JPH0572752B2 - - Google Patents

Info

Publication number
JPH0572752B2
JPH0572752B2 JP58240226A JP24022683A JPH0572752B2 JP H0572752 B2 JPH0572752 B2 JP H0572752B2 JP 58240226 A JP58240226 A JP 58240226A JP 24022683 A JP24022683 A JP 24022683A JP H0572752 B2 JPH0572752 B2 JP H0572752B2
Authority
JP
Japan
Prior art keywords
film carrier
bump
bonding
motor
finger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58240226A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60132334A (ja
Inventor
Akira Kabeshita
Eiji Ichitenmanya
Kazuhiro Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58240226A priority Critical patent/JPS60132334A/ja
Publication of JPS60132334A publication Critical patent/JPS60132334A/ja
Publication of JPH0572752B2 publication Critical patent/JPH0572752B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58240226A 1983-12-20 1983-12-20 フイルムキヤリアボンデイング装置 Granted JPS60132334A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58240226A JPS60132334A (ja) 1983-12-20 1983-12-20 フイルムキヤリアボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58240226A JPS60132334A (ja) 1983-12-20 1983-12-20 フイルムキヤリアボンデイング装置

Publications (2)

Publication Number Publication Date
JPS60132334A JPS60132334A (ja) 1985-07-15
JPH0572752B2 true JPH0572752B2 (enrdf_load_stackoverflow) 1993-10-12

Family

ID=17056321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58240226A Granted JPS60132334A (ja) 1983-12-20 1983-12-20 フイルムキヤリアボンデイング装置

Country Status (1)

Country Link
JP (1) JPS60132334A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2576635B2 (ja) * 1989-07-26 1997-01-29 日本電気株式会社 インナーリードボンディング方法及び装置
JP4681241B2 (ja) * 2004-02-16 2011-05-11 ボンドテック株式会社 アライメント方法、この方法を用いた接合方法、接合装置

Also Published As

Publication number Publication date
JPS60132334A (ja) 1985-07-15

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