JPS60130883A - 多層印刷配線板 - Google Patents

多層印刷配線板

Info

Publication number
JPS60130883A
JPS60130883A JP23946783A JP23946783A JPS60130883A JP S60130883 A JPS60130883 A JP S60130883A JP 23946783 A JP23946783 A JP 23946783A JP 23946783 A JP23946783 A JP 23946783A JP S60130883 A JPS60130883 A JP S60130883A
Authority
JP
Japan
Prior art keywords
layer
multilayer printed
circuit board
printed circuit
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23946783A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365677B2 (enrdf_load_stackoverflow
Inventor
川上　伸
春山　哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIHON SHII EMU KEI KK
Original Assignee
NIHON SHII EMU KEI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIHON SHII EMU KEI KK filed Critical NIHON SHII EMU KEI KK
Priority to JP23946783A priority Critical patent/JPS60130883A/ja
Publication of JPS60130883A publication Critical patent/JPS60130883A/ja
Publication of JPH0365677B2 publication Critical patent/JPH0365677B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP23946783A 1983-12-19 1983-12-19 多層印刷配線板 Granted JPS60130883A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23946783A JPS60130883A (ja) 1983-12-19 1983-12-19 多層印刷配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23946783A JPS60130883A (ja) 1983-12-19 1983-12-19 多層印刷配線板

Publications (2)

Publication Number Publication Date
JPS60130883A true JPS60130883A (ja) 1985-07-12
JPH0365677B2 JPH0365677B2 (enrdf_load_stackoverflow) 1991-10-14

Family

ID=17045195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23946783A Granted JPS60130883A (ja) 1983-12-19 1983-12-19 多層印刷配線板

Country Status (1)

Country Link
JP (1) JPS60130883A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6249276U (enrdf_load_stackoverflow) * 1985-09-13 1987-03-26

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5444772A (en) * 1977-09-16 1979-04-09 Fujitsu Ltd Multilayer printed board
JPS5583292A (en) * 1978-12-19 1980-06-23 Matsushita Electric Ind Co Ltd Device for connecting printed circuit board
JPS5612797A (en) * 1979-07-12 1981-02-07 Matsushita Electric Ind Co Ltd Multilayer printed circuit board and method of manufacturing same
JPS5694070U (enrdf_load_stackoverflow) * 1979-12-20 1981-07-25
JPS56115593A (en) * 1980-02-16 1981-09-10 Elna Co Ltd Method of connecting flexible printed circuit board
JPS56137656A (en) * 1980-03-31 1981-10-27 Chiyou Lsi Gijutsu Kenkyu Kumiai Multilayer wiring structure and its manufacture
JPS5731876U (enrdf_load_stackoverflow) * 1975-06-13 1982-02-19
JPS5759475U (enrdf_load_stackoverflow) * 1980-09-27 1982-04-08
JPS57134987A (en) * 1981-02-16 1982-08-20 Hitachi Ltd Ceramic circuit board
JPS57143891A (en) * 1981-03-02 1982-09-06 Hitachi Ltd Multilayer circuit board
JPS58131798A (ja) * 1982-01-29 1983-08-05 ソニー株式会社 多層配線基板
JPS593564U (ja) * 1982-06-30 1984-01-11 富士通株式会社 多層セラミツク基板の積層構造
JPS5987896A (ja) * 1982-11-10 1984-05-21 富士通株式会社 多層プリント基板

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5731876U (enrdf_load_stackoverflow) * 1975-06-13 1982-02-19
JPS5444772A (en) * 1977-09-16 1979-04-09 Fujitsu Ltd Multilayer printed board
JPS5583292A (en) * 1978-12-19 1980-06-23 Matsushita Electric Ind Co Ltd Device for connecting printed circuit board
JPS5612797A (en) * 1979-07-12 1981-02-07 Matsushita Electric Ind Co Ltd Multilayer printed circuit board and method of manufacturing same
JPS5694070U (enrdf_load_stackoverflow) * 1979-12-20 1981-07-25
JPS56115593A (en) * 1980-02-16 1981-09-10 Elna Co Ltd Method of connecting flexible printed circuit board
JPS56137656A (en) * 1980-03-31 1981-10-27 Chiyou Lsi Gijutsu Kenkyu Kumiai Multilayer wiring structure and its manufacture
JPS5759475U (enrdf_load_stackoverflow) * 1980-09-27 1982-04-08
JPS57134987A (en) * 1981-02-16 1982-08-20 Hitachi Ltd Ceramic circuit board
JPS57143891A (en) * 1981-03-02 1982-09-06 Hitachi Ltd Multilayer circuit board
JPS58131798A (ja) * 1982-01-29 1983-08-05 ソニー株式会社 多層配線基板
JPS593564U (ja) * 1982-06-30 1984-01-11 富士通株式会社 多層セラミツク基板の積層構造
JPS5987896A (ja) * 1982-11-10 1984-05-21 富士通株式会社 多層プリント基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6249276U (enrdf_load_stackoverflow) * 1985-09-13 1987-03-26

Also Published As

Publication number Publication date
JPH0365677B2 (enrdf_load_stackoverflow) 1991-10-14

Similar Documents

Publication Publication Date Title
JP2009158905A (ja) 埋込型印刷回路基板の製造方法
KR100313611B1 (ko) 인쇄회로기판 제조방법
TWI691243B (zh) 印刷電路板的製造方法
JPS59175796A (ja) 多層印刷配線板の製造方法
US20020023776A1 (en) Enhanced surface laminar circuit board
GB2247361A (en) Conductive through-holes in printed wiring boards
JPS60130883A (ja) 多層印刷配線板
JP2001308484A (ja) 回路基板及びその製造方法
JP2003209331A (ja) プリント配線板およびその製造方法
CN209861268U (zh) 同时具有贯孔及盲孔的多层电路板结构
US6391211B1 (en) Method for making an electrical circuit board
JP2797871B2 (ja) プリント配線板の製造方法
JPS62193197A (ja) スル−ホ−ルプリント配線板の製造方法
JPH08186357A (ja) プリント配線板及びその製造方法
EP1135011A2 (en) Printed-wiring board
JPH0739258Y2 (ja) 基板のエッジにおける端子構造
JPS62128596A (ja) リジッド型多層プリント回路基板の製造方法
JPH0143877Y2 (enrdf_load_stackoverflow)
JP3968562B2 (ja) プリント配線板およびその製造方法
JPS60180186A (ja) プリント基板
JPS584999A (ja) プリント配線板の製造法
JP2851148B2 (ja) 印刷配線板
JP2720853B2 (ja) 印刷配線板の製造方法
JPS63233598A (ja) 印刷配線板及びその製造方法
JPS624000B2 (enrdf_load_stackoverflow)