JPS5986226A - Cleaning device for thin plate material - Google Patents
Cleaning device for thin plate materialInfo
- Publication number
- JPS5986226A JPS5986226A JP57197207A JP19720782A JPS5986226A JP S5986226 A JPS5986226 A JP S5986226A JP 57197207 A JP57197207 A JP 57197207A JP 19720782 A JP19720782 A JP 19720782A JP S5986226 A JPS5986226 A JP S5986226A
- Authority
- JP
- Japan
- Prior art keywords
- thin plate
- cleaning
- cleaning device
- high speed
- units
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 32
- 238000004140 cleaning Methods 0.000 title claims abstract description 28
- 239000011521 glass Substances 0.000 claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000007788 liquid Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000003086 colorant Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 abstract description 3
- 239000004809 Teflon Substances 0.000 abstract description 2
- 229920006362 Teflon® Polymers 0.000 abstract description 2
- 239000007769 metal material Substances 0.000 abstract description 2
- 229920003002 synthetic resin Polymers 0.000 abstract description 2
- 239000000057 synthetic resin Substances 0.000 abstract description 2
- 238000011109 contamination Methods 0.000 abstract 2
- 239000011148 porous material Substances 0.000 abstract 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 229910021642 ultra pure water Inorganic materials 0.000 description 3
- 239000012498 ultrapure water Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B08B1/32—
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は、半導体ウェーノーやウエーノ島の製造工程
に使用されるガラスマスクなど、薄板状材に付着したほ
こりなどの異物を除去する、薄板状材の洗浄装置に関す
る。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a thin plate-shaped material that removes foreign matter such as dust attached to a thin plate-shaped material such as a glass mask used in the manufacturing process of semiconductor Waeno and Waeno Island. The present invention relates to a cleaning device.
従来のガラスマスクの洗浄装置は、第1図に要部を断面
図で示すようになつ°Cいた。(1)は半導体ウェーハ
の製造工程において、パターン形成のた′め使用される
ガラスマスク、(2)は高圧水吹付はノズルで、高圧水
(3)が供給されガラスマスクfi1面に射出され、表
面を洗浄するようにしている。A conventional glass mask cleaning apparatus has been constructed as shown in FIG. 1 in cross-sectional view. (1) is a glass mask used for pattern formation in the manufacturing process of semiconductor wafers, (2) is a nozzle for high-pressure water spraying, and high-pressure water (3) is supplied and injected onto the glass mask fi1 surface. I try to clean the surface.
上記従来の装置において、高圧水(2)には約100気
圧の純水が供給され、吹付はノズル(2)の先端の約1
00μmの孔から射出され、約300Orpmで回転さ
れているガラスマスクf1+に吹付け、吹付はノズル(
2)がガラスマスクillの中心位置から半径方向に移
動し、表面に+Jmしている汚れを除去するようにして
いる。In the above-mentioned conventional device, pure water at about 100 atmospheres is supplied to the high-pressure water (2), and the spray is applied to about 100 meters from the tip of the nozzle (2).
It is injected from a hole of 00 μm and sprayed onto the glass mask f1+ which is being rotated at about 300 rpm.
2) is moved in the radial direction from the center position of the glass mask ill to remove +Jm of dirt on the surface.
上記従来の装置では、高圧水の吹付けによってコロナ放
電が発生し、ガラスマスクtllN面に形成しである金
属薄膜パターンの先端が除去される現象が生じ、マスク
洗浄回数が制限される欠点があつた。The above-mentioned conventional apparatus has the disadvantage that the spraying of high-pressure water generates corona discharge and removes the tip of the metal thin film pattern formed on the tllN surface of the glass mask, which limits the number of times the mask can be cleaned. Ta.
また、従来のガラスマスクの洗浄装置の他の例を、第2
図に要部断面図で示す。(4)はブラシで、高速回転さ
れ、高速回転されているガラスマスク11+の表面に接
触し、ガラスマスクil+の中心位置から半径方向に移
動し、ブラシの中央又は毛先部に外部から供給の純水を
潤滑剤として注水し、ガラスマスクi11表面に付着し
ている汚れを除くようにしている。In addition, another example of the conventional glass mask cleaning device is shown in the second example.
The figure shows a cross-sectional view of the main part. (4) is a brush that is rotated at high speed, contacts the surface of the glass mask 11+ that is being rotated at high speed, moves in the radial direction from the center position of the glass mask il+, and supplies the brush from the outside to the center or tip of the brush. Pure water is injected as a lubricant to remove dirt adhering to the surface of the glass mask i11.
この第2図に示す従来の装置では、ブラシ(4)がガラ
スマスク(1)表面に接しているため、ブラシ(4)の
汚れなどがかえってガラスマスクfilに付着したり、
さらに、ガラスマスク(1)の金属薄膜パターンのリフ
トオフ修正箇所における蒸着金島膜のはく離等を生じる
欠点があった。In the conventional device shown in FIG. 2, since the brush (4) is in contact with the surface of the glass mask (1), dirt on the brush (4) may instead adhere to the glass mask fil.
Furthermore, there was a drawback that the vapor-deposited gold island film peeled off at the lift-off correction location of the metal thin film pattern of the glass mask (1).
この発明は、上記従来装置の欠点をなくするためになさ
れたもので、円筒形をなし内径側から外径側に連通ずる
無数の小すき間を有する案内体を、多数の小穴があけら
れた管状軸にはめ込み固着し、薄板状材の少なくとも片
側面を上記案内体の外径部に小ずき間をあけて配し、管
状軸により案内体を高速回転し、なから管状軸内に供給
する純水を案内体により吹出して薄板状月面を洗い流し
、薄板状材の表面を損傷することなく汚れを確実に除去
する、薄板状材の洗浄装置を提供することを目的として
いる。This invention was made in order to eliminate the drawbacks of the above-mentioned conventional devices, and the guide body has a cylindrical shape and has countless small gaps communicating from the inner diameter side to the outer diameter side. The thin plate material is fitted into the shaft and fixed, and at least one side of the thin plate material is placed on the outer diameter of the guide body with a small gap, the guide body is rotated at high speed by the tubular shaft, and the material is fed into the tubular shaft. It is an object of the present invention to provide a cleaning device for a thin plate-shaped material, which blows out pure water using a guide body to wash away the thin plate-shaped lunar surface and reliably removes dirt without damaging the surface of the thin plate-shaped material.
′m3図はこの発明の一実施例によるガラスマスクの洗
浄装置の禦部を示す縦断面図である。(lO)は縦に平
行配設の1対の管状軸で、上側の周囲に多数の小穴(1
1)が設けられ、図示を略した下部の駆動装置により高
速回転される。θ2)は管状軸(lO)の上端をふさぐ
ふた、(+鎖は円筒形をなし、無数の海綿状すき間を有
して内径側から外径側に連通し、ている1対のスポンジ
体で、それぞれ管状軸(101にはめ込み固着されてい
る。双方のスポンジ体03)間の中間には、ガラスマス
ク111が小すき間(約1mm)をあけて配置されてい
る。Figure 'm3 is a longitudinal cross-sectional view showing the edge of a glass mask cleaning device according to an embodiment of the present invention. (lO) is a pair of tubular shafts arranged vertically in parallel, with many small holes (1
1), and is rotated at high speed by a lower driving device (not shown). θ2) is a lid that closes the upper end of the tubular shaft (lO), and (+ chain is a pair of sponge bodies that are cylindrical and communicate from the inner diameter side to the outer diameter side with countless spongy gaps. , respectively, and a glass mask 111 is placed in the middle between the two sponge bodies 03 with a small gap (approximately 1 mm) therebetween.
管状軸(lO(に固着されたスホンジ体Q刊を、第4図
に一部を破断した斜視図で示す。管状軸(lO)は金属
材又はテフロン材など合成樹脂材からなり、直径約5
mmの小穴(Iliか多111設けられである。管状軸
(Iolには下方から超純水θ4)が供′給され、小穴
(11)からスポンジ体(+31内に流動し外径側から
画状に噴出する0
上記一実施例の装置の洗浄作用は、次のようになる。双
方の管状軸(101を約3000rpmの高速回転し、
各スポンジ体帥を回転させる。これにより、高速回転す
るスポンジ体0渇の外径部から超純水(+4)が遠心力
により噴出し、双方のスポンジ体(13)に対し相対的
平行移動するガラスマスク[11の両側面に当り、付着
している汚れを洗い流す。Fig. 4 shows a partially cutaway perspective view of the Suhonji body Q magazine fixed to the tubular shaft (lO). The tubular shaft (lO) is made of a metal material or a synthetic resin material such as Teflon material, and has a diameter of about 5
A tubular shaft (Ultra-pure water θ4) is supplied from below to the tubular shaft, flows into the sponge body (+31) from the small hole (11), and is drawn from the outer diameter side. The cleaning action of the device of the above embodiment is as follows: Both tubular shafts (101) are rotated at a high speed of about 3000 rpm,
Rotate each sponge body. As a result, ultrapure water (+4) is ejected by centrifugal force from the outer diameter of the sponge body (13) rotating at high speed, and the glass mask [11] moves in parallel with both sponge bodies (13). Wash away any dirt that may have adhered to it.
このように、ガラスマスクil+の全面に一様に純水(
14jが当るので、従来の高圧水吹付けのように、コロ
ナ放電によるパターンの削れかなくなり、また、従来の
ブラシ(4)によるように、ガラスマスク(1)に接触
することなく、非接触であるので、汚れの再付着や金属
薄膜のはく離等の現象が生じなくなる。実使用結果によ
れば、洗浄効果は第1図の従来装置と同一であり、ガラ
スマスク(1)の寿命が延長された。In this way, pure water (
14j, unlike conventional high-pressure water spraying, the pattern is not scratched by corona discharge, and unlike conventional brush (4), it does not come into contact with the glass mask (1). Therefore, phenomena such as redeposition of dirt and peeling of the thin metal film do not occur. According to the results of actual use, the cleaning effect is the same as that of the conventional device shown in FIG. 1, and the life of the glass mask (1) is extended.
なお、上記実施例では、洗浄する薄板状材としてガラス
マスク(+)の場合を示したが、他の材質のマスクであ
ってもよく、さらに、半樽体ウェーハ、又はパターンな
どが施された薄板状材の場合にも適用できるものである
。In the above embodiment, a glass mask (+) was used as the thin plate-like material to be cleaned, but a mask made of other materials may also be used. This method can also be applied to thin plate materials.
また、上記実施例では洗浄液として超純水を使用した場
合を説明したが、純水、又は対象薄板状材によっては、
それに適応した洗浄液を用いてもよい。In addition, although the above embodiment describes the case where ultrapure water is used as the cleaning liquid, depending on the pure water or the target thin plate material,
A cleaning solution suitable for this purpose may be used.
さらに、上記実施例では、ガラスマスク(1)の両面を
同時に洗浄する場合を示【7たが、片面でよい場合は、
スポンジ状体(+$1を一方側のみに配設した装置にし
てもよい。Furthermore, in the above embodiment, a case where both sides of the glass mask (1) are cleaned at the same time is shown [7], but if only one side is required,
The device may have a sponge-like body (+$1) placed only on one side.
なおまた、上記実施例では、内径側がら外径側に連通ず
る無数の小ずき間を有する円筒状の案内体として、スポ
ンジ体部を用いたが、これに限らず、例えば円筒状のプ
2シを用いてもよい。Furthermore, in the above embodiment, a sponge body portion is used as the cylindrical guide body having numerous small gaps communicating from the inner diameter side to the outer diameter side, but the sponge body portion is not limited to this, and for example, a cylindrical guide body may be used. 2 shi may be used.
以上のように、この発明によれば、内径側から外径側に
連通する無数の小すき間を有する円筒状の案内体を、多
数の小穴があけられた管状軸にはめ込み、薄板状材の表
面に対し上記案内体の外周面を小すき間をあけて配し、
管状軸により案内体を高速回転させ、管状軸内に洗浄液
を供給し案内体の外周から噴出し薄板状材面を洗い流す
ようにしたので、薄板状材の表面を損傷することなく汚
れが除去され、ガラスマスクなどの場合は、使用寿命が
延長される効果がある。As described above, according to the present invention, a cylindrical guide body having countless small gaps communicating from the inner diameter side to the outer diameter side is fitted into a tubular shaft having a large number of small holes, and the surface of the thin plate material is The outer peripheral surface of the guide body is arranged with a small gap,
The guide body is rotated at high speed by the tubular shaft, and the cleaning liquid is supplied into the tubular shaft and sprayed from the outer periphery of the guide body to wash away the surface of the thin sheet material, so dirt can be removed without damaging the surface of the thin sheet material. , glass masks, etc. have the effect of extending their useful life.
第1図は従来のガラスマスクの洗浄装置を示す要部の正
面断面図、第2図は従来の他の例のガラスマスクの洗浄
装置を示す要部の正面断面図、第3図はこの発明の一実
施例によるガラスマスクの洗浄装置を示す要部の縦断面
図、第4図は第3図のスポンジ体部を一部破断して示す
斜視図である。
図において、l・・・薄板状材をなすガラスマスク、1
0・・・管状軸、11・・・小孔、13・・・案内体を
なすスポンジ体、14・・・洗浄液をなす純水。
なお、図中同一符号は同−又は相当部分を示す。FIG. 1 is a front sectional view of the main parts of a conventional glass mask cleaning device, FIG. 2 is a front sectional view of the main parts of another conventional glass mask cleaning device, and FIG. 3 is the invention. FIG. 4 is a longitudinal sectional view of a main part of a glass mask cleaning device according to an embodiment of the present invention, and FIG. 4 is a partially cutaway perspective view of the sponge body shown in FIG. In the figure, l...glass mask forming a thin plate-like material, 1
0... Tubular shaft, 11... Small hole, 13... Sponge body forming a guide, 14... Pure water forming a cleaning liquid. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
回転され内部に供給される洗浄液を上記各小孔から放射
する管状軸、及び円筒形をなし、無数の小すき間が形成
されていて互いに内径側から外径側に連通しており、上
記管状軸の外円周部にはめ込み固着されていて高速回転
され、管状軸の各小孔からの上記洗浄液を外径側から画
状に噴出する案内体を備え、この案内体の外径部に対し
小すき間をあけて薄板状材を平行に配し、この薄板状材
を案内体に相対的に平行移動させ表面の汚れを上記噴出
する洗浄液により流し落すようにした薄板状材の洗浄装
置。 (2)管状軸に案内体を固着したl対の組を、双方の案
内体の外径部間を間隔をあけて平行配置し、これらの案
内体間に薄板状材を両面側とも小す色間をあけて平行に
配し、両面を同時に洗浄するようにしたことを特徴とす
る特許請求の範囲第1項記載の薄板状材の洗浄装置。 (3) 案内体はスポンジ体からなることを特徴とす
る特許請求の範囲第1項又は第2項記載の薄板状材の洗
浄装置。 (4)案内体はブラシ俸からなることを特徴とする特許
請求の範囲第1項又は第2項記載の薄板状材の洗浄装置
。 (6)薄板状材はガラスマスクからなり、洗浄液に純水
を用いたことを特徴とする特許請求の範囲第1項ないし
i@4項のいづれかの項記載の薄板状材の洗浄装置。 (6) 薄板状材は半導体ウェーノーからなり、洗浄
液に純水を用いたことを特徴とする特許請求の範囲第1
項ないし第4項のいづれかの項記載の薄板状材の洗浄装
置。[Scope of Claims] +11 A tubular shaft having a large number of small holes in its circumference, which is rotated at high speed and radiates the cleaning liquid supplied inside from each of the small holes, and a cylindrical shaft with numerous small holes. A gap is formed and they communicate with each other from the inner diameter side to the outer diameter side, and are fitted and fixed to the outer circumference of the tubular shaft and rotated at high speed, allowing the cleaning liquid from each small hole of the tubular shaft to flow through the outer diameter side. A guide body ejects from the side in a pattern, a thin plate material is placed parallel to the outer diameter of the guide body with a small gap, and the thin plate material is moved parallel to the guide body to create a surface. A cleaning device for thin plate-shaped materials, which is configured to wash off dirt with the jetting cleaning liquid. (2) L pairs of guide bodies fixed to tubular shafts are arranged in parallel with a gap between the outer diameters of both guide bodies, and a thin plate material is placed between these guide bodies on both sides. 2. The cleaning device for thin plate-shaped materials according to claim 1, wherein the cleaning device is arranged in parallel with a gap between colors so that both surfaces can be cleaned at the same time. (3) A cleaning device for a thin plate material according to claim 1 or 2, wherein the guide body is made of a sponge body. (4) The apparatus for cleaning thin plate-shaped materials according to claim 1 or 2, wherein the guide body is made of a brush. (6) The apparatus for cleaning a thin plate-like material according to any one of claims 1 to 4, wherein the thin plate-like material is made of a glass mask, and pure water is used as the cleaning liquid. (6) Claim 1, characterized in that the thin plate material is made of semiconductor wafer, and pure water is used as the cleaning liquid.
A cleaning device for a thin plate-like material as described in any one of Items 1 to 4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57197207A JPS5986226A (en) | 1982-11-08 | 1982-11-08 | Cleaning device for thin plate material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57197207A JPS5986226A (en) | 1982-11-08 | 1982-11-08 | Cleaning device for thin plate material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5986226A true JPS5986226A (en) | 1984-05-18 |
JPS6226175B2 JPS6226175B2 (en) | 1987-06-08 |
Family
ID=16370598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57197207A Granted JPS5986226A (en) | 1982-11-08 | 1982-11-08 | Cleaning device for thin plate material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5986226A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998002904A1 (en) * | 1996-07-15 | 1998-01-22 | Oliver Design, Inc. | Wafer cleaning apparatus |
EP0914216A1 (en) * | 1995-10-13 | 1999-05-12 | Ontrak Systems, Inc. | Method and apparatus for chemical delivery through the brush |
US6230753B1 (en) | 1996-07-15 | 2001-05-15 | Lam Research Corporation | Wafer cleaning apparatus |
EP1107290A2 (en) * | 1999-12-03 | 2001-06-13 | LAM Research Corporation | Wafer scrubbing brush core |
US6247197B1 (en) | 1998-07-09 | 2001-06-19 | Lam Research Corporation | Brush interflow distributor |
EP1698404A1 (en) * | 2003-12-26 | 2006-09-06 | Aion Co., Ltd. | Core for washing sponge roller |
-
1982
- 1982-11-08 JP JP57197207A patent/JPS5986226A/en active Granted
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0914216A4 (en) * | 1995-10-13 | 1999-05-12 | ||
EP1046433A1 (en) * | 1995-10-13 | 2000-10-25 | Lam Research Corporation | Method and apparatus for chemical delivery through the brush |
EP0914216A1 (en) * | 1995-10-13 | 1999-05-12 | Ontrak Systems, Inc. | Method and apparatus for chemical delivery through the brush |
US6230753B1 (en) | 1996-07-15 | 2001-05-15 | Lam Research Corporation | Wafer cleaning apparatus |
US5875507A (en) * | 1996-07-15 | 1999-03-02 | Oliver Design, Inc. | Wafer cleaning apparatus |
US6143089A (en) * | 1996-07-15 | 2000-11-07 | Lam Research Corporation | Method of cleaning semiconductor wafers and other substrates |
WO1998002904A1 (en) * | 1996-07-15 | 1998-01-22 | Oliver Design, Inc. | Wafer cleaning apparatus |
US6345404B1 (en) | 1996-07-15 | 2002-02-12 | Lam Research Corporation | Wafer cleaning apparatus |
US6247197B1 (en) | 1998-07-09 | 2001-06-19 | Lam Research Corporation | Brush interflow distributor |
US6464796B2 (en) * | 1998-07-09 | 2002-10-15 | Lam Research Corporation | Methods for applying fluid through a brush interflow distributor |
EP1107290A2 (en) * | 1999-12-03 | 2001-06-13 | LAM Research Corporation | Wafer scrubbing brush core |
EP1107290A3 (en) * | 1999-12-03 | 2003-04-02 | LAM Research Corporation | Wafer scrubbing brush core |
EP1698404A1 (en) * | 2003-12-26 | 2006-09-06 | Aion Co., Ltd. | Core for washing sponge roller |
EP1698404A4 (en) * | 2003-12-26 | 2012-05-16 | Aion Co Ltd | Core for washing sponge roller |
Also Published As
Publication number | Publication date |
---|---|
JPS6226175B2 (en) | 1987-06-08 |
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