JPS5998587A - 金属芯入り印刷配線板 - Google Patents

金属芯入り印刷配線板

Info

Publication number
JPS5998587A
JPS5998587A JP20787182A JP20787182A JPS5998587A JP S5998587 A JPS5998587 A JP S5998587A JP 20787182 A JP20787182 A JP 20787182A JP 20787182 A JP20787182 A JP 20787182A JP S5998587 A JPS5998587 A JP S5998587A
Authority
JP
Japan
Prior art keywords
hole
metal core
metal
layer
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20787182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS624877B2 (zh
Inventor
直樹 福富
順雄 岩崎
木田　明成
富士男 小島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP20787182A priority Critical patent/JPS5998587A/ja
Publication of JPS5998587A publication Critical patent/JPS5998587A/ja
Publication of JPS624877B2 publication Critical patent/JPS624877B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP20787182A 1982-11-27 1982-11-27 金属芯入り印刷配線板 Granted JPS5998587A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20787182A JPS5998587A (ja) 1982-11-27 1982-11-27 金属芯入り印刷配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20787182A JPS5998587A (ja) 1982-11-27 1982-11-27 金属芯入り印刷配線板

Publications (2)

Publication Number Publication Date
JPS5998587A true JPS5998587A (ja) 1984-06-06
JPS624877B2 JPS624877B2 (zh) 1987-02-02

Family

ID=16546926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20787182A Granted JPS5998587A (ja) 1982-11-27 1982-11-27 金属芯入り印刷配線板

Country Status (1)

Country Link
JP (1) JPS5998587A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6395278U (zh) * 1986-12-11 1988-06-20
JPH01244849A (ja) * 1988-03-28 1989-09-29 Matsushita Electric Works Ltd 電気積層板の製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6425879U (zh) * 1987-08-03 1989-02-14
JPH0268678U (zh) * 1988-11-11 1990-05-24

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6395278U (zh) * 1986-12-11 1988-06-20
JPH01244849A (ja) * 1988-03-28 1989-09-29 Matsushita Electric Works Ltd 電気積層板の製造方法

Also Published As

Publication number Publication date
JPS624877B2 (zh) 1987-02-02

Similar Documents

Publication Publication Date Title
GB911718A (en) Multiplanar printed circuits and methods for their manufacture
JP2017098404A (ja) 配線基板およびその製造方法
KR101298280B1 (ko) 임베디드 인쇄회로기판 및 이의 제조 방법
JPS6158297A (ja) 多層印刷配線板
CN206059386U (zh) 布线基板以及电子装置
JPS5998587A (ja) 金属芯入り印刷配線板
JPH0750489A (ja) 多層印刷配線板の製造方法
KR20110085121A (ko) 발광 장치
JPS596861U (ja) 配線基板
JP2012104792A (ja) 半導体パッケージ基板の製造方法
CN207283915U (zh) 一种散热性能好的线路板
JP4591181B2 (ja) プリント配線板
JPS5843596A (ja) 印刷配線板
WO2022160459A1 (zh) 一种电路板及其制造方法、电子装置
CN215222596U (zh) 一种电路板及电子装置
JPH0691303B2 (ja) 電子部品搭載プリント配線板装置
JPS60167399A (ja) 高熱伝導性金属ベ−ス回路基板
CN207869486U (zh) 双面线路板
CN207652773U (zh) 一种带盲孔埋孔的印刷电路板
JP2009290044A (ja) 配線基板
JPS622787Y2 (zh)
JPS6214717Y2 (zh)
JPS60236280A (ja) 配線用板
JPS627192A (ja) プリント配線基板
GB1273904A (en) Improvements in printed circuits