JPS5998581A - セラミック焼結体基板の穴位置算出方法 - Google Patents
セラミック焼結体基板の穴位置算出方法Info
- Publication number
- JPS5998581A JPS5998581A JP20835482A JP20835482A JPS5998581A JP S5998581 A JPS5998581 A JP S5998581A JP 20835482 A JP20835482 A JP 20835482A JP 20835482 A JP20835482 A JP 20835482A JP S5998581 A JPS5998581 A JP S5998581A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- ceramic sintered
- hole
- sintered substrate
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 24
- 239000000919 ceramic Substances 0.000 title claims description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000005245 sintering Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP20835482A JPS5998581A (ja) | 1982-11-26 | 1982-11-26 | セラミック焼結体基板の穴位置算出方法 | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP20835482A JPS5998581A (ja) | 1982-11-26 | 1982-11-26 | セラミック焼結体基板の穴位置算出方法 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPS5998581A true JPS5998581A (ja) | 1984-06-06 | 
| JPH0226383B2 JPH0226383B2 (cs) | 1990-06-08 | 
Family
ID=16554893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP20835482A Granted JPS5998581A (ja) | 1982-11-26 | 1982-11-26 | セラミック焼結体基板の穴位置算出方法 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPS5998581A (cs) | 
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS60161614A (ja) * | 1984-02-02 | 1985-08-23 | Oki Electric Ind Co Ltd | 基板管理方法 | 
- 
        1982
        - 1982-11-26 JP JP20835482A patent/JPS5998581A/ja active Granted
 
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS60161614A (ja) * | 1984-02-02 | 1985-08-23 | Oki Electric Ind Co Ltd | 基板管理方法 | 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPH0226383B2 (cs) | 1990-06-08 | 
Similar Documents
| Publication | Publication Date | Title | 
|---|---|---|
| JPS6099542A (ja) | ジグ | |
| JPS5998581A (ja) | セラミック焼結体基板の穴位置算出方法 | |
| JPS63241983A (ja) | 回路配線基板 | |
| JPS61196593A (ja) | 印刷配線板 | |
| JPH04147660A (ja) | 電子部品 | |
| JPH03228392A (ja) | プリント基板 | |
| JPS59148387A (ja) | セラミツク焼結体基板の穴加工方法 | |
| JPS60231383A (ja) | プリント配線板 | |
| JP2839013B2 (ja) | 多端子デバイスカバー | |
| JPS5833711Y2 (ja) | 電子回路用プリント基板 | |
| JPS59117139A (ja) | 半導体装置 | |
| JPS6024042A (ja) | 回路部品の実装構造 | |
| JPS60186086A (ja) | プリント配線板 | |
| JPH04208589A (ja) | プリント基板の部品実装構造 | |
| JPS58225696A (ja) | 印刷配線基板 | |
| JPH0683914A (ja) | プリント基板の部品実装情報出力方法 | |
| JPH0520359U (ja) | プリント回路基板 | |
| JPS61253890A (ja) | プリント配線板 | |
| JPS6050990A (ja) | チツプ部品搭載用基板 | |
| JPS6341003A (ja) | チツプ形電子部品の製造方法 | |
| JPS6027185A (ja) | 混成集積回路基板の製造方法 | |
| JPS59150490A (ja) | フラツトパツケ−ジ | |
| JPH051266U (ja) | 巻線部品の実装構造 | |
| JPS62133791A (ja) | リ−ド付回路基板 | |
| JPS60240179A (ja) | ガイドマ−ク |