JPS59915A - 積層回路部品の製造方法 - Google Patents
積層回路部品の製造方法Info
- Publication number
- JPS59915A JPS59915A JP11052482A JP11052482A JPS59915A JP S59915 A JPS59915 A JP S59915A JP 11052482 A JP11052482 A JP 11052482A JP 11052482 A JP11052482 A JP 11052482A JP S59915 A JPS59915 A JP S59915A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- layer
- circuit
- dielectric
- laminated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 15
- 239000003990 capacitor Substances 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 7
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000003985 ceramic capacitor Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 32
- 238000009792 diffusion process Methods 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 239000002344 surface layer Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11052482A JPS59915A (ja) | 1982-06-25 | 1982-06-25 | 積層回路部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11052482A JPS59915A (ja) | 1982-06-25 | 1982-06-25 | 積層回路部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59915A true JPS59915A (ja) | 1984-01-06 |
| JPH038573B2 JPH038573B2 (enrdf_load_stackoverflow) | 1991-02-06 |
Family
ID=14537980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11052482A Granted JPS59915A (ja) | 1982-06-25 | 1982-06-25 | 積層回路部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59915A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013171970A (ja) * | 2012-02-21 | 2013-09-02 | Soshin Electric Co Ltd | コンデンサモジュール |
-
1982
- 1982-06-25 JP JP11052482A patent/JPS59915A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013171970A (ja) * | 2012-02-21 | 2013-09-02 | Soshin Electric Co Ltd | コンデンサモジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH038573B2 (enrdf_load_stackoverflow) | 1991-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR930010076B1 (ko) | 다층혼성집적회로 | |
| JPH07326536A (ja) | セラミックコンデンサ | |
| US20220399436A1 (en) | Capacitor | |
| JP2970334B2 (ja) | チップ形３端子コンデンサ | |
| JPH10308584A (ja) | セラミック多層基板およびその製造方法 | |
| JPH0115164Y2 (enrdf_load_stackoverflow) | ||
| JP7688514B2 (ja) | セラミック電子部品および実装基板 | |
| JPH1167586A (ja) | チップ型ネットワーク電子部品 | |
| JPS59915A (ja) | 積層回路部品の製造方法 | |
| JP2003163559A (ja) | フィルタを有する回路基板 | |
| JP3246166B2 (ja) | 薄膜コンデンサ | |
| JPS5917227A (ja) | 複合積層セラミツク部品の製造方法 | |
| JP3248294B2 (ja) | チップインダクタ及びその製造方法 | |
| JPH11329845A (ja) | 電子部品及びその製造方法 | |
| JPH0817675A (ja) | チップ型積層セラミックコンデンサ | |
| JP3600734B2 (ja) | 薄膜コンデンサおよび基板 | |
| JPH05347227A (ja) | 積層薄膜コンデンサ | |
| JP3597874B2 (ja) | 複合集積回路部品の製造方法 | |
| JPH038572B2 (enrdf_load_stackoverflow) | ||
| JPH11345734A (ja) | 積層セラミックコンデンサ | |
| JPH08181445A (ja) | セラミックス多層基板 | |
| JPS58225628A (ja) | 積層回路部品の製造方法 | |
| JPH0315329B2 (enrdf_load_stackoverflow) | ||
| JPS6092697A (ja) | 複合積層セラミツク部品 | |
| JP2537893B2 (ja) | 電子回路基板の製造方法 |