JPS60110196A - スルホ−ル印刷配線板 - Google Patents
スルホ−ル印刷配線板Info
- Publication number
- JPS60110196A JPS60110196A JP21806983A JP21806983A JPS60110196A JP S60110196 A JPS60110196 A JP S60110196A JP 21806983 A JP21806983 A JP 21806983A JP 21806983 A JP21806983 A JP 21806983A JP S60110196 A JPS60110196 A JP S60110196A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- layer
- printed wiring
- protective layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 25
- 239000011241 protective layer Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000000976 ink Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21806983A JPS60110196A (ja) | 1983-11-18 | 1983-11-18 | スルホ−ル印刷配線板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21806983A JPS60110196A (ja) | 1983-11-18 | 1983-11-18 | スルホ−ル印刷配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60110196A true JPS60110196A (ja) | 1985-06-15 |
JPS6310599B2 JPS6310599B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-03-08 |
Family
ID=16714158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21806983A Granted JPS60110196A (ja) | 1983-11-18 | 1983-11-18 | スルホ−ル印刷配線板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60110196A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6377376U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1986-11-07 | 1988-05-23 | ||
JPH08250834A (ja) * | 1995-12-25 | 1996-09-27 | Hokuriku Electric Ind Co Ltd | 回路基板 |
-
1983
- 1983-11-18 JP JP21806983A patent/JPS60110196A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6377376U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1986-11-07 | 1988-05-23 | ||
JPH08250834A (ja) * | 1995-12-25 | 1996-09-27 | Hokuriku Electric Ind Co Ltd | 回路基板 |
Also Published As
Publication number | Publication date |
---|---|
JPS6310599B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-03-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS61288493A (ja) | 回路基板の部品端子番号表示方法 | |
US5109601A (en) | Method of marking a thin film package | |
JPS60110196A (ja) | スルホ−ル印刷配線板 | |
US5219607A (en) | Method of manufacturing printed circuit board | |
JP2554694Y2 (ja) | プリント基板 | |
JPS6286793A (ja) | 電子部品の実装方法 | |
JP2543858Y2 (ja) | プリント基板 | |
JP2909223B2 (ja) | プリント配線板の導体パターンメッキ方法 | |
JPH054294Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPH11238993A (ja) | 部品実装プリント基板及び部品実装プリント基板の実装方法 | |
JP2000244080A (ja) | プリント配線板 | |
JPH11145607A (ja) | 印刷回路基板におけるはんだ絶縁膜の形成方法及びこの方法によって製造された印刷回路基板 | |
JPH0430494A (ja) | 印刷配線板及びその製造法 | |
EP0375954B1 (en) | Method of manufacturing printed circuit board | |
JPH04243187A (ja) | プリント基板 | |
JP2706673B2 (ja) | プリント配線板 | |
JPH11150346A (ja) | 配線基板 | |
JPH01217994A (ja) | 印刷配線板 | |
JPS6211296A (ja) | 回路部品の実装方法 | |
JPH04247685A (ja) | プリント基板 | |
JPH02148791A (ja) | プリント配線板 | |
JPS63204790A (ja) | プリント配線板 | |
JPH0437191A (ja) | 多層プリント基板 | |
JPH04307784A (ja) | プリント配線板 | |
JPS62256494A (ja) | 印刷配線板 |