JPS60134429A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60134429A
JPS60134429A JP58242029A JP24202983A JPS60134429A JP S60134429 A JPS60134429 A JP S60134429A JP 58242029 A JP58242029 A JP 58242029A JP 24202983 A JP24202983 A JP 24202983A JP S60134429 A JPS60134429 A JP S60134429A
Authority
JP
Japan
Prior art keywords
bonding
wire
junction
semiconductor device
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58242029A
Other languages
English (en)
Japanese (ja)
Other versions
JPH032345B2 (cg-RX-API-DMAC10.html
Inventor
Hiroshi Tate
宏 舘
Ken Okuya
謙 奥谷
Masayuki Shirai
優之 白井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP58242029A priority Critical patent/JPS60134429A/ja
Publication of JPS60134429A publication Critical patent/JPS60134429A/ja
Publication of JPH032345B2 publication Critical patent/JPH032345B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W70/60—
    • H10W70/682—
    • H10W72/07554—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/547—
    • H10W72/59—
    • H10W72/932—
    • H10W72/936—
    • H10W72/9445—
    • H10W74/00—

Landscapes

  • Wire Bonding (AREA)
JP58242029A 1983-12-23 1983-12-23 半導体装置 Granted JPS60134429A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58242029A JPS60134429A (ja) 1983-12-23 1983-12-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58242029A JPS60134429A (ja) 1983-12-23 1983-12-23 半導体装置

Publications (2)

Publication Number Publication Date
JPS60134429A true JPS60134429A (ja) 1985-07-17
JPH032345B2 JPH032345B2 (cg-RX-API-DMAC10.html) 1991-01-14

Family

ID=17083206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58242029A Granted JPS60134429A (ja) 1983-12-23 1983-12-23 半導体装置

Country Status (1)

Country Link
JP (1) JPS60134429A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2631742A1 (fr) * 1988-05-23 1989-11-24 United Technologies Corp Module de circuit integre a soudure amelioree des pattes
JPH02275649A (ja) * 1989-04-17 1990-11-09 Nec Corp 半導体集積回路
JPH02277250A (ja) * 1989-04-18 1990-11-13 Nec Corp 半導体装置
JP2003060122A (ja) * 2001-08-21 2003-02-28 Texas Instr Japan Ltd 半導体チップ搭載用基板及びそれを用いた半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2631742A1 (fr) * 1988-05-23 1989-11-24 United Technologies Corp Module de circuit integre a soudure amelioree des pattes
JPH02275649A (ja) * 1989-04-17 1990-11-09 Nec Corp 半導体集積回路
JPH02277250A (ja) * 1989-04-18 1990-11-13 Nec Corp 半導体装置
JP2003060122A (ja) * 2001-08-21 2003-02-28 Texas Instr Japan Ltd 半導体チップ搭載用基板及びそれを用いた半導体装置

Also Published As

Publication number Publication date
JPH032345B2 (cg-RX-API-DMAC10.html) 1991-01-14

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