JPS60143649A - 半導体装置の多層配線構造 - Google Patents

半導体装置の多層配線構造

Info

Publication number
JPS60143649A
JPS60143649A JP24816483A JP24816483A JPS60143649A JP S60143649 A JPS60143649 A JP S60143649A JP 24816483 A JP24816483 A JP 24816483A JP 24816483 A JP24816483 A JP 24816483A JP S60143649 A JPS60143649 A JP S60143649A
Authority
JP
Japan
Prior art keywords
film
multilayer wiring
organic resin
resin film
wiring structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24816483A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0224382B2 (enrdf_load_stackoverflow
Inventor
Mitsuru Hirao
充 平尾
Sumio Kawakami
河上　澄夫
Shunichi Numata
俊一 沼田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP24816483A priority Critical patent/JPS60143649A/ja
Publication of JPS60143649A publication Critical patent/JPS60143649A/ja
Publication of JPH0224382B2 publication Critical patent/JPH0224382B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP24816483A 1983-12-29 1983-12-29 半導体装置の多層配線構造 Granted JPS60143649A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24816483A JPS60143649A (ja) 1983-12-29 1983-12-29 半導体装置の多層配線構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24816483A JPS60143649A (ja) 1983-12-29 1983-12-29 半導体装置の多層配線構造

Publications (2)

Publication Number Publication Date
JPS60143649A true JPS60143649A (ja) 1985-07-29
JPH0224382B2 JPH0224382B2 (enrdf_load_stackoverflow) 1990-05-29

Family

ID=17174166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24816483A Granted JPS60143649A (ja) 1983-12-29 1983-12-29 半導体装置の多層配線構造

Country Status (1)

Country Link
JP (1) JPS60143649A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5497034A (en) * 1986-03-31 1996-03-05 Hitachi, Ltd. IC wiring connecting method and apparatus
US5510653A (en) * 1992-05-25 1996-04-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including silicon ladder resin layer
US6132852A (en) * 1998-03-13 2000-10-17 Hitachi, Ltd. Multilayer wiring substrate and method for production thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0477670A (ja) * 1990-07-20 1992-03-11 Tama Seiki:Kk 抗原抗体反応を用いた定量分析法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5434786A (en) * 1977-08-24 1979-03-14 Hitachi Ltd Electronic apparatus with multi-layer wiring and its manufacture
JPS57154875A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Mos semiconductor device
JPS57162448A (en) * 1981-03-31 1982-10-06 Fujitsu Ltd Formation of multilayer wiring
JPS5846653A (ja) * 1981-09-14 1983-03-18 Fujitsu Ltd 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5434786A (en) * 1977-08-24 1979-03-14 Hitachi Ltd Electronic apparatus with multi-layer wiring and its manufacture
JPS57154875A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Mos semiconductor device
JPS57162448A (en) * 1981-03-31 1982-10-06 Fujitsu Ltd Formation of multilayer wiring
JPS5846653A (ja) * 1981-09-14 1983-03-18 Fujitsu Ltd 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5497034A (en) * 1986-03-31 1996-03-05 Hitachi, Ltd. IC wiring connecting method and apparatus
US5510653A (en) * 1992-05-25 1996-04-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including silicon ladder resin layer
US6132852A (en) * 1998-03-13 2000-10-17 Hitachi, Ltd. Multilayer wiring substrate and method for production thereof

Also Published As

Publication number Publication date
JPH0224382B2 (enrdf_load_stackoverflow) 1990-05-29

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term