JPS60105259A - 半導体機器用リ−ドフレ−ム材 - Google Patents
半導体機器用リ−ドフレ−ム材Info
- Publication number
- JPS60105259A JPS60105259A JP21307383A JP21307383A JPS60105259A JP S60105259 A JPS60105259 A JP S60105259A JP 21307383 A JP21307383 A JP 21307383A JP 21307383 A JP21307383 A JP 21307383A JP S60105259 A JPS60105259 A JP S60105259A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- frame material
- semiconductor equipment
- semiconductor devices
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims description 25
- 239000004065 semiconductor Substances 0.000 title claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000009792 diffusion process Methods 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 10
- 230000003647 oxidation Effects 0.000 claims description 9
- 238000007254 oxidation reaction Methods 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 230000035515 penetration Effects 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 13
- 238000011282 treatment Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- -1 Au and F Chemical class 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21307383A JPS60105259A (ja) | 1983-11-11 | 1983-11-11 | 半導体機器用リ−ドフレ−ム材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21307383A JPS60105259A (ja) | 1983-11-11 | 1983-11-11 | 半導体機器用リ−ドフレ−ム材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60105259A true JPS60105259A (ja) | 1985-06-10 |
| JPH0562467B2 JPH0562467B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-08 |
Family
ID=16633091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21307383A Granted JPS60105259A (ja) | 1983-11-11 | 1983-11-11 | 半導体機器用リ−ドフレ−ム材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60105259A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6480056A (en) * | 1987-09-21 | 1989-03-24 | Dainippon Printing Co Ltd | Manufacture of conductive material for electronic component |
| JPH04366A (ja) * | 1990-04-16 | 1992-01-06 | Mitsubishi Electric Corp | 半導体リードフレーム材料及びその製造方法 |
| JPH04138036U (ja) * | 1991-06-20 | 1992-12-24 | 三菱電線工業株式会社 | ワーク供給装置 |
| EP0621981A4 (en) * | 1992-01-17 | 1995-05-17 | Olin Corp | LADDER FRAME WITH IMPROVED ADHAESION. |
| JPH08503423A (ja) * | 1992-11-23 | 1996-04-16 | ギューリング，ヨーク | 交換可能な切削チップを備えたドリル |
| WO1996015284A1 (en) * | 1994-11-09 | 1996-05-23 | Cametoid Advanced Technologies Inc. | Method of producing reactive element modified-aluminide diffusion coatings |
| WO2007052438A1 (ja) * | 2005-11-01 | 2007-05-10 | Advanced Systems Japan Inc. | スパイラル状接触子およびその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57147261A (en) * | 1981-03-06 | 1982-09-11 | Hitachi Cable Ltd | Partly reinforcing method for metal |
| JPS58153356A (ja) * | 1982-03-05 | 1983-09-12 | Mitsubishi Metal Corp | 耐酸化性のすぐれた半導体装置のリ−ド材用Ｃｕ合金 |
-
1983
- 1983-11-11 JP JP21307383A patent/JPS60105259A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57147261A (en) * | 1981-03-06 | 1982-09-11 | Hitachi Cable Ltd | Partly reinforcing method for metal |
| JPS58153356A (ja) * | 1982-03-05 | 1983-09-12 | Mitsubishi Metal Corp | 耐酸化性のすぐれた半導体装置のリ−ド材用Ｃｕ合金 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6480056A (en) * | 1987-09-21 | 1989-03-24 | Dainippon Printing Co Ltd | Manufacture of conductive material for electronic component |
| JPH04366A (ja) * | 1990-04-16 | 1992-01-06 | Mitsubishi Electric Corp | 半導体リードフレーム材料及びその製造方法 |
| JPH04138036U (ja) * | 1991-06-20 | 1992-12-24 | 三菱電線工業株式会社 | ワーク供給装置 |
| EP0621981A4 (en) * | 1992-01-17 | 1995-05-17 | Olin Corp | LADDER FRAME WITH IMPROVED ADHAESION. |
| JPH08503423A (ja) * | 1992-11-23 | 1996-04-16 | ギューリング，ヨーク | 交換可能な切削チップを備えたドリル |
| WO1996015284A1 (en) * | 1994-11-09 | 1996-05-23 | Cametoid Advanced Technologies Inc. | Method of producing reactive element modified-aluminide diffusion coatings |
| US5807613A (en) * | 1994-11-09 | 1998-09-15 | Cametoid Advanced Technologies, Inc. | Method of producing reactive element modified-aluminide diffusion coatings |
| WO2007052438A1 (ja) * | 2005-11-01 | 2007-05-10 | Advanced Systems Japan Inc. | スパイラル状接触子およびその製造方法 |
| JP2007128684A (ja) * | 2005-11-01 | 2007-05-24 | Advanced Systems Japan Inc | スパイラル状接触子およびその製造方法 |
| EP1950851A4 (en) * | 2005-11-01 | 2011-11-02 | Advanced Systems Japan Inc | SPIRAL CONTACT AND PROCESS FOR ITS MANUFACTURE |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0562467B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4498121A (en) | Copper alloys for suppressing growth of Cu-Al intermetallic compounds | |
| KR100318818B1 (ko) | 리드프레임에대한보호피막결합 | |
| US5650661A (en) | Protective coating combination for lead frames | |
| JPS60105259A (ja) | 半導体機器用リ−ドフレ−ム材 | |
| US4767049A (en) | Special surfaces for wire bonding | |
| US4035526A (en) | Evaporated solderable multilayer contact for silicon semiconductor | |
| JPH06334087A (ja) | 半導体装置用リードフレームの製造方法 | |
| US4065588A (en) | Method of making gold-cobalt contact for silicon devices | |
| JP3303594B2 (ja) | 耐熱銀被覆複合体とその製造方法 | |
| JPS6243343B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPH01257356A (ja) | 半導体用リードフレーム | |
| JP2000045039A (ja) | コンタクト材料とその製造方法 | |
| JPS60153152A (ja) | 半導体機器用リ−ドフレ−ム材の製造方法 | |
| JP3186408B2 (ja) | 多層リードフレーム及びその製造方法 | |
| JPS6036000B2 (ja) | 耐熱銀被覆銅線およびその製造方法 | |
| JPS57114265A (en) | Ic lead frame and transistor comb and manufacture thereof | |
| US4482611A (en) | Electronic parts | |
| JPH04184969A (ja) | 半導体装置リードフレーム材料及びその製造方法 | |
| JPH09283688A (ja) | 銅被覆リードフレーム材 | |
| JP2564633B2 (ja) | 樹脂との接合性が良好なリードフレーム材の製造方法 | |
| JP2542735B2 (ja) | 半導体リ―ドフレ―ム材料及びその製造方法 | |
| JPH0774291A (ja) | 半導体装置用ヒートシンク材 | |
| JP3463481B2 (ja) | 表面硬化Ｆｅ−Ａｌ系合金の製造方法 | |
| JPH06112389A (ja) | リードフレームおよびその製造方法 | |
| JP2537301B2 (ja) | 電子部品の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |