JPS5999264A - 固定プロ−ブ・ボ−ド - Google Patents
固定プロ−ブ・ボ−ドInfo
- Publication number
- JPS5999264A JPS5999264A JP20883182A JP20883182A JPS5999264A JP S5999264 A JPS5999264 A JP S5999264A JP 20883182 A JP20883182 A JP 20883182A JP 20883182 A JP20883182 A JP 20883182A JP S5999264 A JPS5999264 A JP S5999264A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- wiring board
- probes
- alignment
- small hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 56
- 238000005259 measurement Methods 0.000 claims abstract description 8
- 239000004065 semiconductor Substances 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 11
- 238000000034 method Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20883182A JPS5999264A (ja) | 1982-11-29 | 1982-11-29 | 固定プロ−ブ・ボ−ド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20883182A JPS5999264A (ja) | 1982-11-29 | 1982-11-29 | 固定プロ−ブ・ボ−ド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5999264A true JPS5999264A (ja) | 1984-06-07 |
| JPH04228B2 JPH04228B2 (en:Method) | 1992-01-06 |
Family
ID=16562826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20883182A Granted JPS5999264A (ja) | 1982-11-29 | 1982-11-29 | 固定プロ−ブ・ボ−ド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5999264A (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0337571A (ja) * | 1989-07-03 | 1991-02-18 | Nippon Denshi Zairyo Kk | プローブカード |
| JP2001099864A (ja) * | 1999-09-29 | 2001-04-13 | Nec Corp | プリント基板検査用検査治具及びその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56105647A (en) * | 1980-01-25 | 1981-08-22 | Yoshie Hasegawa | Probeboard |
-
1982
- 1982-11-29 JP JP20883182A patent/JPS5999264A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56105647A (en) * | 1980-01-25 | 1981-08-22 | Yoshie Hasegawa | Probeboard |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0337571A (ja) * | 1989-07-03 | 1991-02-18 | Nippon Denshi Zairyo Kk | プローブカード |
| JP2001099864A (ja) * | 1999-09-29 | 2001-04-13 | Nec Corp | プリント基板検査用検査治具及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04228B2 (en:Method) | 1992-01-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8468690B2 (en) | Holding member for use in test and method for manufacturing same | |
| US7180315B2 (en) | Substrate with patterned conductive layer | |
| JP2001056345A (ja) | プロービングカード及びその製造方法 | |
| US7282931B2 (en) | Full wafer contacter and applications thereof | |
| JP5416986B2 (ja) | 電気的接続装置 | |
| US8435045B2 (en) | Electrical connecting apparatus and method for manufacturing the same | |
| JPS5999264A (ja) | 固定プロ−ブ・ボ−ド | |
| TWI484192B (zh) | Probe card, inspection device and inspection method | |
| JPH11154694A (ja) | ウェハ一括型測定検査用アライメント方法およびプローブカードの製造方法 | |
| JP3076831B2 (ja) | 素子試験装置 | |
| JP3124983B2 (ja) | 電気回路検査装置 | |
| KR101106607B1 (ko) | 반도체 장치의 시험 장치 | |
| JPH04294559A (ja) | プローブカード | |
| US20250172590A1 (en) | Probe card for testing semiconductor device | |
| KR20250132651A (ko) | 공간 변환기, 이를 포함하는 프로브 카드 및 이들의 제조 방법 | |
| JPS5826530Y2 (ja) | プロ−ブカ−ド | |
| JPH03159146A (ja) | プロービングカード | |
| KR20230167644A (ko) | 정렬 정밀도가 높은 프로브 카드 | |
| JPS5912615Y2 (ja) | プロ−ブカ−ド | |
| JPS5826531Y2 (ja) | プロ−ブカ−ド | |
| JPH11163059A (ja) | 集積回路用半導体薄板検査装置およびその検査方法 | |
| JPH01216282A (ja) | 回路基板の検査方法及び回路基板の検査装置 | |
| JPH04364054A (ja) | 検査装置およびその方法 | |
| TW202109053A (zh) | 檢查治具以及檢查裝置 | |
| JPH08241916A (ja) | 半導体集積回路の検査方法 |