JPS5986226A - 薄板状材の洗浄装置 - Google Patents
薄板状材の洗浄装置Info
- Publication number
- JPS5986226A JPS5986226A JP57197207A JP19720782A JPS5986226A JP S5986226 A JPS5986226 A JP S5986226A JP 57197207 A JP57197207 A JP 57197207A JP 19720782 A JP19720782 A JP 19720782A JP S5986226 A JPS5986226 A JP S5986226A
- Authority
- JP
- Japan
- Prior art keywords
- thin plate
- cleaning
- cleaning device
- high speed
- units
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 32
- 238000004140 cleaning Methods 0.000 title claims abstract description 28
- 239000011521 glass Substances 0.000 claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000007788 liquid Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000003086 colorant Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 abstract description 3
- 239000004809 Teflon Substances 0.000 abstract description 2
- 229920006362 Teflon® Polymers 0.000 abstract description 2
- 239000007769 metal material Substances 0.000 abstract description 2
- 229920003002 synthetic resin Polymers 0.000 abstract description 2
- 239000000057 synthetic resin Substances 0.000 abstract description 2
- 238000011109 contamination Methods 0.000 abstract 2
- 239000011148 porous material Substances 0.000 abstract 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 229910021642 ultra pure water Inorganic materials 0.000 description 3
- 239000012498 ultrapure water Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Cleaning In General (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57197207A JPS5986226A (ja) | 1982-11-08 | 1982-11-08 | 薄板状材の洗浄装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57197207A JPS5986226A (ja) | 1982-11-08 | 1982-11-08 | 薄板状材の洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5986226A true JPS5986226A (ja) | 1984-05-18 |
JPS6226175B2 JPS6226175B2 (US07714131-20100511-C00038.png) | 1987-06-08 |
Family
ID=16370598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57197207A Granted JPS5986226A (ja) | 1982-11-08 | 1982-11-08 | 薄板状材の洗浄装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5986226A (US07714131-20100511-C00038.png) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998002904A1 (en) * | 1996-07-15 | 1998-01-22 | Oliver Design, Inc. | Wafer cleaning apparatus |
EP0914216A1 (en) * | 1995-10-13 | 1999-05-12 | Ontrak Systems, Inc. | Method and apparatus for chemical delivery through the brush |
US6230753B1 (en) | 1996-07-15 | 2001-05-15 | Lam Research Corporation | Wafer cleaning apparatus |
EP1107290A2 (en) * | 1999-12-03 | 2001-06-13 | LAM Research Corporation | Wafer scrubbing brush core |
US6247197B1 (en) | 1998-07-09 | 2001-06-19 | Lam Research Corporation | Brush interflow distributor |
EP1698404A1 (en) * | 2003-12-26 | 2006-09-06 | Aion Co., Ltd. | Core for washing sponge roller |
-
1982
- 1982-11-08 JP JP57197207A patent/JPS5986226A/ja active Granted
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0914216A4 (US07714131-20100511-C00038.png) * | 1995-10-13 | 1999-05-12 | ||
EP1046433A1 (en) * | 1995-10-13 | 2000-10-25 | Lam Research Corporation | Method and apparatus for chemical delivery through the brush |
EP0914216A1 (en) * | 1995-10-13 | 1999-05-12 | Ontrak Systems, Inc. | Method and apparatus for chemical delivery through the brush |
US6230753B1 (en) | 1996-07-15 | 2001-05-15 | Lam Research Corporation | Wafer cleaning apparatus |
US5875507A (en) * | 1996-07-15 | 1999-03-02 | Oliver Design, Inc. | Wafer cleaning apparatus |
US6143089A (en) * | 1996-07-15 | 2000-11-07 | Lam Research Corporation | Method of cleaning semiconductor wafers and other substrates |
WO1998002904A1 (en) * | 1996-07-15 | 1998-01-22 | Oliver Design, Inc. | Wafer cleaning apparatus |
US6345404B1 (en) | 1996-07-15 | 2002-02-12 | Lam Research Corporation | Wafer cleaning apparatus |
US6247197B1 (en) | 1998-07-09 | 2001-06-19 | Lam Research Corporation | Brush interflow distributor |
US6464796B2 (en) * | 1998-07-09 | 2002-10-15 | Lam Research Corporation | Methods for applying fluid through a brush interflow distributor |
EP1107290A2 (en) * | 1999-12-03 | 2001-06-13 | LAM Research Corporation | Wafer scrubbing brush core |
EP1107290A3 (en) * | 1999-12-03 | 2003-04-02 | LAM Research Corporation | Wafer scrubbing brush core |
EP1698404A1 (en) * | 2003-12-26 | 2006-09-06 | Aion Co., Ltd. | Core for washing sponge roller |
EP1698404A4 (en) * | 2003-12-26 | 2012-05-16 | Aion Co Ltd | CORE FOR WASHING A SPONGE ROLL |
Also Published As
Publication number | Publication date |
---|---|
JPS6226175B2 (US07714131-20100511-C00038.png) | 1987-06-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5868866A (en) | Method of and apparatus for cleaning workpiece | |
JP3299281B2 (ja) | 表面を入念に洗浄するための方法と装置 | |
KR102316901B1 (ko) | 기판 처리 방법 및 기판 처리 장치 | |
US20070125400A1 (en) | In-line wafer cleaning system and method | |
JP3341727B2 (ja) | ウエット装置 | |
JPS5986226A (ja) | 薄板状材の洗浄装置 | |
JP4033709B2 (ja) | 基板洗浄方法及びその装置 | |
JP2007036066A (ja) | 枚葉式基板処理装置 | |
JPH02253620A (ja) | 半導体基板の洗浄装置 | |
KR100405449B1 (ko) | 반도체 웨이퍼용 세정장치 | |
JP2001168067A (ja) | ダイシング装置 | |
KR100858240B1 (ko) | 기판 스핀 장치 | |
JP2023050877A (ja) | 洗浄装置 | |
JPH09306974A (ja) | ワーク保持装置 | |
JPH06260468A (ja) | 半導体基板洗浄装置 | |
JP2005123353A (ja) | ブラシおよび洗浄装置 | |
JP3331390B2 (ja) | 基板の洗浄装置 | |
JPH0936076A (ja) | 洗浄装置 | |
KR102620817B1 (ko) | 웨이퍼 세정장치 | |
JP7353042B2 (ja) | ブラシ洗浄装置 | |
JPH05121385A (ja) | 洗浄装置 | |
JP2003007668A (ja) | 半導体ウェーハの洗浄装置及び洗浄方法 | |
JP3665155B2 (ja) | 電子部品基板の洗浄装置 | |
JPH04150027A (ja) | ウエハ洗浄装置 | |
JP2000331974A (ja) | 基板回転処理装置 |