JPS60132334A - フイルムキヤリアボンデイング装置 - Google Patents

フイルムキヤリアボンデイング装置

Info

Publication number
JPS60132334A
JPS60132334A JP58240226A JP24022683A JPS60132334A JP S60132334 A JPS60132334 A JP S60132334A JP 58240226 A JP58240226 A JP 58240226A JP 24022683 A JP24022683 A JP 24022683A JP S60132334 A JPS60132334 A JP S60132334A
Authority
JP
Japan
Prior art keywords
film carrier
bump
motor
film
finger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58240226A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0572752B2 (enrdf_load_stackoverflow
Inventor
Akira Kabeshita
朗 壁下
Eiji Ichitenmanya
一天満谷　英二
Kazuhiro Mori
和弘 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58240226A priority Critical patent/JPS60132334A/ja
Publication of JPS60132334A publication Critical patent/JPS60132334A/ja
Publication of JPH0572752B2 publication Critical patent/JPH0572752B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58240226A 1983-12-20 1983-12-20 フイルムキヤリアボンデイング装置 Granted JPS60132334A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58240226A JPS60132334A (ja) 1983-12-20 1983-12-20 フイルムキヤリアボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58240226A JPS60132334A (ja) 1983-12-20 1983-12-20 フイルムキヤリアボンデイング装置

Publications (2)

Publication Number Publication Date
JPS60132334A true JPS60132334A (ja) 1985-07-15
JPH0572752B2 JPH0572752B2 (enrdf_load_stackoverflow) 1993-10-12

Family

ID=17056321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58240226A Granted JPS60132334A (ja) 1983-12-20 1983-12-20 フイルムキヤリアボンデイング装置

Country Status (1)

Country Link
JP (1) JPS60132334A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0358440A (ja) * 1989-07-26 1991-03-13 Nec Corp インナーリードボンディング方法及び装置
JP2005229006A (ja) * 2004-02-16 2005-08-25 Bondotekku:Kk 個別アライメント方法及び装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0358440A (ja) * 1989-07-26 1991-03-13 Nec Corp インナーリードボンディング方法及び装置
JP2005229006A (ja) * 2004-02-16 2005-08-25 Bondotekku:Kk 個別アライメント方法及び装置

Also Published As

Publication number Publication date
JPH0572752B2 (enrdf_load_stackoverflow) 1993-10-12

Similar Documents

Publication Publication Date Title
US8029638B2 (en) Component mounting apparatus and method
JP3024457B2 (ja) 電子部品実装装置および電子部品実装方法
JPS6320846A (ja) 外部リ−ド接合装置
JP5269873B2 (ja) 液晶表示装置の製造装置及び製造方法
JPH1062804A (ja) 液晶実装方法及び装置
JP3275744B2 (ja) ワークの熱圧着装置
JPS60132334A (ja) フイルムキヤリアボンデイング装置
JPS61108144A (ja) 集積回路を回路ユニツトに接続して組み立てる方法並びにこの方法を実施する装置
JP4295713B2 (ja) 表示装置の組み立て装置及び表示装置の組み立て方法
JPH08133560A (ja) 粘着性テープ片の貼着装置および貼着方法
JPH1012662A (ja) Ｔａｂ部品の圧着装置
JP3440801B2 (ja) 電子部品の接合装置
JP2825279B2 (ja) キャリアテープ部品の実装装置
JP2832744B2 (ja) インナーリードボンディング方法
JP2901412B2 (ja) Ｌｏｃ用ダイボンダ
JP2760566B2 (ja) キャリアテープ部品の実装装置
JP2701174B2 (ja) バンプ付け方法
JP2826250B2 (ja) ボンディング装置及びボンディング方法
JP3587624B2 (ja) インナーリード・ボンディング装置
JP2775553B2 (ja) ワイヤボンディング装置及びワイヤボンディング方法
JPH0130299B2 (enrdf_load_stackoverflow)
JPH0131694B2 (enrdf_load_stackoverflow)
TW202338948A (zh) 張力確認方法及膠膜黏貼裝置
JP2007108255A (ja) 偏光板貼付装置
JPH10163696A (ja) ワークの姿勢矯正装置