JPH0472395B2 - - Google Patents

Info

Publication number
JPH0472395B2
JPH0472395B2 JP58231895A JP23189583A JPH0472395B2 JP H0472395 B2 JPH0472395 B2 JP H0472395B2 JP 58231895 A JP58231895 A JP 58231895A JP 23189583 A JP23189583 A JP 23189583A JP H0472395 B2 JPH0472395 B2 JP H0472395B2
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor laser
bonding
heater
heater block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58231895A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60123037A (ja
Inventor
Toshio Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP23189583A priority Critical patent/JPS60123037A/ja
Publication of JPS60123037A publication Critical patent/JPS60123037A/ja
Publication of JPH0472395B2 publication Critical patent/JPH0472395B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Semiconductor Lasers (AREA)
JP23189583A 1983-12-08 1983-12-08 ダイ・ボンディング装置 Granted JPS60123037A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23189583A JPS60123037A (ja) 1983-12-08 1983-12-08 ダイ・ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23189583A JPS60123037A (ja) 1983-12-08 1983-12-08 ダイ・ボンディング装置

Publications (2)

Publication Number Publication Date
JPS60123037A JPS60123037A (ja) 1985-07-01
JPH0472395B2 true JPH0472395B2 (enrdf_load_stackoverflow) 1992-11-18

Family

ID=16930715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23189583A Granted JPS60123037A (ja) 1983-12-08 1983-12-08 ダイ・ボンディング装置

Country Status (1)

Country Link
JP (1) JPS60123037A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6258645A (ja) * 1985-09-09 1987-03-14 Toshiba Corp ダイボンデイング装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51149781A (en) * 1975-06-17 1976-12-22 Agency Of Ind Science & Technol Device for mounting semiconductor laserelement
JPS55132088A (en) * 1979-03-30 1980-10-14 Canon Inc Semiconductor laser device
JPS5898995A (ja) * 1981-12-09 1983-06-13 Nec Corp 光半導体装置
JPS58123787A (ja) * 1982-01-18 1983-07-23 Fujitsu Ltd 半導体レ−ザチツプの自動ダイボンデング装置

Also Published As

Publication number Publication date
JPS60123037A (ja) 1985-07-01

Similar Documents

Publication Publication Date Title
KR100426839B1 (ko) 칩-기판 접속부를 제조하는 장치 및 방법
US4914269A (en) Method of sealing a ceramic lid on a ceramic semiconductor package with a high-power laser
JP2005509269A5 (enrdf_load_stackoverflow)
JPH0472395B2 (enrdf_load_stackoverflow)
JPH0554260B2 (enrdf_load_stackoverflow)
JP4179805B2 (ja) ダイボンディング装置
US7897892B2 (en) Method of bonding an optical component
JPS6347142B2 (enrdf_load_stackoverflow)
JP2662089B2 (ja) ハンダ付装置
JP2002158390A (ja) 半導体レーザ装置の製造方法および半導体レーザ装置
JPS6223003A (ja) レ−ザダイボンデイングツ−ル
JP2624586B2 (ja) 溶接装置および溶接方法
JPS61121383A (ja) 半導体レ−ザのボンデイング方法
JPS6258645A (ja) ダイボンデイング装置
JPH09330953A (ja) 混成要素を基板に混成化する方法と装置
JPS62134173A (ja) レ−ザダイボンデイングツ−ル
US4485290A (en) Bonding a workpiece to a body
JPH04127491A (ja) 半導体レーザ素子の製造方法
JPH09237941A (ja) 半導体レーザ装置の製造方法
JPH03190199A (ja) アウターリードのボンディングヘッド及びボンディング方法
JPS60106186A (ja) 半導体レ−ザ装置の製造方法
JPH0546006Y2 (enrdf_load_stackoverflow)
JPS57159078A (en) Manufacture of semiconductor light-emitting device
JPH03276744A (ja) 半導体装置の製造方法
JPH03227084A (ja) 半導体組立方法