JPS60121274A - 自己触媒型無電解金めっき液 - Google Patents

自己触媒型無電解金めっき液

Info

Publication number
JPS60121274A
JPS60121274A JP22920683A JP22920683A JPS60121274A JP S60121274 A JPS60121274 A JP S60121274A JP 22920683 A JP22920683 A JP 22920683A JP 22920683 A JP22920683 A JP 22920683A JP S60121274 A JPS60121274 A JP S60121274A
Authority
JP
Japan
Prior art keywords
lead
gold
alkali metal
plating liquid
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22920683A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0414189B2 (enExample
Inventor
Yoshiyasu Okamura
岡村　好庸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP22920683A priority Critical patent/JPS60121274A/ja
Publication of JPS60121274A publication Critical patent/JPS60121274A/ja
Publication of JPH0414189B2 publication Critical patent/JPH0414189B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP22920683A 1983-12-06 1983-12-06 自己触媒型無電解金めっき液 Granted JPS60121274A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22920683A JPS60121274A (ja) 1983-12-06 1983-12-06 自己触媒型無電解金めっき液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22920683A JPS60121274A (ja) 1983-12-06 1983-12-06 自己触媒型無電解金めっき液

Publications (2)

Publication Number Publication Date
JPS60121274A true JPS60121274A (ja) 1985-06-28
JPH0414189B2 JPH0414189B2 (enExample) 1992-03-12

Family

ID=16888477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22920683A Granted JPS60121274A (ja) 1983-12-06 1983-12-06 自己触媒型無電解金めっき液

Country Status (1)

Country Link
JP (1) JPS60121274A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560764A (en) * 1994-08-19 1996-10-01 Electroplating Engineers Of Japan, Limited Electroless gold plating solution
US5601637A (en) * 1994-08-19 1997-02-11 Electroplating Engineers Of Japan, Limited Electroless gold plating solution
US5614004A (en) * 1994-08-19 1997-03-25 Electroplating Engineers Of Japan, Limited Electroless gold plating solution
JP2008144188A (ja) * 2006-12-06 2008-06-26 C Uyemura & Co Ltd 無電解金めっき浴、無電解金めっき方法及び電子部品
JP2008144187A (ja) * 2006-12-06 2008-06-26 C Uyemura & Co Ltd 無電解金めっき浴、無電解金めっき方法及び電子部品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524914A (en) * 1978-08-05 1980-02-22 Ngk Spark Plug Co Ltd Nonelectrolytic gold plating liquor
JPS57169077A (en) * 1981-03-23 1982-10-18 Hooker Chemicals Plastics Corp Non-electrolytic gold plating

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524914A (en) * 1978-08-05 1980-02-22 Ngk Spark Plug Co Ltd Nonelectrolytic gold plating liquor
JPS57169077A (en) * 1981-03-23 1982-10-18 Hooker Chemicals Plastics Corp Non-electrolytic gold plating

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560764A (en) * 1994-08-19 1996-10-01 Electroplating Engineers Of Japan, Limited Electroless gold plating solution
US5601637A (en) * 1994-08-19 1997-02-11 Electroplating Engineers Of Japan, Limited Electroless gold plating solution
US5614004A (en) * 1994-08-19 1997-03-25 Electroplating Engineers Of Japan, Limited Electroless gold plating solution
US5660619A (en) * 1994-08-19 1997-08-26 Electroplating Engineer Of Japan, Limited Electroless gold plating solution
JP2008144188A (ja) * 2006-12-06 2008-06-26 C Uyemura & Co Ltd 無電解金めっき浴、無電解金めっき方法及び電子部品
JP2008144187A (ja) * 2006-12-06 2008-06-26 C Uyemura & Co Ltd 無電解金めっき浴、無電解金めっき方法及び電子部品
TWI457462B (zh) * 2006-12-06 2014-10-21 Uyemura C & Co Ltd 無電式鍍金浴，無電式鍍金方法及電子零件

Also Published As

Publication number Publication date
JPH0414189B2 (enExample) 1992-03-12

Similar Documents

Publication Publication Date Title
US4337091A (en) Electroless gold plating
US4168214A (en) Gold electroplating bath and method of making the same
US5232492A (en) Electroless gold plating composition
US4780342A (en) Electroless nickel plating composition and method for its preparation and use
TW200416299A (en) Electroless gold plating solution
JPH0860379A (ja) 無電解金めっき液
CA1188458A (en) Electroless gold plating
JP5416330B2 (ja) 金めっき液用亜硫酸金塩水溶液の製造方法
US5935306A (en) Electroless gold plating bath
US3661596A (en) Stabilized, chemical nickel plating bath
JP2013224496A (ja) 金めっき液用亜硫酸金塩水溶液
EP0384180A1 (en) Formaldehyde-free electroless copper plating solutions
JPH08176837A (ja) 無電解ニッケルリンめっき液
JPH0414189B2 (enExample)
JPS60125379A (ja) 無電解金めっき液
JPH0860377A (ja) 無電解金めっき液
US4036651A (en) Electroless copper plating bath
US3458542A (en) Heavy metal-diamine-gold cyanide complexes
JPH06145997A (ja) 無電解金めっき液
EP0343816A1 (en) Electroless deposition
US3460952A (en) Electroless copper plating
JPH04157169A (ja) 無電解ニッケルーリンめっき液
JPH0860378A (ja) 無電解金めっき液
KR870000344B1 (ko) 무전해 니켈 도금용 활성화 용액의 제조방법
JPH07166392A (ja) 金めっき液及び金めっき方法