CN117373966A - Chip frock dyestripping device and chip packaging system - Google Patents
Chip frock dyestripping device and chip packaging system Download PDFInfo
- Publication number
- CN117373966A CN117373966A CN202311678609.XA CN202311678609A CN117373966A CN 117373966 A CN117373966 A CN 117373966A CN 202311678609 A CN202311678609 A CN 202311678609A CN 117373966 A CN117373966 A CN 117373966A
- Authority
- CN
- China
- Prior art keywords
- film
- chip
- blanking
- film tearing
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 238000007789 sealing Methods 0.000 claims abstract description 72
- 239000000463 material Substances 0.000 claims abstract description 62
- 238000000926 separation method Methods 0.000 claims abstract description 38
- 239000012528 membrane Substances 0.000 claims description 61
- 230000006835 compression Effects 0.000 claims description 24
- 238000007906 compression Methods 0.000 claims description 24
- 238000005192 partition Methods 0.000 claims description 20
- 230000005540 biological transmission Effects 0.000 claims description 4
- 230000000452 restraining effect Effects 0.000 abstract description 6
- 241000252254 Catostomidae Species 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention relates to the technical field of chip packaging, in particular to a chip tooling film tearing device and a chip packaging system, comprising a blanking unit, a film separation unit and a film tearing moving unit, wherein the blanking unit is provided with a blanking table for supporting a bottom plate of a tooling, the film separation unit is provided with a sealing seat, a pressing rod, a film tearing component and a film tearing sucker, the film separation unit is driven by the film tearing moving unit to move downwards integrally, so that the sealing seat presses a film material on the bottom plate to form a sealing cavity, then air is filled into the sealing cavity, the film material in the restraining cavity moves upwards to bulge, and the pressing rod prevents the chip and the film material from moving upwards together, so that the safe and rapid separation of the film material and the chip is realized, the restraining cavity can limit the bulged film material, the situation that part of the chip cannot be smoothly separated from the film material due to local excessive bulge is avoided, and the film tearing sucker capable of actively descending can be firmly adhered to the bulged film material in a downwards pressing manner, and stable film tearing sucker can be ensured.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a chip tooling film tearing device and a chip packaging system comprising the chip tooling film tearing device.
Background
At present, a chip is usually placed on a tool in advance in the packaging process, and then is transferred together with the tool among the working procedures of preheating, sintering, cooling and the like; the tooling mainly comprises a bottom plate, a cover plate and the like, wherein the chip is placed on the bottom plate, the film material covers the chip, and finally the cover plate presses the film material on the bottom plate, so that the chip is loaded in the tooling;
after the chip packaging is completed, the cover plate needs to be detached firstly, and then the membrane material is separated from the bottom plate and the chips on the bottom plate, however, when the membrane material is separated from the bottom plate of the tool, the membrane material is easy to adhere to the chips, so that the membrane material is difficult to tear off smoothly.
Disclosure of Invention
The invention aims to solve the technical problems that: in order to solve the problem that in the prior art, when a film material is separated from a bottom plate of a tool, the film material is easy to adhere to a chip, so that the film material is difficult to tear off smoothly, the chip tool film tearing device and a chip packaging system comprising the chip tool film tearing device are provided.
The technical scheme adopted for solving the technical problems is as follows: a die tooling dyestripping device, comprising:
the blanking unit is provided with a blanking table for supporting a bottom plate of the tool, the bottom plate is provided with an air tap, the upper surface of the bottom plate is covered with a film material, and the chip is positioned between the film material and the upper surface of the bottom plate;
the membrane separation unit is provided with a sealing seat, a compression rod, a membrane tearing assembly and a membrane tearing sucker, wherein a constraint cavity with a downward opening is arranged on the lower end surface of the sealing seat, a plurality of compression rods are distributed in the constraint cavity, and the membrane tearing assembly is arranged on the sealing seat and used for driving the membrane tearing sucker to lift;
the film tearing moving unit is used for driving the film separating unit to downwards displace to press the film material, so that a sealing cavity is formed between the lower surface of the part of the film material in the constraint cavity and the bottom plate, and the upper surface of the chip is provided with a limiting area and a separating area; the air tap is used for inflating the sealing cavity to enable the membrane material to swell and separate from the separation area of the chip, and the lower end part of the pressure rod is used for pressing the part of the membrane material opposite to the limiting area; the film tearing assembly is further configured to drive the film tearing sucker to descend so as to suck the upper surface of the part, separated from the separation area, of the film material in the constraint cavity.
Further, the compression bar is arranged on the sealing seat in an up-and-down elastic telescopic way through the compression bar elastic element.
Further, a partition plate is fixed in the sealing seat, the lower surface of the partition plate is formed into the inner wall of the upper end of the constraint cavity, the pressure rod downwards passes through the partition plate, a protruding part positioned above the partition plate is arranged on the pressure rod, a pressure rod seat is fixed on the partition plate, a pressure rod elastic element is arranged between the protruding part and the pressure rod seat, one end of the pressure rod elastic element is propped against the pressure rod seat, the other end of the pressure rod elastic element is propped against the protruding part, and the protruding part is propped against the partition plate.
Further, the lower end part of the compression bar is hemispherical, spherical crown-shaped or spherical segment-shaped.
Further, each chip corresponds to a pressing rod, the lower end part of the pressing rod is opposite to the limiting area of the corresponding chip, and the limiting area is positioned in the middle of the upper surface of the chip.
Further, the lower terminal surface of sealing seat is equipped with the dyestripping sealing washer, the dyestripping sealing washer downwards protrudes in the lower terminal surface of sealing seat, the restriction chamber is located the dyestripping sealing washer.
Further, the blanking table is provided with a first blanking clamp plate, a second blanking clamp plate and a blanking power assembly, the first blanking clamp plate and the second blanking clamp plate are movably arranged on the blanking table, a bottom plate placed on the blanking table is located between the first blanking clamp plate and the second blanking clamp plate, and the blanking power assembly is used for driving the first blanking clamp plate and the second blanking clamp plate to be close to or far away from each other.
Further, a first clamping groove is formed in one side, close to the second blanking clamping plate, of the first blanking clamping plate, a second clamping groove is formed in one side, close to the first blanking clamping plate, of the second blanking clamping plate, the first clamping groove is used for allowing one end of a bottom plate to be inserted, and the second clamping groove is used for allowing the other end of the bottom plate to be inserted.
Further, the device also comprises a cover separation unit, wherein a cover plate is pressed on the membrane material of the bottom plate, and the upper surface of the bottom plate downwards penetrates through a push rod hole which is opposite to the cover plate;
the cover separation unit is provided with a cover suction seat and a cover separation sucker, the film tearing moving unit is also used for driving the cover suction seat to move, and the cover separation sucker is fixed on the cover suction seat and used for adsorbing a cover plate on a film material;
the blanking table is provided with a push rod, the push rod is in transmission connection with a jacking power assembly, and the jacking power assembly is used for driving the push rod to upwards pass through the push rod hole, so that the push rod upwards pushes the cover plate.
The invention also provides a chip packaging system which comprises the chip tooling film tearing device.
The beneficial effects of the invention are as follows: according to the film tearing device for the chip tool, the film tearing moving unit is used for driving the film separating unit to move downwards integrally, so that the sealing seat presses the film material on the bottom plate to form the sealing cavity, then gas is filled into the sealing cavity, the film material in the restraining cavity moves upwards to bulge, and the chip and the film material are prevented from moving upwards together by the pressing rod, so that the problem that the film material is easy to adhere to the chip when the film material is separated from the bottom plate of the tool is solved, the restraining cavity can limit the bulged film material, the situation that part of chips cannot be smoothly separated from the film material due to local excessive bulge of the film material is avoided, and the film tearing sucker capable of actively descending can be tightly attached to the bulged film material in a downwards pressing mode, so that the film tearing sucker can be ensured to stably and firmly adsorb the film material.
Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments of the present application, which proceeds with reference to the accompanying drawings.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic diagram of a die tooling film tearing device of the present invention;
FIG. 2 is a three-dimensional schematic view of the membrane separation unit and the cover separation unit mounted on the membrane-tearing movement unit;
FIG. 3 is a three-dimensional schematic of one side of a membrane separation unit;
FIG. 4 is a three-dimensional schematic of the other side of the membrane separation unit;
FIG. 5 is a schematic diagram of a front view of a membrane separation unit;
FIG. 6 is a schematic cross-sectional view of A-A of FIG. 5;
FIG. 7 is a schematic three-dimensional view of one side of the plunger and tear film suction cup cooperation;
FIG. 8 is another three-dimensional schematic view of the plunger and tear film suction cup cooperation;
FIG. 9 is a three-dimensional schematic of a tooling placed on a blanking unit;
FIG. 10 is a three-dimensional schematic of a blanking unit;
FIG. 11 is a schematic diagram of a membrane separation unit pressing a tooling of a blanking unit to be separated;
FIG. 12 is an enlarged partial schematic view of B in FIG. 11;
FIG. 13 is a schematic cross-sectional view of the tooling;
FIG. 14 is an enlarged partial schematic view of C in FIG. 13;
fig. 15 is a three-dimensional schematic of a base plate.
In the figure: 1. the blanking unit, 11, the blanking table, 12, the first blanking clamp plate, 121, the first clamping groove, 13, the second blanking clamp plate, 131, the second clamping groove, 14, the blanking power component, 15, the ejector rod, 16, the jacking power component, 17 and the jacking plate;
2. the membrane separation unit 21, the sealing seat 211, the constraint cavity 212, the partition plate 22, the compression bar 221, the protruding part 23, the membrane tearing assembly 24, the membrane tearing sucker 25, the compression bar elastic element 26, the membrane tearing sealing ring 27, the compression bar seat 28 and the membrane tearing plate;
3. a film tearing moving unit, 31, a Y-axis assembly, 32 and a Z-axis assembly;
4. a cover separating unit 41, a cover sucking seat 42 and a cover separating sucker;
5. the device comprises a tool, 51, a bottom plate, 511, a mandril hole, 52, a membrane material, 53, a cover plate, 54, an air tap, 55 and a sealing cavity;
6. and a chip.
Detailed Description
The invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the invention and therefore show only those features which are relevant to the invention, and orientation and reference (e.g., up, down, left, right, etc.) may be used solely to aid in the description of the features in the drawings. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the claimed subject matter is defined only by the appended claims and equivalents thereof.
As shown in fig. 1-15, a die tooling film tearing device comprises a blanking unit 1, a film separation unit 2 and a film tearing moving unit 3:
the blanking unit 1 is provided with a blanking table 11 for supporting a bottom plate 51 of the tool 5, the bottom plate 51 is provided with an air tap 54, the upper surface of the bottom plate 51 is covered with a film 52, and the chip 6 is positioned between the film 52 and the upper surface of the bottom plate 51;
the membrane separation unit 2 is provided with a sealing seat 21, a compression rod 22, a membrane tearing assembly 23 and a membrane tearing sucker 24, wherein a constraint cavity 211 with a downward opening is arranged on the lower end surface of the sealing seat 21, a plurality of compression rods 22 are distributed in the constraint cavity 211, and the membrane tearing assembly 23 is arranged on the sealing seat 21 and used for driving the membrane tearing sucker 24 to lift; the film tearing suckers 24 can be communicated with a vacuum pump, a vacuum generator and other vacuumizing devices to realize vacuum adsorption of the film material 52, a plurality of film tearing suckers 24 can be fixedly arranged on the film tearing plate 28, and the arrangement mode of the film tearing suckers 24 on the film tearing plate 28 can be flexibly adjusted according to actual needs, for example, two ends of the film tearing plate 28 are respectively provided with a row, and each row is provided with three or more film tearing suckers 24 arranged at intervals; the film tearing assembly 23 is in transmission connection with the film tearing plate 28, and when the film tearing assembly 23 drives the film tearing plate 28 to lift, all film tearing suckers 24 lift synchronously along with the film tearing plate 28; the film tearing assembly 23 may be, but not limited to, a cylinder, an electric push rod, a linear module, etc., taking the example of the film tearing assembly 23 as the cylinder, the piston rod of the cylinder as the film tearing assembly 23 faces downwards and is fixedly connected with the film tearing plate 28, and the cylinder body as the cylinder of the film tearing assembly 23 may be fixed on the sealing seat 21;
the film tearing moving unit 3 is used for driving the film separating unit 2 to downwards move to press the film 52, so that a sealing cavity 55 is formed between the bottom surface of the part of the film 52 in the constraint cavity 211 and the bottom plate 51, the upper surface of the chip 6 is provided with a limiting area and a separating area, and the area of the limiting area is smaller than or far smaller than that of the separating area; the air tap 54 is used for inflating the sealing cavity 55, so that the membrane material 52 bulges and is separated from the separation area of the chip 6, an air source can inflate air into the sealing cavity 55 through the air tap 54, an inflation connector can also be arranged on the blanking table 11 and is communicated with the air source, when the tool 5 is placed on the blanking table 11, the inflation connector is communicated with the air tap 54, and at the moment, the air source can input air into the sealing cavity 55; the lower end part of the pressing rod 22 is used for pressing the part of the membrane 52 opposite to the limiting area; the film tearing assembly 23 is further configured to drive the film tearing chuck 24 to descend so as to suck the upper surface of the separation area of the film 52 in the constraint cavity 211.
According to the chip tooling film tearing device, the film tearing moving unit 3 is utilized to drive the film separating unit 2 to move downwards integrally, the sealing seat 21 is used for pressing the film 52 on the bottom plate 51 to form the sealing cavity 55, then gas is filled into the sealing cavity 55, the film 52 in the restraining cavity 211 can move upwards to bulge, the pressing rod 22 is used for pressing the part, opposite to the limiting area of the chip 6, of the film 52, the chip 6 and the film 52 are prevented from moving upwards, so that the film 52 and the chip 6 can be separated safely and quickly, the restraining cavity 211 can limit the bulge film 52, the situation that part of the chip 6 cannot be separated from the film 52 smoothly due to the unlimited upwards and upwards extension of the film 52 is avoided, the film tearing sucker 24 capable of actively descending can be attached to the bulge film 52 in a downwards pressing mode, the film 52 is ensured to be stably and firmly adsorbed, and finally the film sucker 24 is driven to move by the film moving unit 3 and/or the film tearing assembly 23, and the film 52 can be separated completely, and the film 52 can be stacked completely.
It should be noted that, after the separation of the membrane 52 from the separation region of the chip 6, a larger gap is formed between the membrane and the separation region, so that the adhesion between the chip 6 and the membrane 52 is reduced, and at this time, the membrane 52 is completely separated from the chip 6 after further upward movement.
In some examples, the compression bar 22 is elastically telescopic up and down mounted on the sealing seat 21 by a compression bar elastic element 25; when the sealing cavity 55 is inflated, the elastically stretchable compression bar 22 can buffer the membrane material 52, so that the membrane material 52 is prevented from being damaged due to rigid contact with the compression bar 22; and the film tearing assembly 23 can also drive the film 52 to move upwards, and the film 52 drives the pressing rod 22 upwards, so that the pressing rod 22 overcomes the elasticity of the pressing rod elastic element 25 to move upwards, and the limit area of the film 52 and the chip 6 is completely separated.
In some examples, a partition plate 212 is fixed in the seal seat 21, a lower surface of the partition plate 212 is formed as an upper end inner wall of the constraint cavity 211, the pressure bar 22 passes through the partition plate 212 downward, only a lower end of the pressure bar 22 is located in the constraint cavity 211, the pressure bar 22 is provided with a protruding portion 221 located above the partition plate 212, the pressure bar 22 can be slidably connected with the partition plate 212 through a linear bearing, flexibility of up-and-down movement of the pressure bar 22 is improved, a pressure bar seat 27 is fixed on the partition plate 212, one end of the pressure bar elastic element 25 abuts against the pressure bar seat 27, the other end abuts against the protruding portion 221, the pressure bar elastic element 25 can be, but is not limited to, a spring, the spring can be sleeved outside the pressure bar 22, the protruding portion 221 abuts against the partition plate 212, and the pressure bar 22 is kept at a limit position of downward movement by the pressure bar elastic element 25 in a normal state; the layout design can improve the compactness of the structure.
In some examples, the lower end of the compression bar 22 is hemispherical, spherical crown-shaped, or spherical segment-shaped: thus, the limit area corresponds to a point, which corresponds to the point contact between the pressing rod 22 and the chip 6 through the film 52, so as to protect the chip 6.
In some examples, each chip 6 corresponds to one compression bar 22, and the lower end part of the compression bar 22 is opposite to the corresponding limit area of the chip 6, and the limit area is positioned in the middle of the upper surface of the chip 6; therefore, when the air inflation is realized, the area of the membrane material 52 corresponding to the chip 6 can be displaced upwards around by taking the limiting area as the center, and the adhesive force between the membrane material 52 and the chip 6 is weakened to the greatest extent.
In some examples, the lower end surface of the sealing seat 21 is provided with a film tearing sealing ring 26, the film tearing sealing ring 26 protrudes downwards from the lower end surface of the sealing seat 21, the constraint cavity 211 is located in the film tearing sealing ring 26, the cross section of the film tearing sealing ring 26 can be, but is not limited to, circular or square, the lower end surface of the sealing seat 21 can be provided with a mounting groove, the film tearing sealing ring 26 is embedded in the mounting groove, and the film tearing sealing ring 26 is fixed on the sealing seat 21; the sealing seat 21 can only rely on the contact of the film tearing sealing ring 26 and the film 52, the pressure-bearing area of the film 52 is reduced, the film 52 is prevented from generating larger adhesion force between the part of the sealing seat 21 in pressure connection and the bottom plate 51 of the tool 5, the film tearing sealing ring 26 is also beneficial to improving the sealing performance between the film 52 and the bottom plate 51, and the film 52 is ensured to be smoothly separated.
In some examples, the film tearing moving unit 3 may specifically include a Y-axis assembly 31 and a Z-axis assembly 32, and the Y-axis assembly 31 and the Z-axis assembly 32 may be, but are not limited to, a cylinder, an electric push rod, a linear module, or the like; the output end of the Y-axis component 31 is connected with the Z-axis component 32 and is used for driving the Z-axis component 32 to translate along the Y-axis direction; the output end of the Z-axis component 32 is fixedly connected with the sealing seat 21 and is used for driving the sealing seat 21 to move up and down along the Z-axis direction, and the X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to each other; the film tearing moving unit 3 may be replaced by a robot in the prior art, which is not limited in this embodiment.
In some examples, the blanking table 11 has a first blanking clamp plate 12, a second blanking clamp plate 13, and a blanking power assembly 14, where the first blanking clamp plate 12 and the second blanking clamp plate 13 are movably installed on the blanking table 11, specifically, the first blanking clamp plate 12 and the second blanking clamp plate 13 may be movably installed on the blanking table 11 along the X-axis direction through linear guide rails, a bottom plate 51 placed on the blanking table 11 is located between the first blanking clamp plate 12 and the second blanking clamp plate 13, and a positioning pin may be used on the blanking table 11 to position the bottom plate 51 in a plane, and the blanking power assembly 14 is used to drive the first blanking clamp plate 12 and the second blanking clamp plate 13 to close to or separate from each other; the blanking power assembly 14 may be, but is not limited to, two cylinders, and the first blanking clamp plate 12 and the second blanking clamp plate 13 are respectively driven by one cylinder independently; it should be noted that, the blanking power assembly 14 may also adopt a pneumatic finger, the first blanking clamp plate 12 and the second blanking clamp plate 13 are respectively and fixedly connected with two clamping jaws of the pneumatic finger, and the pneumatic finger drives the first blanking clamp plate 12 and the second blanking clamp plate 13 to move synchronously;
in the process of driving the film tearing sucker 24 to move by the film tearing moving unit 3, the first blanking clamping plate 12 and the second blanking clamping plate 13 clamp and fix the bottom plate 51 on the blanking table 11, and the film 52 can be forcedly separated from the bottom plate 51, so that the damage to the chip 6 on the bottom plate 51 caused by shaking of the bottom plate 51 can be avoided.
In some examples, a first clamping groove 121 is formed on a side, close to the second blanking clamping plate 13, of the first blanking clamping plate 12, a second clamping groove 131 is formed on a side, close to the first blanking clamping plate 12, of the second blanking clamping plate 13, the first clamping groove 121 is used for inserting one end of the bottom plate 51, and the second clamping groove 131 is used for inserting the other end of the bottom plate 51;
when the bottom plate 51 is clamped by the first blanking clamping plate 12 and the second blanking clamping plate 13, two ends of the bottom plate 51 are respectively clamped into the first clamping groove 121 and the second clamping groove 131, so that the bottom plate 51 is prevented from moving upwards along with the film 52, the bottom plate 51 can be stably clamped by small clamping force, and the bottom plate 51 is prevented from being clamped and deformed due to overlarge clamping force.
In some examples, the cover separating unit 4 further comprises a cover plate 53 pressed on the film 52 of the bottom plate 51, and a top rod hole 511 is penetrated downwards through the upper surface of the bottom plate 51, and the top rod hole 511 is opposite to the cover plate 53; in the packaging process, the cover plate 53 presses the membrane material 52 on the bottom plate 51 in a magnetic adsorption mode by adopting a magnetic piece, so that a sealing cavity 55 is formed between the membrane material 52 and the bottom plate 51, the chip 6 is positioned in the sealing cavity 55, after the packaging is finished, the cover plate 53 is removed, the membrane material 52 is removed, and finally the chip 6 on the bottom plate 51 is exposed;
the cover separating unit 4 is provided with a cover sucking seat 41 and a cover separating sucker 42; the cover separation sucker 42 can be communicated with a vacuum pumping device such as a vacuum pump or a vacuum generator, and the cover plate 53 is adsorbed by vacuum; the film tearing moving unit 3 is further configured to drive the cover sucking seat 41 to move, specifically, two Z-axis assemblies 32 of the film tearing moving unit 3 may be provided, an output end of one Z-axis assembly 32 is fixedly connected with the sealing seat 21, so as to drive the sealing seat 21 to move up and down along the Z-axis direction, an output end of the other Z-axis assembly 32 is fixedly connected with the cover sucking seat 41, so as to drive the cover sucking seat 41 to move up and down along the Z-axis direction, and the cover separating sucker 42 is fixed on the cover sucking seat 41 and is used for sucking the cover plate 53 on the film 52; the film tearing moving unit 3 can move the cover separating unit 4 to the cover separating sucker 42 to adsorb the cover plate 53 on the bottom plate 51 on the blanking table 11 in advance, and then the film tearing moving unit 3 drives the cover plate 53 to separate from the bottom plate 51; further, a plurality of air injection holes facing the membrane material 52 can be formed in the cover sucking seat 41, and when the cover plate 53 is driven by the membrane tearing moving unit 3 to be separated from the bottom plate 51, the air injection holes inject air to the membrane material 52 on the bottom plate 51 so as to press the membrane material 52 on the bottom plate 51, so that the problem that the membrane material 52 is adhered to the cover plate 53 is solved, and the membrane material 52 is prevented from moving along with the cover plate 53.
The blanking table 11 is provided with a plurality of ejector rods 15, the ejector rods 15 are in transmission connection with a jacking power assembly 16, the jacking power assembly 16 is used for driving the ejector rods 15 to upwards pass through ejector rod holes 511, so that the ejector rods 15 upwards push a cover plate 53, the ejector rods 15 can be provided with a plurality of ejector rod holes 511, each ejector rod 15 corresponds to one ejector rod hole 511, all the ejector rods 15 are fixed on the jacking plate 17, the jacking power assembly 16 is used for driving the jacking plate 17 to ascend or descend, the jacking power assembly 16 can be but is not limited to a cylinder, an electric push rod, a linear module or the like, a cylinder is taken as an example, a piston rod of the cylinder of the jacking power assembly 16 is upwards, and the cylinder of the cylinder serving as the jacking power assembly 16 can be fixed on the blanking table 11; if the cover plate 53 and the bottom plate 51 are fixed by means of magnetic adsorption, the binding force between the cover plate 53 and the bottom plate 51 is large, and the cover plate 53 is driven to move only by the cover separation sucker 42, so that the cover plate 53 is easy to be separated from the cover separation sucker 42; when the ejector rod 15 moves upward, the cover plate 53 may be pushed directly, or the cover plate 53 may be pushed upward via the membrane 52.
In some examples, a chip packaging system includes the above-described chip tooling film tearing apparatus.
The working principle of the die tooling film tearing device is as follows:
s1, placing a tool 5 to be torn off after packaging is completed on a blanking table 11; the blanking power assembly 14 drives the first blanking clamp plate 12 and the second blanking clamp plate 13 to be close to each other, and clamps and fixes the bottom plate 51 on the blanking table 11;
s2, the film tearing moving unit 3 drives the cover separating sucker 42 to move to adsorb the cover plate 53 placed on the tool 5, the jacking power assembly 16 drives the ejector rod 15 to move upwards to forcefully jack the cover plate 53 upwards, and meanwhile, the film tearing moving unit 3 drives the adsorbed cover plate 53 to be far away from the bottom plate 51 through the cover separating sucker 42;
s3, the film tearing moving unit 3 drives the film separation unit 2 to move downwards integrally, so that the sealing seat 21 presses the film 52 on the bottom plate 51 to form a sealing cavity 55;
s4, filling gas into the sealing cavity 55, enabling the membrane material 52 in the constraint cavity 211 to move upwards to bulge, pressing the part, opposite to the limiting area of the chip 6, of the membrane material 52 by the pressure rod 22, and enabling the membrane tearing assembly 23 to drive the membrane tearing suction disc 24 to descend into the constraint cavity 211 and suck the upper surface of the part, separated from the separation area, of the membrane material 52;
and S5, finally, the film tearing moving unit 3 drives the film tearing sucker 24 to move upwards, and the film 52 moves upwards along with the film tearing sucker 24, so that the film 52 is completely separated, and the separated waste film 52 can be stacked in a concentrated mode.
The above-described preferred embodiments according to the present invention are intended to suggest that, from the above description, various changes and modifications can be made by the worker in question without departing from the technical spirit of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (10)
1. The utility model provides a chip frock dyestripping device which characterized in that: comprising the following steps:
the blanking unit (1) is provided with a blanking table (11) for supporting a bottom plate (51) of the tool (5), the bottom plate (51) is provided with an air tap (54), the upper surface of the bottom plate (51) is covered with a film material (52), and the chip (6) is positioned between the film material (52) and the upper surface of the bottom plate (51);
the membrane separation unit (2) is provided with a sealing seat (21), a compression rod (22), a membrane tearing assembly (23) and a membrane tearing sucker (24), wherein a constraint cavity (211) with a downward opening is arranged on the lower end face of the sealing seat (21), a plurality of compression rods (22) are distributed in the constraint cavity (211), and the membrane tearing assembly (23) is arranged on the sealing seat (21) and used for driving the membrane tearing sucker (24) to lift;
the film tearing moving unit (3) is used for driving the film separating unit (2) to downwards move to press the film material (52) so that a sealing cavity (55) is formed between the lower surface of the part of the film material (52) in the constraint cavity (211) and the bottom plate (51), and the upper surface of the chip (6) is provided with a limiting area and a separating area; the air tap (54) is used for inflating the sealing cavity (55) to enable the membrane material (52) to bulge and separate from the separation area of the chip (6), and the lower end part of the pressure rod (22) is used for pressing the part of the membrane material (52) opposite to the limit area; the film tearing assembly (23) is further configured to drive the film tearing sucker (24) to descend so as to suck the upper surface of the separation part of the film material (52) in the constraint cavity (211) from the separation area.
2. The die tooling film tearing device of claim 1, wherein: the compression bar (22) is arranged on the sealing seat (21) in a vertically elastic telescopic way through the compression bar elastic element (25).
3. The die tooling film tearing device of claim 2, wherein: the sealing seat (21) is internally fixed with a partition plate (212), the lower surface of the partition plate (212) is formed into the upper end inner wall of the constraint cavity (211), the pressure rod (22) downwards passes through the partition plate (212), the pressure rod (22) is provided with a protruding part (221) positioned above the partition plate (212), the partition plate (212) is fixedly provided with a pressure rod seat (27), a pressure rod elastic element (25) is arranged between the protruding part (221) and the pressure rod seat (27), one end of the pressure rod elastic element (25) is propped against the pressure rod seat (27), the other end of the pressure rod elastic element is propped against the protruding part (221), and the protruding part (221) is propped against the partition plate (212).
4. The die tooling film tearing device of claim 1, wherein: the lower end part of the compression bar (22) is hemispherical, spherical crown-shaped or spherical segment-shaped.
5. The die tooling film tearing device of claim 1, wherein: each chip (6) corresponds to one compression bar (22), the lower end part of each compression bar (22) is opposite to the limiting area of the corresponding chip (6), and the limiting area is positioned in the middle of the upper surface of the chip (6).
6. The die tooling film tearing device of claim 1, wherein: the sealing seat is characterized in that a film tearing sealing ring (26) is arranged on the lower end face of the sealing seat (21), the film tearing sealing ring (26) protrudes downwards from the lower end face of the sealing seat (21), and the constraint cavity (211) is located in the film tearing sealing ring (26).
7. The die tooling film tearing device of claim 1, wherein: the blanking bench (11) is provided with a first blanking clamp plate (12), a second blanking clamp plate (13) and a blanking power assembly (14), the first blanking clamp plate (12) and the second blanking clamp plate (13) are movably arranged on the blanking bench (11), a bottom plate (51) placed on the blanking bench (11) is located between the first blanking clamp plate (12) and the second blanking clamp plate (13), and the blanking power assembly (14) is used for driving the first blanking clamp plate (12) and the second blanking clamp plate (13) to be close to or far away from each other.
8. The die tooling film tearing device of claim 7, wherein: first clamping groove (121) has been seted up to one side that first unloading splint (12) are close to second unloading splint (13), second clamping groove (131) has been seted up to one side that second unloading splint (13) are close to first unloading splint (12), first clamping groove (121) are used for supplying the one end of bottom plate (51) to insert, second clamping groove (131) are used for supplying the other end of bottom plate (51) to insert.
9. The die tooling film tearing device of claim 1, wherein: the device further comprises a cover separation unit (4), wherein a cover plate (53) is pressed on a membrane material (52) of the bottom plate (51), a push rod hole (511) is penetrated downwards on the upper surface of the bottom plate (51), and the push rod hole (511) is opposite to the cover plate (53);
the cover separation unit (4) is provided with a cover suction seat (41) and a cover separation sucker (42), the film tearing moving unit (3) is also used for driving the cover suction seat (41) to move, and the cover separation sucker (42) is fixed on the cover suction seat (41) and used for adsorbing a cover plate (53) on a film material (52);
the blanking table (11) is provided with a push rod (15), the push rod (15) is in transmission connection with a jacking power assembly (16), and the jacking power assembly (16) is used for driving the push rod (15) to upwards penetrate through the push rod hole (511) so that the push rod (15) upwards pushes the cover plate (53).
10. A chip packaging system, characterized in that: a die tooling film tearing apparatus comprising any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311678609.XA CN117373966B (en) | 2023-12-08 | 2023-12-08 | Chip frock dyestripping device and chip packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311678609.XA CN117373966B (en) | 2023-12-08 | 2023-12-08 | Chip frock dyestripping device and chip packaging system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117373966A true CN117373966A (en) | 2024-01-09 |
| CN117373966B CN117373966B (en) | 2024-02-06 |
Family
ID=89391439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311678609.XA Active CN117373966B (en) | 2023-12-08 | 2023-12-08 | Chip frock dyestripping device and chip packaging system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117373966B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10136743A1 (en) * | 2001-07-27 | 2003-02-13 | Epcos Ag | Production of a hermetic encapsulation comprises fixing and electrically contacting a component formed on chip on a support, covering the rear side of the chip with a plastic film, connecting with the support, structuring, etc. |
| US20070243667A1 (en) * | 2006-04-18 | 2007-10-18 | Texas Instruments Incorporated | POP Semiconductor Device Manufacturing Method |
| US20130337614A1 (en) * | 2012-06-14 | 2013-12-19 | Infineon Technologies Ag | Methods for manufacturing a chip package, a method for manufacturing a wafer level package, and a compression apparatus |
| CN107579163A (en) * | 2017-08-30 | 2018-01-12 | 京东方科技集团股份有限公司 | The method for packing of membrane material encapsulation smelting tool and OLED metal film |
| CN109177441A (en) * | 2018-11-22 | 2019-01-11 | 浙江晶科能源有限公司 | A kind of coat peeling unit and its dyestripping method |
| US20190067220A1 (en) * | 2017-08-30 | 2019-02-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package structure and method of fabricating package structure |
| KR20200143791A (en) * | 2019-06-17 | 2020-12-28 | 한미반도체 주식회사 | Semiconductor package separating device |
| CN114188264A (en) * | 2022-02-15 | 2022-03-15 | 合肥矽迈微电子科技有限公司 | Chip stripping mechanism, stripping machine and stripping method |
| CN216902874U (en) * | 2021-12-27 | 2022-07-05 | 池州华宇电子科技股份有限公司 | Chip adhesive film vacuum negative pressure separating mechanism |
| CN219123193U (en) * | 2023-02-16 | 2023-06-02 | 上海凯虹科技电子有限公司 | Tooling component and tooling suite |
-
2023
- 2023-12-08 CN CN202311678609.XA patent/CN117373966B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10136743A1 (en) * | 2001-07-27 | 2003-02-13 | Epcos Ag | Production of a hermetic encapsulation comprises fixing and electrically contacting a component formed on chip on a support, covering the rear side of the chip with a plastic film, connecting with the support, structuring, etc. |
| US20070243667A1 (en) * | 2006-04-18 | 2007-10-18 | Texas Instruments Incorporated | POP Semiconductor Device Manufacturing Method |
| US20130337614A1 (en) * | 2012-06-14 | 2013-12-19 | Infineon Technologies Ag | Methods for manufacturing a chip package, a method for manufacturing a wafer level package, and a compression apparatus |
| CN107579163A (en) * | 2017-08-30 | 2018-01-12 | 京东方科技集团股份有限公司 | The method for packing of membrane material encapsulation smelting tool and OLED metal film |
| US20190067220A1 (en) * | 2017-08-30 | 2019-02-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package structure and method of fabricating package structure |
| CN109177441A (en) * | 2018-11-22 | 2019-01-11 | 浙江晶科能源有限公司 | A kind of coat peeling unit and its dyestripping method |
| KR20200143791A (en) * | 2019-06-17 | 2020-12-28 | 한미반도체 주식회사 | Semiconductor package separating device |
| CN216902874U (en) * | 2021-12-27 | 2022-07-05 | 池州华宇电子科技股份有限公司 | Chip adhesive film vacuum negative pressure separating mechanism |
| CN114188264A (en) * | 2022-02-15 | 2022-03-15 | 合肥矽迈微电子科技有限公司 | Chip stripping mechanism, stripping machine and stripping method |
| CN219123193U (en) * | 2023-02-16 | 2023-06-02 | 上海凯虹科技电子有限公司 | Tooling component and tooling suite |
Non-Patent Citations (2)
| Title |
|---|
| 常达;许剑;赵义丽;: "水蒸气分离膜制备技术研究进展", 信息记录材料, no. 12, 1 December 2019 (2019-12-01) * |
| 魏行方;张鸿海;舒霞云;曹澍;: "面积阵列焊球快速制备技术与装置", 华中科技大学学报(自然科学版), no. 04, 23 April 2013 (2013-04-23) * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117373966B (en) | 2024-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101849656B1 (en) | Manufacturing method of a display device and manufacturing device of the display device | |
| KR101066505B1 (en) | Laminating method and laminating apparatus | |
| CN117373966B (en) | Chip frock dyestripping device and chip packaging system | |
| CN112621178B (en) | Screen assembling component and screen assembling equipment | |
| CN113968065B (en) | Laminating device and curved surface laminating jig | |
| CN212892892U (en) | Chip on film attaching device | |
| CN215657648U (en) | Screw filling device for production line | |
| KR101764244B1 (en) | Transfer module for semiconductor chip having buffering function | |
| CN212672184U (en) | Attaching jig of display device | |
| CN214754079U (en) | Seal box and device that stews | |
| CN213694727U (en) | Plug-in components anchor clamps and plug-in components equipment | |
| CN113085332B (en) | Vacuum laminating equipment | |
| CN212354557U (en) | Bag taking mechanism of packaging machine | |
| CN112591459A (en) | Automatic material distributing suction head device and material sticking equipment | |
| CN218299848U (en) | Battery packaging device | |
| CN220948815U (en) | Wrapping bag clamping device | |
| CN221427672U (en) | Sealing cap valve body press-mounting mechanism | |
| CN220774295U (en) | Electronic chip laminating device | |
| CN217394276U (en) | Car brake inlay apron assembly mounting plate | |
| CN219405483U (en) | Keycap pressure maintaining equipment | |
| CN220994209U (en) | Frock clamp and disassemble equipment | |
| CN220431534U (en) | Vacuum adsorption module and handling device | |
| CN221226164U (en) | Frock tectorial membrane device and semiconductor production encapsulation equipment | |
| CN114275572B (en) | Automatic feeding device and automatic feeding and discharging method for PET (polyethylene terephthalate) film | |
| CN217788350U (en) | Fluid medium 3D laminating equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |