JPS60123037A - ダイ・ボンディング装置 - Google Patents

ダイ・ボンディング装置

Info

Publication number
JPS60123037A
JPS60123037A JP23189583A JP23189583A JPS60123037A JP S60123037 A JPS60123037 A JP S60123037A JP 23189583 A JP23189583 A JP 23189583A JP 23189583 A JP23189583 A JP 23189583A JP S60123037 A JPS60123037 A JP S60123037A
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor laser
heater
laser chip
heater block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23189583A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0472395B2 (enrdf_load_stackoverflow
Inventor
Toshio Yamamoto
俊夫 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP23189583A priority Critical patent/JPS60123037A/ja
Publication of JPS60123037A publication Critical patent/JPS60123037A/ja
Publication of JPH0472395B2 publication Critical patent/JPH0472395B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Semiconductor Lasers (AREA)
JP23189583A 1983-12-08 1983-12-08 ダイ・ボンディング装置 Granted JPS60123037A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23189583A JPS60123037A (ja) 1983-12-08 1983-12-08 ダイ・ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23189583A JPS60123037A (ja) 1983-12-08 1983-12-08 ダイ・ボンディング装置

Publications (2)

Publication Number Publication Date
JPS60123037A true JPS60123037A (ja) 1985-07-01
JPH0472395B2 JPH0472395B2 (enrdf_load_stackoverflow) 1992-11-18

Family

ID=16930715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23189583A Granted JPS60123037A (ja) 1983-12-08 1983-12-08 ダイ・ボンディング装置

Country Status (1)

Country Link
JP (1) JPS60123037A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6258645A (ja) * 1985-09-09 1987-03-14 Toshiba Corp ダイボンデイング装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51149781A (en) * 1975-06-17 1976-12-22 Agency Of Ind Science & Technol Device for mounting semiconductor laserelement
JPS55132088A (en) * 1979-03-30 1980-10-14 Canon Inc Semiconductor laser device
JPS5898995A (ja) * 1981-12-09 1983-06-13 Nec Corp 光半導体装置
JPS58123787A (ja) * 1982-01-18 1983-07-23 Fujitsu Ltd 半導体レ−ザチツプの自動ダイボンデング装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51149781A (en) * 1975-06-17 1976-12-22 Agency Of Ind Science & Technol Device for mounting semiconductor laserelement
JPS55132088A (en) * 1979-03-30 1980-10-14 Canon Inc Semiconductor laser device
JPS5898995A (ja) * 1981-12-09 1983-06-13 Nec Corp 光半導体装置
JPS58123787A (ja) * 1982-01-18 1983-07-23 Fujitsu Ltd 半導体レ−ザチツプの自動ダイボンデング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6258645A (ja) * 1985-09-09 1987-03-14 Toshiba Corp ダイボンデイング装置

Also Published As

Publication number Publication date
JPH0472395B2 (enrdf_load_stackoverflow) 1992-11-18

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