JPS5984448A - 樹脂封止型半導体装置およびその製造方法 - Google Patents

樹脂封止型半導体装置およびその製造方法

Info

Publication number
JPS5984448A
JPS5984448A JP57194547A JP19454782A JPS5984448A JP S5984448 A JPS5984448 A JP S5984448A JP 57194547 A JP57194547 A JP 57194547A JP 19454782 A JP19454782 A JP 19454782A JP S5984448 A JPS5984448 A JP S5984448A
Authority
JP
Japan
Prior art keywords
resin
integrated circuit
semiconductor device
circuit element
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57194547A
Other languages
English (en)
Japanese (ja)
Other versions
JPH049381B2 (cs
Inventor
Ken Ogura
謙 小椋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP57194547A priority Critical patent/JPS5984448A/ja
Publication of JPS5984448A publication Critical patent/JPS5984448A/ja
Publication of JPH049381B2 publication Critical patent/JPH049381B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Volatile Memory (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Read Only Memory (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP57194547A 1982-11-08 1982-11-08 樹脂封止型半導体装置およびその製造方法 Granted JPS5984448A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57194547A JPS5984448A (ja) 1982-11-08 1982-11-08 樹脂封止型半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57194547A JPS5984448A (ja) 1982-11-08 1982-11-08 樹脂封止型半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPS5984448A true JPS5984448A (ja) 1984-05-16
JPH049381B2 JPH049381B2 (cs) 1992-02-20

Family

ID=16326346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57194547A Granted JPS5984448A (ja) 1982-11-08 1982-11-08 樹脂封止型半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JPS5984448A (cs)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894707A (en) * 1987-02-12 1990-01-16 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having a light transparent window and a method of producing same
US5037779A (en) * 1989-05-19 1991-08-06 Whalley Peter D Method of encapsulating a sensor device using capillary action and the device so encapsulated
US5079190A (en) * 1988-02-09 1992-01-07 Canon Kabushiki Kaisha Method of eliminating uneven refractive index in resin of a resin encapsulated photoelectric converting device
US5424249A (en) * 1992-01-23 1995-06-13 Mitsubishi Denki Kabushiki Kaisha Method of making mold-packaged pressure sensing semiconductor device
US5622873A (en) * 1994-01-24 1997-04-22 Goldstar Electron Co., Ltd. Process for manufacturing a resin molded image pick-up semiconductor chip having a window

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894707A (en) * 1987-02-12 1990-01-16 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having a light transparent window and a method of producing same
US5079190A (en) * 1988-02-09 1992-01-07 Canon Kabushiki Kaisha Method of eliminating uneven refractive index in resin of a resin encapsulated photoelectric converting device
US5037779A (en) * 1989-05-19 1991-08-06 Whalley Peter D Method of encapsulating a sensor device using capillary action and the device so encapsulated
US5424249A (en) * 1992-01-23 1995-06-13 Mitsubishi Denki Kabushiki Kaisha Method of making mold-packaged pressure sensing semiconductor device
US5622873A (en) * 1994-01-24 1997-04-22 Goldstar Electron Co., Ltd. Process for manufacturing a resin molded image pick-up semiconductor chip having a window

Also Published As

Publication number Publication date
JPH049381B2 (cs) 1992-02-20

Similar Documents

Publication Publication Date Title
US6433421B2 (en) Semiconductor device
US7253026B2 (en) Ultra-thin semiconductor package device and method for manufacturing the same
CN100452441C (zh) 光传感器封装
US7713788B2 (en) Method of manufacturing semiconductor package using redistribution substrate
CN107644862B (zh) 具有银纳米层的粗糙引线框
US4766095A (en) Method of manufacturing eprom device
US20120001328A1 (en) Chip-sized package and fabrication method thereof
CN106971985A (zh) 半导体封装及其制造方法
US20060202041A1 (en) Integrated circuit card and a method for manufacturing the same
JPS5984448A (ja) 樹脂封止型半導体装置およびその製造方法
JP2002515176A (ja) 集積回路パッケージ及びその製造方法
US20070080435A1 (en) Semiconductor packaging process and carrier for semiconductor package
JPS5990965A (ja) 光電変換モジユ−ル
JPH0883859A (ja) 半導体装置の製造方法
JPH0546098B2 (cs)
JPS60244035A (ja) 半導体装置の製造方法
JPS58207656A (ja) 樹脂封止型半導体装置およびその製造方法
CN107833866A (zh) 一次封装成型的增强散热的封装结构及制造方法
JPS5848950A (ja) 半導体装置およびその製造方法
CN101494210A (zh) 导线架以及封装结构
JP4020594B2 (ja) 半導体装置の製造方法
TWI604538B (zh) 指紋辨識封裝結構及其製造方法
US7851270B2 (en) Manufacturing process for a chip package structure
TWI301948B (cs)
JPS63133653A (ja) 光消去型半導体メモリ装置