JPS60110873A - タ−ゲットの冷却方法 - Google Patents

タ−ゲットの冷却方法

Info

Publication number
JPS60110873A
JPS60110873A JP21713683A JP21713683A JPS60110873A JP S60110873 A JPS60110873 A JP S60110873A JP 21713683 A JP21713683 A JP 21713683A JP 21713683 A JP21713683 A JP 21713683A JP S60110873 A JPS60110873 A JP S60110873A
Authority
JP
Japan
Prior art keywords
target
cooling water
cooling
plate
support plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21713683A
Other languages
English (en)
Japanese (ja)
Other versions
JPH052739B2 (enExample
Inventor
Minoru Inoue
実 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP21713683A priority Critical patent/JPS60110873A/ja
Publication of JPS60110873A publication Critical patent/JPS60110873A/ja
Publication of JPH052739B2 publication Critical patent/JPH052739B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
JP21713683A 1983-11-17 1983-11-17 タ−ゲットの冷却方法 Granted JPS60110873A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21713683A JPS60110873A (ja) 1983-11-17 1983-11-17 タ−ゲットの冷却方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21713683A JPS60110873A (ja) 1983-11-17 1983-11-17 タ−ゲットの冷却方法

Publications (2)

Publication Number Publication Date
JPS60110873A true JPS60110873A (ja) 1985-06-17
JPH052739B2 JPH052739B2 (enExample) 1993-01-13

Family

ID=16699414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21713683A Granted JPS60110873A (ja) 1983-11-17 1983-11-17 タ−ゲットの冷却方法

Country Status (1)

Country Link
JP (1) JPS60110873A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6279870U (enExample) * 1985-11-05 1987-05-21
JPH04293771A (ja) * 1990-12-19 1992-10-19 Intevac Inc スパッタコーティング源
EP1659193A1 (de) * 2004-11-19 2006-05-24 Applied Films GmbH & Co. KG Gekühlte Rückenplatte für ein Sputtertarget und Sputtertarget bestehend aus mehreren Rückenplatten
US7799190B2 (en) * 2005-04-14 2010-09-21 Tango Systems, Inc. Target backing plate for sputtering system
JP2014051746A (ja) * 2002-10-24 2014-03-20 Honeywell Internatl Inc 冷却能を向上させると共に撓みおよび変形を減少させるターゲットの設計およびその関連方法
JP2017115211A (ja) * 2015-12-24 2017-06-29 株式会社アルバック スパッタリング装置及びスパッタリング方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5677380A (en) * 1979-11-28 1981-06-25 Hitachi Ltd Sputtering apparatus
JPS56112470A (en) * 1980-02-07 1981-09-04 Anelva Corp Sputtering device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5677380A (en) * 1979-11-28 1981-06-25 Hitachi Ltd Sputtering apparatus
JPS56112470A (en) * 1980-02-07 1981-09-04 Anelva Corp Sputtering device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6279870U (enExample) * 1985-11-05 1987-05-21
JPH04293771A (ja) * 1990-12-19 1992-10-19 Intevac Inc スパッタコーティング源
JP2014051746A (ja) * 2002-10-24 2014-03-20 Honeywell Internatl Inc 冷却能を向上させると共に撓みおよび変形を減少させるターゲットの設計およびその関連方法
EP1659193A1 (de) * 2004-11-19 2006-05-24 Applied Films GmbH & Co. KG Gekühlte Rückenplatte für ein Sputtertarget und Sputtertarget bestehend aus mehreren Rückenplatten
CN100471988C (zh) 2004-11-19 2009-03-25 应用材料股份有限两合公司 用于一个溅射靶的冷却背板和由多个背板组成的溅射靶
US7959776B2 (en) 2004-11-19 2011-06-14 Applied Films Gmbh & Co. Cooled backing plate for a sputtering target, and sputtering target comprising a plurality of backing plates
US7799190B2 (en) * 2005-04-14 2010-09-21 Tango Systems, Inc. Target backing plate for sputtering system
JP2017115211A (ja) * 2015-12-24 2017-06-29 株式会社アルバック スパッタリング装置及びスパッタリング方法

Also Published As

Publication number Publication date
JPH052739B2 (enExample) 1993-01-13

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