JPS57154875A - Mos semiconductor device - Google Patents

Mos semiconductor device

Info

Publication number
JPS57154875A
JPS57154875A JP3943081A JP3943081A JPS57154875A JP S57154875 A JPS57154875 A JP S57154875A JP 3943081 A JP3943081 A JP 3943081A JP 3943081 A JP3943081 A JP 3943081A JP S57154875 A JPS57154875 A JP S57154875A
Authority
JP
Japan
Prior art keywords
electrode
insulating film
region
drain electrode
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3943081A
Other languages
Japanese (ja)
Inventor
Hideshi Ito
Takeaki Okabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3943081A priority Critical patent/JPS57154875A/en
Publication of JPS57154875A publication Critical patent/JPS57154875A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)

Abstract

PURPOSE:To obtain an MOSFET with which the trouble of destruction caused by the breaking of an N-inversion layer at the point directly below an electrode can be prevented by a method wherein a gate shield electrode is provided between a channel stopper P<+> layer and a drain electrode on the insulating film having the thickly formed circumferential part. CONSTITUTION:An insulating film 2 having the thickly formed circumferential region, an N<+> drain region 4, a P<+> region 8 to be turned into a channel stopper, a high withstand viltage N<+> layer 10, an interlayer insulating film 11 consisting of PSG and the like, and a gate shielding electrode 12 and the like are provided on a P<+> type Si substrate 1. At this point, a drain electrode 7, consisting of Al which will be resistance-connected using the contact section 4A on the region 4, is extended on the insulating film 11. Also, the electrode 12 is provided in such a manner that a part of the gate electrode 6, consisting of a polycrystalline Si, for example, is extended on the insulating film 2 having the thickly formed circumferential region and that the electrode 12 is intersected with the drain electrode at the point located between the region 8 and the electrode 7. As a result, even when an N inversion layer is generated on the semiconductor surface underlying the circumferential insulating film by applying high voltage on the drain electrode, the N inversion layer breaks off at the point directly below the electrode 12, and the breakage caused by the leakage of current and the like can be prevented.
JP3943081A 1981-03-20 1981-03-20 Mos semiconductor device Pending JPS57154875A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3943081A JPS57154875A (en) 1981-03-20 1981-03-20 Mos semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3943081A JPS57154875A (en) 1981-03-20 1981-03-20 Mos semiconductor device

Publications (1)

Publication Number Publication Date
JPS57154875A true JPS57154875A (en) 1982-09-24

Family

ID=12552773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3943081A Pending JPS57154875A (en) 1981-03-20 1981-03-20 Mos semiconductor device

Country Status (1)

Country Link
JP (1) JPS57154875A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60143649A (en) * 1983-12-29 1985-07-29 Hitachi Ltd Multilayer interconnection structure for semiconductor device
US4785343A (en) * 1985-06-07 1988-11-15 Fujitsu Limited MIS FET semiconductor device with improved leakage current

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60143649A (en) * 1983-12-29 1985-07-29 Hitachi Ltd Multilayer interconnection structure for semiconductor device
JPH0224382B2 (en) * 1983-12-29 1990-05-29 Hitachi Seisakusho Kk
US4785343A (en) * 1985-06-07 1988-11-15 Fujitsu Limited MIS FET semiconductor device with improved leakage current

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