JP6166587B2 - Cutting method of resin plate attached to glass substrate - Google Patents

Cutting method of resin plate attached to glass substrate Download PDF

Info

Publication number
JP6166587B2
JP6166587B2 JP2013106047A JP2013106047A JP6166587B2 JP 6166587 B2 JP6166587 B2 JP 6166587B2 JP 2013106047 A JP2013106047 A JP 2013106047A JP 2013106047 A JP2013106047 A JP 2013106047A JP 6166587 B2 JP6166587 B2 JP 6166587B2
Authority
JP
Japan
Prior art keywords
laser beam
resin plate
polarizing plate
glass substrate
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013106047A
Other languages
Japanese (ja)
Other versions
JP2014226671A (en
Inventor
智史 國生
智史 國生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2013106047A priority Critical patent/JP6166587B2/en
Priority to TW103100795A priority patent/TWI581885B/en
Priority to KR20140010405A priority patent/KR20140136861A/en
Priority to CN201410144034.8A priority patent/CN104175002A/en
Publication of JP2014226671A publication Critical patent/JP2014226671A/en
Application granted granted Critical
Publication of JP6166587B2 publication Critical patent/JP6166587B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Description

本発明は、ガラス基板上に貼り付けられた樹脂板を、レーザビームの照射により切断する切断方法に関する。例えば、本発明は、ガラス基板上に樹脂製の偏光板が貼り付けられた液晶表示パネル（ＬＣＤ）において、偏光板をレーザビームで切断する際の切断方法として利用される。   The present invention relates to a cutting method for cutting a resin plate attached on a glass substrate by laser beam irradiation. For example, the present invention is used as a cutting method when a polarizing plate is cut with a laser beam in a liquid crystal display panel (LCD) in which a resin polarizing plate is attached to a glass substrate.

ガラス基板の片面あるいは両面にＰＥＴ樹脂などからなる偏光板（偏光フイルム）を貼り付けた液晶表示パネルは従来から知られている。このような液晶表示パネルを製造する方法が、例えば特許文献１に開示されている。この特許文献１で示された方法では、まず、複数の単位パネルがパターン形成された大面積の液晶マザー基板から個々の単位パネルを切り出し、この単位パネルに、別途作成された偏光板が一枚ずつ貼り付けられている。   Conventionally, a liquid crystal display panel in which a polarizing plate (polarizing film) made of PET resin or the like is attached to one side or both sides of a glass substrate is known. A method for manufacturing such a liquid crystal display panel is disclosed in Patent Document 1, for example. In the method disclosed in Patent Document 1, first, individual unit panels are cut out from a large-area liquid crystal mother substrate on which a plurality of unit panels are patterned, and a single polarizing plate is prepared on each unit panel. It is pasted one by one.

上記の方法では、単位パネル毎に偏光板を貼り付けなければならないので、その工程に時間がかかる。また、ガラス基板に対して、それと同サイズの偏光板を正確に位置決めして貼り付けなければならず、時間を要するとともに位置決めの精度が要求され、位置ズレによる不具合が発生しやすい。   In the above method, since a polarizing plate must be attached to each unit panel, the process takes time. In addition, a polarizing plate of the same size as that of the glass substrate must be accurately positioned and affixed, which requires time and positioning accuracy is required, and problems due to misalignment are likely to occur.

そこで出願人は、大面積の液晶マザー基板の全面に偏光板を先に貼り付けておき、その後、切断予定ラインに沿ってレーザビームで偏光板を切断するようにした方法を特許文献２で開示している。これによれば、偏光板を単位パネルのガラス基板に合わせて精度よく、かつ、一挙に複数の単位パネルに貼り付けることができる。また、ガラス基板と偏光板との間にＩＴＯ膜を介在させることで、ビーム照射時にはＩＴＯ膜でビームが反射され、ガラス基板への熱ダメージを抑えることができる。   Therefore, the applicant discloses in Patent Document 2 a method in which a polarizing plate is first pasted on the entire surface of a large-area liquid crystal mother substrate, and then the polarizing plate is cut with a laser beam along a planned cutting line. doing. According to this, the polarizing plate can be attached to a plurality of unit panels at once with high accuracy in accordance with the glass substrate of the unit panel. Further, by interposing the ITO film between the glass substrate and the polarizing plate, the beam is reflected by the ITO film at the time of beam irradiation, and thermal damage to the glass substrate can be suppressed.

特開２００２−０２３１５１号公報JP 2002-023151 A 特開２０１１−１７８６３６号公報JP 2011-178636 A

一般に、レーザビームを走査して偏光板を切断する場合、レーザビームは、所定の強度分布で走査するようにしている。照射ビームの光強度分布は、図５（ａ）に示すように、光軸中心部が強く、その外側が弱くなる山状の分布（ガウシアン分布）になる。レーザビームは、円形状ビームスポットを形成していてもよく、また、所定の長軸径、短軸径を有する楕円状のビームスポットを形成していてもよい。
したがって、レーザビームの焦点をガラス基板１１に貼り付けられた偏光板１２の表面に合わせて照射した場合、図５（ｂ）に示すように、溶融やアブレーションにより形成される溝１３は、略上記の光強度分布（照射面の熱強度分布と同様）の反転形状となる。この後、基板を次工程に送り、溝１３の中心に沿ってガラス基板１１を単位パネルに分断すると、図５（ｃ）に示すように、偏光板１２の切断面は傾斜面となる。その結果、ガラス基板１１の端面近傍には、偏光板１２の板厚が徐々に薄くなる傾斜領域が所定の幅Ｌ１で形成されることになる。
しかしながら、分断された単位パネルを製品としてみた場合には、傾斜領域の幅Ｌ１はできるだけ小さい方が望ましい。すなわち、偏光板１２の端はできるだけガラス基板１１の端に近い位置で分断できることが望ましい。
傾斜領域の幅Ｌ１を小さくするための方法として、偏光板１２表面におけるビームスポットの小径化がある。レーザビームは、より小さく集光させることで急峻な光強度分布へと変化する。前述のように、溝１３は、光強度分布に応じた反転形状となるため、結果的により狭い傾斜領域Ｌ１を得ることができる。しかし、その一方で、ビームスポット内は強い光強度で集中的に照射されることになるため、偏光板１２直下のガラス基板１１にも熱的ダメージを与えてしまうことになる。ガラス基板１１への熱的ダメージは、ガラス基板１１自体の強度低下を招いて製品価値を大きく損なうため、極力避けねばならない。
高品質の単位パネルを得るためには、ガラス基板に熱的ダメージをもたらすことなく、上記傾斜領域の幅Ｌ１をできるだけ小さく、具体的にはＬ１を５０μｍ以下にすることが望ましい。 In general, when a polarizing plate is cut by scanning a laser beam, the laser beam is scanned with a predetermined intensity distribution. As shown in FIG. 5A, the light intensity distribution of the irradiation beam is a mountain-shaped distribution (Gaussian distribution) in which the central portion of the optical axis is strong and the outside thereof is weak. The laser beam may form a circular beam spot, or may form an elliptical beam spot having a predetermined major axis diameter and minor axis diameter.
Therefore, when the focus of the laser beam is applied to the surface of the polarizing plate 12 attached to the glass substrate 11, as shown in FIG. 5B, the groove 13 formed by melting or ablation is substantially the same as described above. Of the light intensity distribution (similar to the heat intensity distribution on the irradiated surface). Thereafter, when the substrate is sent to the next process and the glass substrate 11 is divided into unit panels along the center of the groove 13, the cut surface of the polarizing plate 12 becomes an inclined surface as shown in FIG. As a result, an inclined region where the plate thickness of the polarizing plate 12 is gradually reduced is formed in the vicinity of the end face of the glass substrate 11 with a predetermined width L1.
However, when the divided unit panel is viewed as a product, it is desirable that the width L1 of the inclined region is as small as possible. That is, it is desirable that the end of the polarizing plate 12 can be divided as close to the end of the glass substrate 11 as possible.
As a method for reducing the width L1 of the inclined region, there is a reduction in the diameter of the beam spot on the surface of the polarizing plate 12. The laser beam changes to a steep light intensity distribution by focusing lightly. As described above, since the groove 13 has an inverted shape corresponding to the light intensity distribution, a narrower inclined region L1 can be obtained as a result. However, on the other hand, since the inside of the beam spot is intensively irradiated with a strong light intensity, the glass substrate 11 directly under the polarizing plate 12 is also thermally damaged. Thermal damage to the glass substrate 11 causes a decrease in the strength of the glass substrate 11 itself and greatly impairs the product value, so it must be avoided as much as possible.
In order to obtain a high-quality unit panel, it is desirable to make the width L1 of the inclined region as small as possible without causing thermal damage to the glass substrate, specifically, to set L1 to 50 μm or less.

このような課題に鑑み、上記した特許文献２では、ガラス基板と偏光板との間にＩＴＯ膜を介在させておいて、レーザビーム照射時にＩＴＯ膜で反射させてレーザビームによるガラス基板への熱的ダメージを抑えるようにしている。
しかし、ＩＴＯ膜を組み入れることになれば、液晶パネルの構成が複雑になるとともに、ＩＴＯ蒸着等の製造工程も増えてコスト高になるといった問題点があった。 In view of such a problem, in Patent Document 2 described above, an ITO film is interposed between the glass substrate and the polarizing plate, and the laser beam is reflected by the ITO film at the time of laser beam irradiation, and heat is applied to the glass substrate by the laser beam. I try to suppress damage.
However, if an ITO film is incorporated, the configuration of the liquid crystal panel becomes complicated, and the manufacturing process such as ITO deposition increases, resulting in high costs.

本発明者は、偏光板下にあるガラス基板に熱ダメージを与えないように、焦点から離れた位置のデフォーカスで加工するにあたって、レーザビームの周辺部分（スクライブラインの両脇または片側）を遮蔽し、偏光板への照射を防ぐことによって、偏光板の切断面の傾斜が緩やかになることを見出し、本発明を完成した。
本発明は、ＩＴＯ膜による反射層を形成する工程を省略するものでありながら、ガラス基板へのレーザビームによる熱的ダメージを抑制することができ、しかも、ガラス基板の表面に貼り付けられた偏光板等の樹脂板の傾斜領域の幅Ｌ１が急峻になるようにすることができるレーザビームによる樹脂板の切断方法を提供することを目的とする。 The present inventor shields the peripheral portion of the laser beam (on both sides or one side of the scribe line) when processing with defocus at a position away from the focus so as not to cause thermal damage to the glass substrate under the polarizing plate. In addition, the inventors found that the inclination of the cut surface of the polarizing plate becomes gentle by preventing the irradiation to the polarizing plate, and the present invention has been completed.
Although the present invention omits the step of forming a reflective layer with an ITO film, it can suppress thermal damage to the glass substrate due to the laser beam, and is also attached to the surface of the glass substrate. It is an object of the present invention to provide a method of cutting a resin plate with a laser beam that can make the width L1 of the inclined region of the resin plate such as a plate steep.

上記課題を解決するために本発明では次のような技術的手段を講じた。
すなわち、本発明の切断方法は、ガラス等の下地基板に貼り付けた樹脂板に対してレーザビームを切断予定ラインに沿って相対的に移動させながら照射して当該下地基板を切断することなく前記樹脂板を切断する方法である。
そして、前記樹脂板に照射されるレーザビームの光強度分布がビームの光軸中心付近の略一定強度のピーク部分とその外側で緩やかに減衰するテール部分とで照射されるように、前記レーザビームの焦点が前記樹脂板の表面から高さ方向にデフォーカスさせた状態で照射する。
さらに、前記樹脂板に照射されたレーザビームを遮蔽する遮蔽部材を、前記切断予定ラインを露出させた状態で該切断予定ラインに沿って隣接するように配置し、前記レーザビームのうち、前記ピーク部分のレーザビームを前記切断予定ラインに照射するとともに、前記テール部分のレーザビームを前記遮蔽部材でカットするようにした。 In order to solve the above problems, the present invention takes the following technical means.
That is, in the cutting method of the present invention, the resin substrate attached to the base substrate such as glass is irradiated while moving the laser beam relatively along the planned cutting line without cutting the base substrate. This is a method of cutting a resin plate.
The laser beam is irradiated so that the light intensity distribution of the laser beam irradiated on the resin plate is irradiated with a peak portion having a substantially constant intensity near the center of the optical axis of the beam and a tail portion that gently attenuates outside the laser beam. Is irradiated in a state where the focal point is defocused in the height direction from the surface of the resin plate.
Further, a shielding member that shields the laser beam applied to the resin plate is disposed adjacent to the planned cutting line in a state where the planned cutting line is exposed. The laser beam of the portion was irradiated to the cutting planned line, and the laser beam of the tail portion was cut by the shielding member .

ここで、レーザビームはＣＯ２レーザとするのが好ましい。 Here, the laser beam is preferably a CO 2 laser.

本発明によれば、樹脂板（偏光板）に照射されるレーザビームは、デフォーカス状態にしてあるので、最もビームが集光される位置に比べて相対的に光強度分布のピークは低くなる。そのため、偏光板を切断した際にガラス基板へ与える熱的ダメージを、最もビームが集光された位置での加工に比べて抑えることができる。一方、レーザビーム照射時に、レーザビームの光強度分布におけるテール部分が遮蔽板によってカットされるので、遮蔽板端部に沿って切り出された偏光板の切断端面が急激な傾斜面になり、垂直に近い切断端面をもった高品質の製品を得ることができるようになる。   According to the present invention, since the laser beam irradiated to the resin plate (polarizing plate) is in a defocused state, the peak of the light intensity distribution is relatively lower than the position where the beam is most focused. . Therefore, the thermal damage given to the glass substrate when the polarizing plate is cut can be suppressed as compared with the processing at the position where the beam is most condensed. On the other hand, when the laser beam is irradiated, the tail portion in the light intensity distribution of the laser beam is cut by the shielding plate, so that the cut end surface of the polarizing plate cut out along the edge of the shielding plate becomes an abruptly inclined surface and becomes vertical. It becomes possible to obtain a high-quality product having a close cut end face.

本発明に係る切断方法の一例を示す図。The figure which shows an example of the cutting method which concerns on this invention. 遮蔽板を使用しない場合の加工例を示す図。The figure which shows the process example when not using a shielding board. 図１で示した切断方法の工程を説明する図。The figure explaining the process of the cutting method shown in FIG. 本発明に係る切断方法の他の実施例を示す図。The figure which shows the other Example of the cutting method which concerns on this invention. 従来のレーザビーム照射方法により形成される溝の形態を示す図。The figure which shows the form of the groove | channel formed by the conventional laser beam irradiation method.

以下において、本発明の切断方法を図に基づいて詳細に説明する。
図１（ａ）は、単位パネルに切り出す前の液晶マザー基板Ａにおけるガラス基板１と、その上面に貼り付けられた偏光板２の断面図を示すもので、この液晶マザー基板ＡをレーザビームＢにより切断予定ラインＳから左右の単位パネルＡ１、Ａ１に分断する場合を例にして説明する。 Below, the cutting method of this invention is demonstrated in detail based on figures.
FIG. 1A shows a cross-sectional view of a glass substrate 1 in a liquid crystal mother substrate A before being cut into a unit panel and a polarizing plate 2 attached to the upper surface thereof. In the following, an example will be described in which the cutting scheduled line S is divided into left and right unit panels A1 and A1.

図１（ａ）に示すように、ガラス基板１への熱的ダメージを抑えるべくレーザビームＢの焦点Ｐを液晶マザー基板Ａの上方（あるいは下方）にずらしたデフォーカス状態となるよう、レーザ光学系（図示外）を切断予定ラインＳの上方に配置する。本実施例の場合、偏光板２はＰＥＴ樹脂などで形成されており、ガラス基板１の厚みが０．７ｍｍ程度、偏光板２の厚みが０．２ｍｍ程度で形成されている。また、デフォーカスされるレーザビームＢの焦点Ｐの位置、すなわち、焦点Ｐと偏光板２の上面との距離Ｈは約２ｍｍに設定される。
使用されるレーザビームＢとしては、偏光板２に対して吸収効率のよい波長、例えば９．４μｍや１０．６μｍの波長を有するＣＯ２レーザを用いるのがよい。
そして、図１（ｂ）に示すように、切断予定ラインＳの近傍部分を露出させた状態で、切断予定ラインＳに沿ってその両脇、または片側にレーザビームＢを遮蔽する遮蔽板（遮蔽部材）３を配置する。遮蔽板３には、ガラス板やシムテープなどＣＯ２レーザが透過しない材質を用いる。 As shown in FIG. 1A, the laser optical system is set so that the focal point P of the laser beam B is shifted above (or below) the liquid crystal mother substrate A so as to suppress thermal damage to the glass substrate 1. The system (not shown) is arranged above the planned cutting line S. In the case of the present embodiment, the polarizing plate 2 is formed of PET resin or the like, and the glass substrate 1 is formed with a thickness of about 0.7 mm and the polarizing plate 2 is formed with a thickness of about 0.2 mm. Further, the position of the focal point P of the laser beam B to be defocused, that is, the distance H between the focal point P and the upper surface of the polarizing plate 2 is set to about 2 mm.
As the laser beam B to be used, it is preferable to use a CO 2 laser having a wavelength with good absorption efficiency with respect to the polarizing plate 2, for example, a wavelength of 9.4 μm or 10.6 μm.
As shown in FIG. 1B, a shielding plate (shielding) that shields the laser beam B on both sides or one side along the planned cutting line S in a state where the vicinity of the planned cutting line S is exposed. Member) 3 is arranged. The shielding plate 3 is made of a material that does not transmit a CO 2 laser, such as a glass plate or shim tape.

説明の便宜上、遮蔽板３を用いないときの加工状態について簡単に説明する。図２はデフォーカス状態で照射されたレーザビームＢを、遮蔽板３を用いることなく直接偏光板２に照射したときの加工状態を示す図である。
偏光板２の上面に照射されるレーザビームＢは、焦点Ｐの位置よりも下側、つまりデフォーカスの状態であり、焦点Ｐよりもビーム径は広い。そのため、偏光板２上面における光強度分布は、図２（ｂ）のようにレーザビームＢの光軸中心をピーク部分とし、焦点Ｐに比べ（図５（ａ）参照）、外側周辺に向けて緩やかに減衰するテールを引いた山状の形態（緩やかなガウシアン分布）となる。このレーザビームＢを偏光板２に照射すると、偏光板２に形成される溝Ｃ１は、図２（ａ）に示すように、光強度分布を反転させた形状となる。したがって、切断予定ラインＳに沿って分断された後の偏光板２の切断面は、緩やかな傾斜面が形成されることになり偏光板２の分断品質としては好ましい状態ではない。分断後の製品形状にもよるが、一般にこの傾斜面は、限りなく垂直に近いほど高品位であるとされる。 For convenience of explanation, a processing state when the shielding plate 3 is not used will be briefly described. FIG. 2 is a diagram illustrating a processing state when the polarizing plate 2 is directly irradiated with the laser beam B irradiated in the defocused state without using the shielding plate 3.
The laser beam B irradiated on the upper surface of the polarizing plate 2 is below the position of the focal point P, that is, in a defocused state, and the beam diameter is wider than the focal point P. Therefore, the light intensity distribution on the upper surface of the polarizing plate 2 has a peak portion at the center of the optical axis of the laser beam B as shown in FIG. 2B, and is directed toward the outer periphery as compared with the focal point P (see FIG. 5A). It has a mountain shape with a slowly decaying tail (gradual Gaussian distribution). When the polarizing plate 2 is irradiated with the laser beam B, the groove C1 formed in the polarizing plate 2 has a shape in which the light intensity distribution is inverted as shown in FIG. Therefore, a gently inclined surface is formed on the cut surface of the polarizing plate 2 after being cut along the planned cutting line S, which is not a preferable state as the cutting quality of the polarizing plate 2. Although it depends on the shape of the product after the division, this inclined surface is generally considered to have a higher quality as it is almost as vertical.

本発明では、図３（ａ）に示すように、遮蔽板３（遮蔽部材）を、切断予定ラインＳの近傍部分を露出させた状態で切断予定ラインＳに沿って配置し、光強度分布における光軸中心近傍のピーク部分Ｂ１の光のみを切断予定ラインＳに照射するようにして、他のテール部分Ｂ２を遮蔽板３でカットするようにした。遮蔽板３の端面と切断予定ラインＳとの間隔Ｌは、１０〜２００μｍ程度、好ましくは２０〜１００μｍ程度とするのがよい。   In this invention, as shown to Fig.3 (a), the shielding board 3 (shielding member) is arrange | positioned along the scheduled cutting line S in the state which exposed the vicinity part of the scheduled cutting line S, and in light intensity distribution Only the light of the peak portion B1 near the center of the optical axis is irradiated to the cutting planned line S, and the other tail portion B2 is cut by the shielding plate 3. The distance L between the end face of the shielding plate 3 and the scheduled cutting line S is about 10 to 200 μm, preferably about 20 to 100 μm.

上記のようにしてレーザビームを切断予定ラインＳに沿って移動させることにより、図３（ｂ）に示すような溝Ｃを偏光板２に形成する。レーザビームは光強度分布におけるピーク部分Ｂ１のみが左右の遮蔽板３、３の間の切断予定ラインＳ部分に照射され、テール部分Ｂ２が遮蔽板３によってカットされる。切断予定ラインＳに照射されたレーザビームは、デフォーカス状態で照射されているので、焦点を偏光板２の上面に合わせて照射したときのように、集光された光強度のピークが高いレーザビームに比べて光強度が弱められているとともに略一定強度であり、ガラス基板１への熱的ダメージを抑えることができる。切断予定ラインＳではこのピーク部分Ｂ１のレーザビームが照射され、溝Ｃを溶融あるいはアブレーションによって形成することができる。
また、照射面では、レーザビームの光強度分布のテール部分Ｂ２が遮蔽板３によってカットされており、光強度が略一定であるピーク部分Ｂ１の光が偏光板２に照射されるので、照射部分は略均一な光エネルギーによる均一な加工（アブレーションまたは溶融）がなされるようになり、加工後の溝Ｃは図３（ｃ）に示すように左右側壁が切り立った急峻な傾斜面が形成される。したがって、次工程で切断予定ラインＳに沿ってガラス基板１を単位パネルＡ１、Ａ１に分断したときに、偏光板２の端面は急峻な傾斜面が形成され、斜面領域の幅Ｌ１を小さくすることができる。すなわち、本発明によれば、ガラス基板に対する熱的ダメージを抑え、偏光板には急峻な傾斜面を形成することができる。従来、これらは相反する条件（デフォーカスまたは集光）でしか達成することができなかったが、本発明によれば、両立できなかった加工結果を一度の走査で達成できるようになる。 By moving the laser beam along the planned cutting line S as described above, a groove C as shown in FIG. In the laser beam, only the peak portion B1 in the light intensity distribution is irradiated to the cutting planned line S portion between the left and right shielding plates 3 and 3, and the tail portion B2 is cut by the shielding plate 3. Since the laser beam irradiated to the cutting line S is irradiated in a defocused state, a laser with a high peak of the collected light intensity is emitted as when the focal point is irradiated to the upper surface of the polarizing plate 2. Compared with the beam, the light intensity is weakened and the intensity is substantially constant, and thermal damage to the glass substrate 1 can be suppressed. The cutting line S is irradiated with the laser beam of this peak portion B1, and the groove C can be formed by melting or ablation.
On the irradiation surface, the tail portion B2 of the light intensity distribution of the laser beam is cut by the shielding plate 3, and the light of the peak portion B1 whose light intensity is substantially constant is irradiated to the polarizing plate 2, so that the irradiation portion Is subjected to uniform processing (ablation or melting) with substantially uniform light energy, and the processed groove C has a steeply inclined surface with the left and right side walls standing up as shown in FIG. . Therefore, when the glass substrate 1 is divided into unit panels A1 and A1 along the scheduled cutting line S in the next step, a steep inclined surface is formed on the end surface of the polarizing plate 2, and the width L1 of the inclined region is reduced. Can do. That is, according to the present invention, thermal damage to the glass substrate can be suppressed, and a steep inclined surface can be formed on the polarizing plate. Conventionally, these could be achieved only under contradictory conditions (defocusing or condensing). However, according to the present invention, it is possible to achieve processing results that could not be achieved in one scan.

ここで、本発明を用いた具体的な加工例について説明する。ガラス基板１の板厚が０．７ｍｍ、樹脂製の偏光板２の板厚が０．２ｍｍの液晶マザー基板に、板厚が０．５ｍｍの遮蔽板３を取り付け、遮蔽板３の端面と切断予定ラインＳとの間隔Ｌを５０μｍとし、レーザの焦点Ｐと偏光板２の上面とのデフォーカスの距離Ｈを２ｍｍに設定し、ＣＯ２レーザで偏光板２をカットした。
その結果、傾斜領域の幅Ｌ１を目標の５０μｍよりも小さい３８μｍまで改善することができた。
なお、比較のため、遮蔽板３を取り付けずに同様のレーザ照射を行った結果、傾斜領域の幅Ｌ１は８０μｍ以上であった。 Here, a specific processing example using the present invention will be described. A shielding plate 3 having a thickness of 0.5 mm is attached to a liquid crystal mother substrate in which the thickness of the glass substrate 1 is 0.7 mm and the thickness of the resin polarizing plate 2 is 0.2 mm, and the end surface of the shielding plate 3 is cut. The distance L from the planned line S was set to 50 μm, the defocus distance H between the focal point P of the laser and the upper surface of the polarizing plate 2 was set to 2 mm, and the polarizing plate 2 was cut with a CO 2 laser.
As a result, the width L1 of the inclined region could be improved to 38 μm, which is smaller than the target 50 μm.
For comparison, as a result of performing the same laser irradiation without attaching the shielding plate 3, the width L1 of the inclined region was 80 μm or more.

次に、第二の実施形態について説明する。図４は、ガラス基板１の端面からオーバーハングさせた状態で貼り付けられた偏光板２を切断する場合を示す。
この場合は、図４（ａ）に示すように、偏光板２から切断される端材部分２ａは破棄されるものであるから、遮蔽板３は、ガラス基板１の端面に沿った切断予定ラインＳのガラス基板１側のみに配置する。そして上記実施例と同様に、デフォーカス状態でレーザビームＢを切断予定ラインＳに沿って偏光板２上に照射する。すると、偏光板２に形成される溝Ｃ’の側壁は、図４（ｂ）に示すように、遮蔽板３を載置した側では、先の実施例と同様に熱強度分布における裾野部分Ｂ２が遮蔽板３でカットされるので急峻な傾斜面となり、反対側は緩やかな傾斜面となる。この緩やかな傾斜面の側の偏光板２は端材２ａとして破棄される。
これにより、図４（ｃ）に示すように、ガラス基板１に貼り付けられた偏光板２の切断端面を、ガラス基板１の端面と一致させた状態で切断でき、かつ、偏光板２の切断端面の傾斜領域の幅Ｌ１を小さくすることができる。 Next, a second embodiment will be described. FIG. 4 shows a case where the polarizing plate 2 attached in an overhanging state from the end face of the glass substrate 1 is cut.
In this case, as shown in FIG. 4 (a), the end material portion 2 a cut from the polarizing plate 2 is discarded, so that the shielding plate 3 is a line to be cut along the end surface of the glass substrate 1. It arrange | positions only to the glass substrate 1 side of S. In the same manner as in the above embodiment, the laser beam B is irradiated onto the polarizing plate 2 along the planned cutting line S in the defocused state. Then, as shown in FIG. 4 (b), the side wall of the groove C ′ formed in the polarizing plate 2 is the base portion B2 in the heat intensity distribution on the side where the shielding plate 3 is placed, as in the previous embodiment. Is cut by the shielding plate 3, so that it becomes a steep inclined surface, and the opposite side becomes a gentle inclined surface. The polarizing plate 2 on the gentle inclined surface side is discarded as the end material 2a.
As a result, as shown in FIG. 4C, the cut end face of the polarizing plate 2 attached to the glass substrate 1 can be cut in a state where it matches the end face of the glass substrate 1, and the polarizing plate 2 is cut. The width L1 of the inclined area of the end face can be reduced.

以上、本発明の代表的な実施例について説明したが、本発明は必ずしも上記の実施形態に特定されるものでない。例えば、切断すべき樹脂板として、液晶表示パネルのガラス基板に貼り付けられた偏光板を示したが、下地となる基板がガラス以外の基板であっても、レーザビームが照射されたときに熱的なダメージを受けるものについては本発明が利用できる。その他、本発明では、その目的を達成し、請求の範囲を逸脱しない範囲内で適宜修正、変更することが可能である。   As mentioned above, although the typical Example of this invention was described, this invention is not necessarily specified to said embodiment. For example, a polarizing plate attached to a glass substrate of a liquid crystal display panel is shown as a resin plate to be cut. However, even if the underlying substrate is a substrate other than glass, it is heated when irradiated with a laser beam. The present invention can be used for those that are subject to undue damage. In addition, in the present invention, the object can be achieved and modified and changed as appropriate without departing from the scope of the claims.

本発明は、液晶表示パネルの偏光板のようなガラス基板に貼り付けられた樹脂板を切断する際に利用される。   The present invention is used when cutting a resin plate attached to a glass substrate such as a polarizing plate of a liquid crystal display panel.

Ａ 液晶マザー基板
Ａ１ 単位パネル
Ｂ レーザビーム
Ｃ 溝
Ｐ レーザビームの焦点
１ ガラス基板
２ 偏光板（樹脂板）
３ 遮蔽板 A Liquid crystal mother substrate A1 Unit panel B Laser beam C Groove P Focus of laser beam 1 Glass substrate 2 Polarizing plate (resin plate)
3 Shield plate

Claims (3)

下地基板に貼り付けた樹脂板に対してレーザビームを切断予定ラインに沿って相対的に移動させながら照射して当該下地基板を切断することなく前記樹脂板を切断する方法であって、
前記樹脂板に照射されるレーザビームの光強度分布がビームの光軸中心付近の略一定強度のピーク部分とその外側で緩やかに減衰するテール部分とで照射されるように、前記レーザビームの焦点が前記樹脂板の表面から高さ方向にデフォーカスさせた状態で照射し、
前記樹脂板に照射されたレーザビームを遮蔽する遮蔽部材を、前記切断予定ラインを露出させた状態で当該切断予定ラインに沿って隣接するように配置し、
前記レーザビームのうち、前記ピーク部分のレーザビームを前記切断予定ラインに照射するとともに、前記テール部分のレーザビームを前記遮蔽部材でカットするようにしたことを特徴とする樹脂板の切断方法。 A method of cutting the resin plate without cutting the base substrate by irradiating the resin plate affixed to the base substrate while moving the laser beam relatively along the planned cutting line,
The focus of the laser beam is such that the light intensity distribution of the laser beam irradiated on the resin plate is irradiated with a peak portion having a substantially constant intensity near the center of the optical axis of the beam and a tail portion that gently attenuates outside the beam portion. Is irradiated in a state defocused in the height direction from the surface of the resin plate,
A shielding member that shields the laser beam applied to the resin plate is disposed so as to be adjacent along the planned cutting line in a state where the planned cutting line is exposed,
A method for cutting a resin plate, comprising: irradiating the laser beam of the peak portion of the laser beam onto the planned cutting line, and cutting the laser beam of the tail portion with the shielding member . 前記レーザビームがＣＯ２レーザである請求項１に記載の樹脂板の切断方法。 The method for cutting a resin plate according to claim 1, wherein the laser beam is a CO 2 laser. 前記樹脂板が液晶表示パネルのガラス基板に貼り付けられた偏光板である請求項１または請求項２のいずれかに記載の樹脂板の切断方法。 The method for cutting a resin plate according to claim 1, wherein the resin plate is a polarizing plate attached to a glass substrate of a liquid crystal display panel.
JP2013106047A 2013-05-20 2013-05-20 Cutting method of resin plate attached to glass substrate Expired - Fee Related JP6166587B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013106047A JP6166587B2 (en) 2013-05-20 2013-05-20 Cutting method of resin plate attached to glass substrate
TW103100795A TWI581885B (en) 2013-05-20 2014-01-09 A method of cutting a resin plate attached to a glass substrate
KR20140010405A KR20140136861A (en) 2013-05-20 2014-01-28 Method for cutting resin sheet bonded to glass substrate
CN201410144034.8A CN104175002A (en) 2013-05-20 2014-04-10 Cutting method of resign board pasted at glass substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013106047A JP6166587B2 (en) 2013-05-20 2013-05-20 Cutting method of resin plate attached to glass substrate

Publications (2)

Publication Number Publication Date
JP2014226671A JP2014226671A (en) 2014-12-08
JP6166587B2 true JP6166587B2 (en) 2017-07-19

Family

ID=51956499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013106047A Expired - Fee Related JP6166587B2 (en) 2013-05-20 2013-05-20 Cutting method of resin plate attached to glass substrate

Country Status (4)

Country Link
JP (1) JP6166587B2 (en)
KR (1) KR20140136861A (en)
CN (1) CN104175002A (en)
TW (1) TWI581885B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102416550B1 (en) * 2017-04-28 2022-07-05 삼성디스플레이 주식회사 Polarizing layer, display device with the same, and fabricating method for the display device
WO2018235462A1 (en) * 2017-06-23 2018-12-27 日東電工株式会社 Manufacturing method for image display device, and image display device obtained according to said manufacturing method
KR102286476B1 (en) * 2019-05-23 2021-08-06 코닝 인코포레이티드 Glass substrate cutting method and light guide plate manufacturing method

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6604805A (en) * 1966-04-08 1967-10-09
US3742182A (en) * 1971-12-27 1973-06-26 Coherent Radiation Method for scanning mask forming holes with a laser beam
JPH01321087A (en) * 1988-06-21 1989-12-27 Matsushita Electric Ind Co Ltd Laser beam machining method and its machine for organic film
JPH04251688A (en) * 1991-01-23 1992-09-08 Fanuc Ltd Laser beam machine
JPH1158748A (en) * 1997-08-12 1999-03-02 Brother Ind Ltd Method and apparatus for manufacturing ink jet head
KR20010042981A (en) * 1999-02-25 2001-05-25 야스카와 히데아키 Method For Machining Work By Laser Beam
US6278078B1 (en) * 1999-06-02 2001-08-21 Lockheed Martin Corporation Laser soldering method
JP2002023151A (en) * 2000-07-12 2002-01-23 Toshiba Corp Method and device for manufacture of liquid crystal display device having polarizing plate
JP4093891B2 (en) * 2002-04-02 2008-06-04 シャープ株式会社 Liquid crystal panel, liquid crystal panel manufacturing method and liquid crystal panel manufacturing apparatus
JP2004314155A (en) * 2003-04-18 2004-11-11 Murata Mfg Co Ltd Laser beam machining method
JP2005138126A (en) * 2003-11-05 2005-06-02 Mitsubishi Heavy Ind Ltd Welding system
JP2005152966A (en) * 2003-11-27 2005-06-16 Fuji Photo Film Co Ltd Laser beam machining method, and blank transfer method
US8035901B2 (en) * 2008-04-30 2011-10-11 Corning Incorporated Laser scoring with curved trajectory
JP2010050175A (en) * 2008-08-20 2010-03-04 Disco Abrasive Syst Ltd Laser processing method and laser processing device
JP2010105016A (en) * 2008-10-30 2010-05-13 Toray Advanced Film Co Ltd Laser beam machining method and apparatus
CN104722928A (en) * 2009-12-07 2015-06-24 Ipg微系统有限公司 Laser machining and scribing systems and methods
JP5240267B2 (en) * 2010-09-30 2013-07-17 三星ダイヤモンド工業株式会社 Laser processing apparatus, workpiece processing method, and workpiece dividing method

Also Published As

Publication number Publication date
TW201444630A (en) 2014-12-01
CN104175002A (en) 2014-12-03
KR20140136861A (en) 2014-12-01
TWI581885B (en) 2017-05-11
JP2014226671A (en) 2014-12-08

Similar Documents

Publication Publication Date Title
WO2014030519A1 (en) Workpiece cutting method
JP5632751B2 (en) Processing object cutting method
JP5597052B2 (en) Laser processing method
JP5597051B2 (en) Laser processing method
TWI552822B (en) Laser processing method
JP5879106B2 (en) Method for scribing a brittle material substrate
KR102128416B1 (en) Laser machining device and laser machining method
JP5030871B2 (en) Resin welding method
CN103567630A (en) Laminated-substrate processing method and processing apparatus
JP6166587B2 (en) Cutting method of resin plate attached to glass substrate
US20150059411A1 (en) Method of separating a glass sheet from a carrier
US9061468B2 (en) Welding method and welding apparatus
JP2014041927A (en) Method for cutting workpiece
TW201529503A (en) Chamfering method of glass substrate and laser processing device
JP5030872B2 (en) Resin welding method
WO2015098388A1 (en) Processing device
US11123821B2 (en) Laser cutting method
JP5579532B2 (en) Manufacturing method of resin molded products
JP2011017810A (en) Bright spot erasing device and bright spot erasing method
JP2005028784A (en) Laser welding method
WO2011074072A1 (en) Method of welding resin
JP6989549B2 (en) Manufacturing method of the joint
JP5264266B2 (en) Glass welding method
JP2012000622A (en) Laser scribing method for brittle material substrate
KR20130076440A (en) Laser cutting apparatus and laser cutting method

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160419

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170223

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170307

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170420

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170530

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170623

R150 Certificate of patent or registration of utility model

Ref document number: 6166587

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees