JPH05121385A - Cleaning device - Google Patents

Cleaning device

Info

Publication number
JPH05121385A
JPH05121385A JP30987791A JP30987791A JPH05121385A JP H05121385 A JPH05121385 A JP H05121385A JP 30987791 A JP30987791 A JP 30987791A JP 30987791 A JP30987791 A JP 30987791A JP H05121385 A JPH05121385 A JP H05121385A
Authority
JP
Japan
Prior art keywords
cleaning
cleaning liquid
cleaning device
fibers
brush
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30987791A
Other languages
Japanese (ja)
Inventor
Kazuki Kobayashi
和樹 小林
Hiroi Oketani
大亥 桶谷
Hiromitsu Asano
浩充 浅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP30987791A priority Critical patent/JPH05121385A/en
Publication of JPH05121385A publication Critical patent/JPH05121385A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To improve cleaning capacity of a cleaning device to be used in a cleaning step of semiconductor, an electronic component, etc., to simplify the step and to improve an operating efficiency. CONSTITUTION:(1) Several tens to several hundreds of fibers are bundled to form fiber bundles 1, and the bundles 1 are spirally disposed on a rear surface of a rotating plate 2 having a cleanser discharging nozzle 3 at the nozzle 3 as a center. (2) The inner and outer peripheries of the plate 2 are formed of different materials and shapes. Thus, readherence of cleaned contaminants is prevented to enhance a cleaning effect.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半導体や電子部品の製
造組立工程において、ガラス基板やシリコンウェハー、
プリント基板等を洗浄する際に用いられる洗浄装置に関
する。
BACKGROUND OF THE INVENTION The present invention relates to a glass substrate, a silicon wafer,
The present invention relates to a cleaning device used when cleaning a printed circuit board or the like.

【0002】[0002]

【従来の技術】従来、この種の洗浄装置に用いられるブ
ラシは図5に示すように中心に洗浄液の排出ノズル3を
設けた回転板2の裏面に、繊維を数十〜数百本束ねたも
のをひとつの単位とした繊維束1を多数同心円状に植立
して成り、搬送されてきた電子部品(図示せず)等の表
面を洗浄液を排出しつつ回転移動することにより、洗浄
を行うものであった。
2. Description of the Related Art Conventionally, as shown in FIG. 5, a brush used in this type of cleaning device has a dozen to several hundred fibers bundled on the back surface of a rotary plate 2 having a cleaning liquid discharge nozzle 3 at the center. Cleaning is performed by concentrically arranging a number of fiber bundles 1 each of which is a unit, and rotating and moving the surface of conveyed electronic parts (not shown) while discharging the cleaning liquid. It was a thing.

【0003】[0003]

【発明が解決しようとする課題】上述した従来の洗浄装
置のブラシでは、ブラシを構成する繊維の形状、材質に
応じた汚れについては洗浄効果が見られるが、それ以外
の汚れについては洗浄が困難であり、各種の汚染に対応
するためには複数種類のブラシを用意し、数工程に分け
て洗浄を行わなくてはならないという問題点を有してい
た。又、回転板の裏面に繊維束を密に植設しているの
で、中央から供給された洗浄液の排出が円滑に行われ
ず、一度洗浄された汚れが再付着するという問題点もあ
った。本発明は、これら従来の問題点を解決しようとす
るものである。
With the brush of the conventional cleaning device described above, a cleaning effect can be seen with respect to stains depending on the shape and material of the fibers constituting the brush, but it is difficult to wash with other stains. However, in order to deal with various types of contamination, there is a problem that a plurality of types of brushes must be prepared and cleaning must be performed in several steps. Further, since the fiber bundles are densely planted on the back surface of the rotary plate, the cleaning liquid supplied from the center cannot be discharged smoothly, and there is a problem that stains once cleaned are redeposited. The present invention is intended to solve these conventional problems.

【0004】[0004]

【課題を解決する為の手段】本発明は、上記従来の問題
点を解決するために回転板裏面の繊維束を渦巻状に植設
することとし、又、ブラシを構成する繊維の材質や形状
を回転板の内周部と外周部で異ならせることとした。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems of the prior art, the present invention adopts a method in which a fiber bundle on the back surface of a rotary plate is planted in a spiral shape, and the material and shape of the fibers constituting the brush Is different between the inner peripheral portion and the outer peripheral portion of the rotary plate.

【0005】[0005]

【作用】渦巻状に植設された繊維束は、回転板の中心部
から供給された洗浄液の排出を円滑になすように作用す
る。又、材質や形状の異なる繊維は、性質の異なる汚れ
を払拭するように作用するものである。
The fiber bundles which are planted in a spiral shape act so as to smoothly discharge the cleaning liquid supplied from the central portion of the rotary plate. Fibers having different materials and shapes act to wipe off stains having different properties.

【0006】[0006]

【実施例】図1は本発明の一実施例を示す裏面図であ
り、図示しない回転軸の下端に固定された円形の回転板
2の裏面には、その中心に洗浄液の排出ノズル3を設け
ると共に、その周囲に数十〜数百本の繊維を束ねて成る
多数の繊維束1を渦巻状に植設している。
1 is a rear view showing an embodiment of the present invention. A cleaning liquid discharge nozzle 3 is provided at the center of the back surface of a circular rotary plate 2 fixed to the lower end of a rotary shaft (not shown). At the same time, a large number of fiber bundles 1 formed by bundling dozens to hundreds of fibers are spirally planted around it.

【0007】図2は他の実施例を示し、上記実施例と同
様に回転軸4の下端に取り付けられた円形回転板2の裏
面に、その中心に洗浄液の排出ノズル3の先端を臨ませ
ると共に、その周囲に多数の繊維束を植設している。こ
こにおいて、該実施例では回転板の裏面に植設される繊
維束は、その内周部と外周部とで材質が異なっており、
回転板2の内周寄りには軟質繊維から成る繊維束1’
を、外周寄りには硬質繊維から成る繊維束1”を植設し
ている。尚、図中符号5は上記排出ノズル3と連通し、
該排出ノズル3に洗浄液を供給する為の洗浄液供給チュ
ーブを示す。
FIG. 2 shows another embodiment, in which the tip of the cleaning liquid discharge nozzle 3 faces the center of the rear surface of the circular rotary plate 2 attached to the lower end of the rotary shaft 4 as in the above embodiment. , A large number of fiber bundles are planted around it. Here, in the embodiment, the fiber bundle planted on the back surface of the rotating plate is different in material between the inner peripheral portion and the outer peripheral portion,
A fiber bundle 1 ′ made of soft fibers near the inner circumference of the rotary plate 2.
A fiber bundle 1 ″ made of hard fibers is planted near the outer periphery. Reference numeral 5 in the drawing communicates with the discharge nozzle 3,
A cleaning liquid supply tube for supplying a cleaning liquid to the discharge nozzle 3 is shown.

【0008】このようにして成る本発明の洗浄装置の回
転ブラシは、図3及び図4に示すように所定位置に複数
配置され、搬送方向に移動するガラス基板等の被洗浄物
7の表面で回転軸2を中心に回転すると共に、それぞれ
に設けた排出ノズルから洗浄液を排出してその表面を洗
浄するものである。この時、第一の実施例として示した
繊維束を放射状に植設した回転ブラシでは、回転板の中
心から供給された洗浄液は、洗浄の際の該回転板の回転
にしたがって周方向に導かれ、外部に排出される。6は
このようにして洗浄に用いられた洗浄液を被洗浄物7の
表面から排除する為の高圧純水シャワーを示す。よっ
て、洗浄液の滞留が防止され、常に清浄な洗浄液が用い
られる為、高い洗浄効果が得られるものである。又、内
周と外周とで繊維の材質を異ならせた前記第2の実施例
に示した回転ブラシでは、外周部の硬質なブラシで表面
の強固な汚れや比較的大きな異物を落とし、内周部の軟
質なブラシで微細部分の汚れや小粒径の異物を除去し、
異なる種類の汚れを能率良く、同時に除去できるもので
ある。
The rotating brush of the cleaning apparatus of the present invention thus constituted is arranged in plural at predetermined positions as shown in FIGS. 3 and 4, and is on the surface of the object to be cleaned 7 such as a glass substrate moving in the carrying direction. While rotating around the rotary shaft 2, the cleaning liquid is discharged from the discharge nozzles provided in each of them to clean the surface thereof. At this time, in the rotating brush in which the fiber bundles are radially implanted as shown in the first embodiment, the cleaning liquid supplied from the center of the rotating plate is guided in the circumferential direction as the rotating plate rotates during cleaning. , Discharged to the outside. Reference numeral 6 denotes a high-pressure pure water shower for removing the cleaning liquid thus used for cleaning from the surface of the object to be cleaned 7. Therefore, retention of the cleaning liquid is prevented, and a clean cleaning liquid is always used, so that a high cleaning effect can be obtained. Further, in the rotating brush shown in the second embodiment in which the fiber material is different between the inner circumference and the outer circumference, the hard brush on the outer circumference removes strong dirt and relatively large foreign matter on the surface, Use a soft brush on the part to remove dirt and fine particles in fine parts,
Different types of stains can be removed efficiently and simultaneously.

【0009】尚、上記第2の実施例では、回転板の内周
部と外周部とで植設される繊維の材質を変えた例を示し
たが、繊維の形状や太さなどを変えることにより、内周
部と外周部とでブラシの性質を異ならせることとしても
良い。
In the second embodiment, the material of the fibers to be planted is changed between the inner peripheral portion and the outer peripheral portion of the rotary plate, but the shape and thickness of the fibers may be changed. Therefore, the properties of the brush may be different between the inner peripheral portion and the outer peripheral portion.

【0010】[0010]

【発明の効果】以上のように本発明の洗浄装置に用いる
回転ブラシは、繊維束を渦巻状に植設したものでは、洗
浄液が円滑に排出されるので、洗浄された汚れの再付着
が防止され、洗浄効果が向上する。又、内外で繊維の材
質や形状を変えたものでは、各種の汚れに対応でき、洗
浄効果が向上すると共に、洗浄工程が簡素化され、装置
も簡素化される。よって、能率良く精度の高い洗浄が行
え、製品の歩留まりの向上にも優れた効果を奏するもの
である。
As described above, in the rotary brush used in the cleaning apparatus of the present invention, in which the fiber bundle is planted in a spiral shape, the cleaning liquid is smoothly discharged, and thus the reattachment of the cleaned dirt is prevented. The cleaning effect is improved. Further, by changing the material and shape of the fiber inside and outside, various stains can be dealt with, the cleaning effect is improved, the cleaning process is simplified, and the apparatus is also simplified. Therefore, cleaning can be performed efficiently and with high precision, and an excellent effect can be obtained in improving the yield of products.

【図面の簡単な説明】[Brief description of drawings]

【図1】回転ブラシの実施例を示す簡略裏面図である。FIG. 1 is a simplified back view showing an embodiment of a rotating brush.

【図2】他の実施例の一部切欠斜視図である。FIG. 2 is a partially cutaway perspective view of another embodiment.

【図3】使用状態平面図である。FIG. 3 is a plan view of a usage state.

【図4】使用状態側面図である。FIG. 4 is a side view of a usage state.

【図5】従来例の簡略裏面図である。FIG. 5 is a simplified back view of a conventional example.

【符号の説明】[Explanation of symbols]

1,1’,1” 繊維束 2 回転板 3 排出ノズル 4 回転軸 1,1 ', 1 "fiber bundle 2 rotary plate 3 discharge nozzle 4 rotary shaft

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 裏面中央に開口した排出ノズルから洗浄
液を排出しつつ回転駆動されることにより、シリコンウ
ェハーやプリント基板などの各種電子部品の表面に付着
した汚れを落とす回転ブラシを有する洗浄装置におい
て、回転ブラシの回転板の裏面に植設される繊維を数十
から数百本単位の繊維束とすると共に、該繊維束を洗浄
液の排出ノズルを中心に渦巻状に配したことを特徴とす
る洗浄装置。
1. A cleaning device having a rotating brush that removes dirt adhering to the surface of various electronic components such as a silicon wafer and a printed circuit board by being rotationally driven while discharging a cleaning liquid from a discharge nozzle opened at the center of the back surface. A fiber bundle of several tens to several hundred fibers is planted on the back surface of the rotary plate of the rotary brush, and the fiber bundle is spirally arranged around the cleaning liquid discharge nozzle. Cleaning device.
【請求項2】 回転ブラシの繊維の材質或いは形状が回
転板の内周部と外周部とで異なることを特徴とする請求
項1記載の洗浄装置。
2. The cleaning device according to claim 1, wherein the material or shape of the fibers of the rotating brush is different between the inner peripheral portion and the outer peripheral portion of the rotating plate.
【請求項3】 上記請求項1及び2の回転ブラシを使用
した洗浄装置において、回転ブラシから出た洗浄液を被
洗浄物の表面から排除する為の高圧純水シャワーを有す
ることを特徴とする洗浄装置。
3. The cleaning apparatus using the rotating brush according to claim 1 or 2, further comprising a high-pressure pure water shower for removing the cleaning liquid discharged from the rotating brush from the surface of the object to be cleaned. apparatus.
JP30987791A 1991-10-28 1991-10-28 Cleaning device Pending JPH05121385A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30987791A JPH05121385A (en) 1991-10-28 1991-10-28 Cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30987791A JPH05121385A (en) 1991-10-28 1991-10-28 Cleaning device

Publications (1)

Publication Number Publication Date
JPH05121385A true JPH05121385A (en) 1993-05-18

Family

ID=17998381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30987791A Pending JPH05121385A (en) 1991-10-28 1991-10-28 Cleaning device

Country Status (1)

Country Link
JP (1) JPH05121385A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100521368B1 (en) * 2002-12-13 2005-10-12 삼성전자주식회사 Chemical mechanical polishing apparatus for manufacturing semiconductor devices
JP2009070932A (en) * 2007-09-12 2009-04-02 Sumitomo Metal Mining Co Ltd Wafer-cleaning apparatus and wafer-cleaning method
JP2013038178A (en) * 2011-08-05 2013-02-21 Tokyo Electron Ltd Substrate processing device, removal processing body of the same substrate processing device, and substrate processing method
JP6304349B1 (en) * 2016-11-15 2018-04-04 株式会社Sumco Wafer edge polishing apparatus and method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5613727A (en) * 1979-07-13 1981-02-10 Fujitsu Ltd Washing method
JPS63137429A (en) * 1986-11-28 1988-06-09 Dainippon Screen Mfg Co Ltd Apparatus for washing both surface of substrate
JPH01171762A (en) * 1987-12-28 1989-07-06 Shibayama Kikai Kk Suction chuck cleaning device for semiconductor wafer grinding machine
JPH02152231A (en) * 1988-12-02 1990-06-12 Mitsubishi Electric Corp Removal apparatus of foreign body
JP3101232B2 (en) * 1996-05-31 2000-10-23 アトフィナ Latex based on vinyl chloride copolymer having special structure, method for producing the same, and use thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5613727A (en) * 1979-07-13 1981-02-10 Fujitsu Ltd Washing method
JPS63137429A (en) * 1986-11-28 1988-06-09 Dainippon Screen Mfg Co Ltd Apparatus for washing both surface of substrate
JPH01171762A (en) * 1987-12-28 1989-07-06 Shibayama Kikai Kk Suction chuck cleaning device for semiconductor wafer grinding machine
JPH02152231A (en) * 1988-12-02 1990-06-12 Mitsubishi Electric Corp Removal apparatus of foreign body
JP3101232B2 (en) * 1996-05-31 2000-10-23 アトフィナ Latex based on vinyl chloride copolymer having special structure, method for producing the same, and use thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100521368B1 (en) * 2002-12-13 2005-10-12 삼성전자주식회사 Chemical mechanical polishing apparatus for manufacturing semiconductor devices
JP2009070932A (en) * 2007-09-12 2009-04-02 Sumitomo Metal Mining Co Ltd Wafer-cleaning apparatus and wafer-cleaning method
JP2013038178A (en) * 2011-08-05 2013-02-21 Tokyo Electron Ltd Substrate processing device, removal processing body of the same substrate processing device, and substrate processing method
JP6304349B1 (en) * 2016-11-15 2018-04-04 株式会社Sumco Wafer edge polishing apparatus and method
JP2018079523A (en) * 2016-11-15 2018-05-24 株式会社Sumco Wafer edge polishing device and method
KR20190052138A (en) * 2016-11-15 2019-05-15 가부시키가이샤 사무코 Edge polishing apparatus and method of wafer
US11559869B2 (en) 2016-11-15 2023-01-24 Sumco Corporation Wafer edge polishing apparatus and method

Similar Documents

Publication Publication Date Title
US20010027797A1 (en) Cleaning apparatus
US20020092544A1 (en) Substrate cleaning apparatus and substrate cleaning method
WO1999046083A1 (en) Cleaning device for surface plate correcting dresser
JP3323384B2 (en) Substrate cleaning apparatus and substrate cleaning method
JPH0786218A (en) Substrate cleaner
JPH05121385A (en) Cleaning device
TW201246318A (en) Method for cleaning a semiconductor wafer
JP4294176B2 (en) Method for cleaning quartz articles with a grained surface
JP2006319279A (en) Apparatus and method for cleaning substrate
JP2001121096A (en) Roll brush cleaning device
JPH0774132A (en) Brush scrubber and method of brush-scrubbing
JP2003163196A (en) Cleaning equipment and cleaning method of semiconductor substrate
EP0020088B1 (en) Apparatus for cleaning glass masks
KR102149114B1 (en) Removing Apparatus for Cutting Residue of Semiconductor Package
JPS60240129A (en) Scrub washing apparatus
JPH08267024A (en) Scrub washing device
JP2000237700A (en) Substrate washing apparatus
JP2988366B2 (en) Cleaning equipment
JPH10166268A (en) Back grinder chuck table washing device
JPH09171983A (en) Substrate cleaning equipment
JPS5986226A (en) Cleaning device for thin plate material
KR20050047147A (en) Apparatus for cleaning a wafer
JP2916409B2 (en) Spin cleaning method and apparatus therefor
JPH0936076A (en) Washing device
JP2002208580A (en) Scrubber cleaning device