JPS5988830A - 化合物半導体基板表面上にパッシベーション層を形成する方法 - Google Patents

化合物半導体基板表面上にパッシベーション層を形成する方法

Info

Publication number
JPS5988830A
JPS5988830A JP58146793A JP14679383A JPS5988830A JP S5988830 A JPS5988830 A JP S5988830A JP 58146793 A JP58146793 A JP 58146793A JP 14679383 A JP14679383 A JP 14679383A JP S5988830 A JPS5988830 A JP S5988830A
Authority
JP
Japan
Prior art keywords
layer
gaas
substrate
arsenic
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58146793A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0218579B2 (enExample
Inventor
ジヨン・ロ−レンス・フリ−オウフ
ト−マス・ネルソン・ジヤクソン
ピ−タ−・オ−ルハフエン
ジヨ−ジ・デ−ビツド・ベテイツト
ジエリ−・マツクフア−ソン・ウツド−ル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5988830A publication Critical patent/JPS5988830A/ja
Publication of JPH0218579B2 publication Critical patent/JPH0218579B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/481—Encapsulations, e.g. protective coatings characterised by their materials comprising semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
    • H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists

Landscapes

  • Formation Of Insulating Films (AREA)
  • Weting (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP58146793A 1982-11-10 1983-08-12 化合物半導体基板表面上にパッシベーション層を形成する方法 Granted JPS5988830A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US44065482A 1982-11-10 1982-11-10
US440654 1982-11-10

Publications (2)

Publication Number Publication Date
JPS5988830A true JPS5988830A (ja) 1984-05-22
JPH0218579B2 JPH0218579B2 (enExample) 1990-04-26

Family

ID=23749634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58146793A Granted JPS5988830A (ja) 1982-11-10 1983-08-12 化合物半導体基板表面上にパッシベーション層を形成する方法

Country Status (3)

Country Link
EP (1) EP0108910B1 (enExample)
JP (1) JPS5988830A (enExample)
DE (1) DE3379701D1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5247349A (en) * 1982-11-16 1993-09-21 Stauffer Chemical Company Passivation and insulation of III-V devices with pnictides, particularly amorphous pnictides having a layer-like structure
AU2992784A (en) * 1983-06-29 1985-01-03 Stauffer Chemical Company Passivation and insulation of iii-v devices with pnictides
DE19900052A1 (de) * 1999-01-04 2000-07-13 Siemens Ag Halbleiterchip und Verfahren zur Herstellung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3959098A (en) * 1973-03-12 1976-05-25 Bell Telephone Laboratories, Incorporated Electrolytic etching of III - V compound semiconductors

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
J.VAC SCI TECHNOL *

Also Published As

Publication number Publication date
JPH0218579B2 (enExample) 1990-04-26
EP0108910B1 (en) 1989-04-19
EP0108910A2 (en) 1984-05-23
EP0108910A3 (en) 1986-09-10
DE3379701D1 (en) 1989-05-24

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