JPS5987825A - ダイ・ボンデイング方法 - Google Patents

ダイ・ボンデイング方法

Info

Publication number
JPS5987825A
JPS5987825A JP57196758A JP19675882A JPS5987825A JP S5987825 A JPS5987825 A JP S5987825A JP 57196758 A JP57196758 A JP 57196758A JP 19675882 A JP19675882 A JP 19675882A JP S5987825 A JPS5987825 A JP S5987825A
Authority
JP
Japan
Prior art keywords
semiconductor laser
bonding
submount
heating element
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57196758A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0554260B2 (enExample
Inventor
Toshio Yamamoto
俊夫 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP57196758A priority Critical patent/JPS5987825A/ja
Publication of JPS5987825A publication Critical patent/JPS5987825A/ja
Publication of JPH0554260B2 publication Critical patent/JPH0554260B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07337—
    • H10W72/352—
    • H10W72/354—

Landscapes

  • Die Bonding (AREA)
  • Semiconductor Lasers (AREA)
JP57196758A 1982-11-11 1982-11-11 ダイ・ボンデイング方法 Granted JPS5987825A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57196758A JPS5987825A (ja) 1982-11-11 1982-11-11 ダイ・ボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57196758A JPS5987825A (ja) 1982-11-11 1982-11-11 ダイ・ボンデイング方法

Publications (2)

Publication Number Publication Date
JPS5987825A true JPS5987825A (ja) 1984-05-21
JPH0554260B2 JPH0554260B2 (enExample) 1993-08-12

Family

ID=16363123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57196758A Granted JPS5987825A (ja) 1982-11-11 1982-11-11 ダイ・ボンデイング方法

Country Status (1)

Country Link
JP (1) JPS5987825A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01121927U (enExample) * 1988-02-12 1989-08-18
GB2377402A (en) * 2001-07-12 2003-01-15 Agilent Technologies Inc Die bond strip

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54100258A (en) * 1978-01-25 1979-08-07 Hitachi Ltd Pellet bonding method
JPS55110048A (en) * 1979-02-16 1980-08-25 Hitachi Ltd Pellet bonding method
JPS5624941A (en) * 1979-08-07 1981-03-10 Mitsubishi Electric Corp Manufacture of semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54100258A (en) * 1978-01-25 1979-08-07 Hitachi Ltd Pellet bonding method
JPS55110048A (en) * 1979-02-16 1980-08-25 Hitachi Ltd Pellet bonding method
JPS5624941A (en) * 1979-08-07 1981-03-10 Mitsubishi Electric Corp Manufacture of semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01121927U (enExample) * 1988-02-12 1989-08-18
GB2377402A (en) * 2001-07-12 2003-01-15 Agilent Technologies Inc Die bond strip
GB2377402B (en) * 2001-07-12 2004-05-12 Agilent Technologies Inc Improved diebond strip
US7559455B2 (en) 2001-07-12 2009-07-14 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Diebond strip

Also Published As

Publication number Publication date
JPH0554260B2 (enExample) 1993-08-12

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