JPS60101921A - 電子部品の外装方法 - Google Patents
電子部品の外装方法Info
- Publication number
- JPS60101921A JPS60101921A JP20961483A JP20961483A JPS60101921A JP S60101921 A JPS60101921 A JP S60101921A JP 20961483 A JP20961483 A JP 20961483A JP 20961483 A JP20961483 A JP 20961483A JP S60101921 A JPS60101921 A JP S60101921A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin material
- capacitor element
- external lead
- component body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 11
- 239000011347 resin Substances 0.000 claims description 48
- 229920005989 resin Polymers 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 28
- 238000004806 packaging method and process Methods 0.000 claims description 13
- 238000001879 gelation Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 description 36
- 239000007787 solid Substances 0.000 description 6
- 238000007654 immersion Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 235000011511 Diospyros Nutrition 0.000 description 1
- 244000236655 Diospyros kaki Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20961483A JPS60101921A (ja) | 1983-11-07 | 1983-11-07 | 電子部品の外装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20961483A JPS60101921A (ja) | 1983-11-07 | 1983-11-07 | 電子部品の外装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60101921A true JPS60101921A (ja) | 1985-06-06 |
| JPH0473283B2 JPH0473283B2 (enExample) | 1992-11-20 |
Family
ID=16575713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20961483A Granted JPS60101921A (ja) | 1983-11-07 | 1983-11-07 | 電子部品の外装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60101921A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3291718B1 (en) | 2015-05-07 | 2018-08-29 | Koninklijke Philips N.V. | Food preparation apparatus and method |
-
1983
- 1983-11-07 JP JP20961483A patent/JPS60101921A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0473283B2 (enExample) | 1992-11-20 |
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