness (ie, a third direction (Z direction) length) of the resin pattern 120 may be about 30 μm or more. Here, since the resin pattern 120 includes the lenticular pattern LT, the thickness of the resin pattern 120 refers to the maximum thickness in the third direction (Z direction). Alternatively, the thickness of the resin pattern 120 may be a distance from the highest point of the lenticular pattern LT to the lower surface of the resin pattern 120 in contact with the glass substrate.

Although it is illustrated that four substantially identical effective optical regions 110E are defined on one glass substrate 110 in FIG. 5A , the present invention is not limited thereto. More specifically, various sizes and numbers of effective optical areas 110E may be defined according to specifications of a glass product (eg, a light guide plate) to be produced. That is, two, three, or five or more effective optical regions may be defined on one glass substrate 110 , or effective optical regions having different sizes and shapes may be defined.

According to some embodiments, the cross-sectional shape of the lenticular pattern LT may have, for example, any one of a wedge shape, a convexly protruding arc shape, a polygonal arc shape, and a dome shape. According to some embodiments, the lenticular pattern LT may extend long in the second direction (Y direction). The lenticular patterns LT may be formed to form a plurality of columns aligned along the first direction (X direction).

According to some embodiments, the light extraction pattern EP may have a shape in which the lenticular pattern LT is partially recessed. According to some embodiments, the light extraction pattern EP may be a dent or a recess formed in the lenticular pattern LT. According to some embodiments, the light extraction pattern EP may be formed with a periodic or aperiodic pitch. According to some embodiments, the light extraction pattern EP may have a regular or irregular shape and/or size. In FIG. 2C , the profile viewed from above of the light extraction pattern EP is illustrated as having a rectangular shape, but is not limited thereto. The profile viewed from above of the light extraction pattern EP may have any of various shapes such as polygons, circles, ellipses, and the like.

According to some embodiments, the lenticular pattern LT may increase the average inclination angle of the effective optical area 110E. Accordingly, since the light traveling in the effective optical area 110E has many components equal to or less than the total reflection critical angle, the amount of emitted light may increase.

According to some embodiments, reference marks 123 may be formed together when the resin layer is patterned. The fiducial marks 123 may have a substantially cross shape. However, the present invention is not limited thereto, and the reference marks 123 may have any shape that is optically easy to identify, such as a polygon, a circle, a star shape, an ellipse, and an irregular shape. The lengths of the first and second directions (X-direction, Y-direction) of the fiducial marks 123 may be in the range of approximately several hundred micrometers, respectively, and the width may be approximately 100 micrometers, but this is only an exemplary numerical value and in any sense It does not limit the invention. According to some embodiments, the reference marks 123 may be a reference for improving the precision of the selective removal process of the resin pattern 120 to be described later.

According to some embodiments, two or more reference marks 123 may be disposed adjacent to each corner of the resin pattern 120 . According to some embodiments, the reference marks 123 may be disposed adjacent to midpoints of four sides of the resin pattern 120 . However, the arrangement of the fiducial marks 123 shown in FIG. 2A is exemplary and does not limit the present invention in any sense. That is, the arrangement of the reference marks 123 may be variously modified according to the size and shape of the glass product to be formed by the cutting process.

When the glass substrate 110 is cut and separated, it is included in the cut surface of the glass substrate 110 and the integrated pattern (IP) due to the cumulative error of a series of processes including coating, imprinting, cutting and grinding, etc. There is a problem in that the extension direction (ie, the second direction (Y direction)) of the lenticular pattern LT is misaligned.

According to one or more exemplary embodiments, the first and second scribing schedulers SPP1 and SPP2 (see FIG. 6A ) using the reference marks 123 precisely aligned with the integrated pattern IP during the imprinting process. may be formed, and a scribe line SL (refer to FIG. 7A ) may be formed based on the first and second scribing scheduled portions SPP1 and SPP2. Accordingly, the cutting surface of the glass substrate 110 and the extending direction (ie, the second direction) of the lenticular pattern LT may be precisely aligned. In particular, when the glass substrate 110 is used as a light guide plate, the lenticular pattern LT is substantially parallel to that corresponding to the light extraction surface among the cut surfaces of the glass substrate 110 formed in a cutting process to be described later. can be sorted. Accordingly, the optical performance of the light guide plate, which is the final product, may be improved.

6A is a plan view for explaining a method of cutting a glass substrate according to some embodiments, and FIG. 6B is a partial cross-sectional view taken along the cutting line of FIG. 6A, 6I-6I', 6II-4II' and 6III-6III'.

1, 4, 6A, and 6B , a portion of the resin pattern 120 may be selectively removed at P20.

According to some embodiments, the first and second planned scribing portions SPP1 and SPP2 may be formed by the selective removal of the resin pattern 120 . According to some embodiments, the upper surface of the glass substrate 100 may be exposed in the first and second planned scribing portions SPP1 and SPP2 . According to some embodiments, the first planned scribing parts SPP1 may extend substantially parallel to the first direction (X direction), and the second planned scribing parts SPP2 may extend in the second direction ( Y direction) and may extend substantially parallel to each other. According to some embodiments, each of the first planned scribing parts SPP1 may cross each of the second planned scribing parts SPP2 in a cross shape.

According to some embodiments, the resin pattern 120 may be selectively removed by the first scribing apparatus ST1 . According to some embodiments, the first scribing device ST1 may be a laser scribing device, and laser light generated by the first scribing device ST1 may have a wavelength transparent to the glass substrate 110 . According to some embodiments, the transmittance of the laser light generated by the first scribing apparatus ST1 to the glass substrate 110 may be higher than that to the resin pattern 120 . According to some embodiments, the wavelength of the laser light generated by the first scribing device ST1 may be about 8 μm to about 12 μm. Accordingly, the laser light generated by the first scribing apparatus ST1 may selectively remove only the resin pattern 120 without substantially damaging the glass substrate 110 . That is, selectively removing the resin pattern 120 means partially removing only the resin pattern 120 without damaging the glass substrate 110 .

According to some embodiments, the depth of field of the laser light generated by the first scribing device ST1 may be equal to or smaller than -3 mm. According to some embodiments, the traveling speed of the first scribing device ST1 and, accordingly, the traveling speed of the laser light may be about 200 mm/s or less.

According to some embodiments, the selective removal of the resin pattern 120 may be performed using the reference marks 123 (refer to FIG. 2A ) as alignment marks. According to some embodiments, the reference marks 123 (refer to FIG. 2A ) spaced apart with the resin pattern 120 therebetween are connected in the first direction (X direction), and the first direction (X direction) and substantially As the resin pattern 120 disposed on the first straight line parallel to , is removed, the first scheduled scribing portion SPP1 may be formed. Similarly, according to some embodiments, the reference marks 123 (refer to FIG. 2A ) spaced apart with the resin pattern 120 therebetween are connected in the second direction (Y direction), and the second direction (Y direction) As the resin pattern 120 disposed on the second straight line substantially parallel to the , the first scribing scheduled portion SPP1 is formed.

According to some embodiments, the reference marks 123 (refer to FIG. 2A ) may be removed by the first scribing apparatus ST1 together with the selective removal of the resin pattern 120 . Referring to FIG. 6A , although it is illustrated that the reference marks 123 (see FIG. 5A ) are completely removed, the present invention is not limited thereto, and some of the reference marks 123 (see FIG. 5A ) may remain.

7A is a plan view for explaining a method for cutting a glass substrate according to some embodiments, and FIG. 7B is a partial cross-sectional view taken along the cutting line of FIG. 7A, 7I-7I', 7II-7II' and 7III-7III'.

1, 4, 7A, and 7B , a scribe line SL may be formed at P30.

According to some embodiments, the scribe line SL may be a crack, a microtunnel, and/or a perforation to improve the quality of the cut surface in a cutting process to be described later. FIG. 5B is a diagram illustrating a case in which the third scribing apparatus ST3 is omitted (or, although not omitted, a scribing process is not performed). The scribe line SL shown in FIG. 7B may be formed by the second scribe device ST2. According to some embodiments, the depth of the scribe line SL may be about 1/20 to 1/2 of the thickness of the glass substrate 110 (ie, the length in the third direction (Z direction)), but is not limited thereto.

According to some embodiments, the scribe lines SL may be formed with reference to the first and second scribing schedule portions SPP1 and SPP2. According to some embodiments, the scribe lines SL may extend on center lines of the first and second scribing scheduled portions SPP1 and SPP2. According to some embodiments, the scribe lines SL may extend to completely cross the top surface of the glass substrate 110 . According to some embodiments, the glass substrate 110 may be divided into two parts by respective scribe lines SL. Accordingly, during the cutting process, the glass substrate 110 may be separated into different glass products based on the scribe lines SL.

According to some embodiments, each effective optical area 110E may be surrounded by scribe lines SL. According to some embodiments, each of the effective optical areas 110E may be disposed to be spaced apart from each other with the scribe lines SL interposed therebetween.

7C and 7D are partial cross-sectional views taken along the cutting line 7I-7I', 7II-7II' and 7III-7III' of FIG. 7A, and more specifically, scribe lines SL formed in different ways These are partial cross-sectional views for

FIG. 7C is a diagram illustrating a case in which the second scribe device ST2 is omitted and the scribe line SL is formed by the third scribe device ST3. Alternatively, alternatively, FIG. 7C is a diagram illustrating a case in which both the second and third scribing devices ST2 and ST3 are provided, but a scribing process by the third scribing device ST3 is not performed.

1 and 7C , a scribe line SL may be formed on the second surface. The scribe lines SL formed on the second surface may extend to completely cross the top surface of the glass substrate 110 , and according to some embodiments, the scribe lines SL may be formed on the glass substrate 110 by the respective scribe lines SL. ) can be divided into two parts.

7D is a diagram illustrating a case in which all of the first to third scribing devices ST1, ST2, and ST3 are used. Referring to FIG. 7D , the scribe line SL may be formed on the first and second surfaces, respectively.

4 and 7A , the glass substrate 110 may be cut at P40.

The glass substrate 110 may be cut along the scribe line SL. Separation of the glass substrate 110 may be performed by any known method such as ball breaking, bar breaking, and tilt breaking. Ball breaking may be a method of point-pressing the scribe line SL formed on the glass substrate 110 . Bar breaking and tilt breaking may be a method of pre-pressing the scribe line SL formed on the glass substrate 110 . According to some embodiments, when cutting the glass substrate 110 along the scribe line SL disposed adjacent to the edge of the glass substrate 110, a ball breaking method may be used. According to some embodiments, when cutting the glass substrate 110 along the scribe line SL disposed adjacent to the central portion of the glass substrate 110, bar breaking and tilt breaking may be used.

In the conventional manufacturing process of the light guide plate, after cutting the glass substrate according to the purpose, separate processes for forming a lenticular pattern and a light extraction pattern for each of the cut glass substrates were performed. According to exemplary embodiments, since the resin pattern 120 is formed on the glass substrate 110 before cutting the glass substrate 110 and then cut, the productivity of glass products (eg, light guide plate) can be greatly improved. can

Since light is incident through the side cut surface of a general light guide plate, it is very important for optical performance to form the cut surface of the imprinted glass with high quality (ie, no defects). When the surface on which the resin pattern 120 is formed is mechanically cut, the scribe device does not touch the surface of the glass substrate 110 because it is blocked by the resin pattern 120 even when a high pressure cutting scribe device is used. There is this.

According to one or more exemplary embodiments, the first scribing device ST1 may selectively remove only the resin pattern 120 without damaging the glass substrate 110 , and the second and/or third scribing device ST2 may be used. , ST3) may form a scribe line SL on the first surface or a portion corresponding thereto from which the resin pattern is removed. Therefore, by selectively removing the resin pattern 120 before forming the scribe line SL, as described above, productivity can be improved and reliability can be secured.

8 is a flowchart illustrating a method of manufacturing a glass according to some embodiments. 9 is a cross-sectional view for explaining a method of manufacturing a glass according to some embodiments. More specifically, FIG. 9 is a partial cross-sectional view illustrating an enlarged cut surface of the glass substrate 110 .

P10 to P40 of FIG. 8 may be substantially the same as P10 to P40 described with reference to FIG. 1 . Therefore, for convenience of description, duplicates of those described with reference to FIG. 1 will be omitted, and differences will be mainly described.

Referring to FIGS. 8 and 9 , the cut surface may be chamfered at P50.

The chamfering of the cut surface may be performed by approaching the substrate to the rotating chamfering scribe device (CHW) in the extending direction. The quality of the chamfered glass substrate 110 may be characterized by a thickness (t), a chamfer width (Wc), a chamfer height (Hc), and a cut plane angle (θ). Here, the cutting plane angle may be defined by an angle between the cutting plane and the normal of the first surface.

In particular, when the finally produced glass product is a light guide plate, it is very important for the optical performance of the light guide plate that the cutting plane angle θ is substantially perpendicular. In one or more embodiments, the cut angle of the glass substrate 110 is about 1° or less, and it can be seen that excellent optical properties are exhibited.

Then, referring to FIG. 9 , the glass substrate 110 cut at P60 may be cleaned. The cleaning of the glass substrate 110 may be performed by a cleaning apparatus. According to some embodiments, the cleaning apparatus may be of an in-line type or a batch type. Here, the in-line type cleaning apparatus can clean the glass substrate moving along the conveyor using a cleaning solution and a sponge. A batch type cleaning apparatus can clean a glass substrate immersed in a cleaning solution.

Exemplary embodiments have been disclosed in the drawings and specification as described above. Although the embodiments have been described using specific terms in the present specification, these are used only for the purpose of explaining the technical spirit of the present disclosure, and are not used to limit the meaning or the scope of the present disclosure described in the claims. Therefore, it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the true technical protection scope of the present disclosure should be defined by the technical spirit of the appended claims.

110: glass substrate, 110E: effective optical area, 110R: outer area
120: resin pattern, 123: reference mark
LT: Lenticular pattern, EP: Light extraction pattern, IP: Integration pattern
ST1, ST2, ST3: first to third scribe devices
SPP1, SPP2: first and second scribing scheduled parts, SL: scribe line

Claims (20)

forming a resin pattern including a lenticular pattern on a first surface of a glass substrate;
removing a portion of the resin pattern using laser light;
forming scribe lines on the first surface exposed by removing the resin pattern; and
cutting the glass substrate along the scribe lines;
The step of removing a portion of the resin pattern includes irradiating the laser light along a direction perpendicular to the extension direction of the lenticular pattern,
The thickness of the resin pattern is 30 µm or more, the wavelength of the laser light is 8 µm to 12 µm, the depth of field of the laser light is -3 mm or less, and the laser light proceeds in a direction perpendicular to the extending direction of the lenticular pattern The speed is 200mm/s or less, characterized in that the glass substrate cutting method. According to claim 1,
The forming of the resin pattern includes forming reference marks at corners of the glass substrate at the same time as forming the resin pattern. According to claim 1,
Transmittance of the laser light to the glass substrate is a glass substrate cutting method, characterized in that higher than the transmittance for the resin pattern. According to claim 1,
The step of removing a portion of the resin pattern, without removing the glass substrate, the glass substrate cutting method, characterized in that selectively removing only a portion of the resin pattern. According to claim 1,
Effective optical regions and an outer region surrounding the effective optical regions are defined on the glass substrate;
The resin pattern is a glass substrate cutting method, characterized in that it further comprises a light extraction pattern formed on the effective optical area. 6. The method of claim 5,
and the lenticular pattern extends from the effective optical areas to the outer area. According to claim 1,
The scribe lines include at least one first scribe line disposed adjacent to an edge of the glass substrate and at least one second scribe line disposed adjacent to a central portion of the glass substrate,
The step of cutting the glass substrate,
Point pressing the glass substrate along the first scribe line; and
along the second scribe line, a method for cutting a glass substrate comprising the step of pre-pressing the glass substrate. According to claim 1,
The angle between the cut surface formed by cutting the glass substrate and the normal of the first surface is a glass substrate cutting method, characterized in that less than 1 °. Forming a resin pattern on a first surface of a glass substrate, wherein the resin pattern is elongated in a first direction parallel to the first surface, parallel to the first surface, and perpendicular to the first direction. a lenticular pattern arranged in rows along a direction and a light extraction pattern recessed from the lenticular pattern in a third direction perpendicular to the first and second directions;
removing at least a portion of the resin pattern to form first and second scheduled scribing portions exposing a first surface of the glass substrate;
forming a scribe line extending on the first and second planned scribing portions on the glass substrate; and
Including; cutting the glass substrate along the scribe line;
Forming the first scribing scheduled portion comprises irradiating laser light along the second direction,
The thickness of the resin pattern is 30 μm or more, the wavelength of the laser light is 8 μm to 12 μm, the depth of field of the laser light is -3 mm or less, and the traveling speed of the laser light in the second direction is 200 mm/s or less. A method for manufacturing a light guide plate, characterized in that 10. The method of claim 9,
The forming of the first and second planned scribing portions may include using laser light having a wavelength that is transparent to the glass substrate. 10. The method of claim 9,
The method for manufacturing a light guide plate, characterized in that the cut surface of the glass substrate formed in the step of cutting the glass substrate is perpendicular to the first surface. 10. The method of claim 9,
The selectively removing the resin pattern comprises selectively removing the resin pattern without damaging the glass substrate. 10. The method of claim 9,
The forming of the resin pattern may include forming reference marks at corners of the glass substrate. 14. The method of claim 13,
The forming of the first and second scheduled scribing portions may include forming the resin pattern disposed on a straight line connecting the reference marks spaced apart in the first direction or the second direction with the resin pattern interposed therebetween. A method of manufacturing a light guide plate, characterized in that it is removed. 14. The method of claim 13,
In the forming of the first and second scribing scheduled portions, reference marks are further removed. 14. The method of claim 13,
The method of claim 1 , wherein the first scribing scheduled portion extends along the first direction, and the second scribing scheduled portion extends along the second direction. forming a resin pattern including reference marks and a lenticular pattern on a first surface of a glass substrate;
removing at least a portion of the reference marks and the resin pattern using laser light;
forming scribe lines on the glass substrate in the portion from which the resin pattern is removed; and
cutting the glass substrate along the scribe lines;
The step of removing at least a portion of the resin pattern includes irradiating the laser light in a direction perpendicular to an extension direction of the lenticular pattern,
The thickness of the resin pattern is 30 µm or more, the wavelength of the laser light is 8 µm to 12 µm, the depth of field of the laser light is -3 mm or less, and the laser light proceeds in a direction perpendicular to the extending direction of the lenticular pattern A method for manufacturing a light guide plate, characterized in that the speed is 200 mm/s or less.

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