JPS5980946A - セラミツクリ−ドレスパツケ−ジおよびその製造法 - Google Patents

セラミツクリ−ドレスパツケ−ジおよびその製造法

Info

Publication number
JPS5980946A
JPS5980946A JP57190945A JP19094582A JPS5980946A JP S5980946 A JPS5980946 A JP S5980946A JP 57190945 A JP57190945 A JP 57190945A JP 19094582 A JP19094582 A JP 19094582A JP S5980946 A JPS5980946 A JP S5980946A
Authority
JP
Japan
Prior art keywords
ceramic
metal
metal conductor
package
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57190945A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6312383B2 (en, 2012
Inventor
Shozo Abe
阿部　正蔵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP57190945A priority Critical patent/JPS5980946A/ja
Priority to US06/544,851 priority patent/US4525597A/en
Publication of JPS5980946A publication Critical patent/JPS5980946A/ja
Publication of JPS6312383B2 publication Critical patent/JPS6312383B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP57190945A 1982-10-30 1982-10-30 セラミツクリ−ドレスパツケ−ジおよびその製造法 Granted JPS5980946A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP57190945A JPS5980946A (ja) 1982-10-30 1982-10-30 セラミツクリ−ドレスパツケ−ジおよびその製造法
US06/544,851 US4525597A (en) 1982-10-30 1983-10-24 Ceramic leadless packages and a process for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57190945A JPS5980946A (ja) 1982-10-30 1982-10-30 セラミツクリ−ドレスパツケ−ジおよびその製造法

Publications (2)

Publication Number Publication Date
JPS5980946A true JPS5980946A (ja) 1984-05-10
JPS6312383B2 JPS6312383B2 (en, 2012) 1988-03-18

Family

ID=16266283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57190945A Granted JPS5980946A (ja) 1982-10-30 1982-10-30 セラミツクリ−ドレスパツケ−ジおよびその製造法

Country Status (2)

Country Link
US (1) US4525597A (en, 2012)
JP (1) JPS5980946A (en, 2012)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5069626A (en) * 1987-07-01 1991-12-03 Western Digital Corporation Plated plastic castellated interconnect for electrical components
CA1293544C (en) * 1987-07-01 1991-12-24 Timothy P. Patterson Plated plastic castellated interconnect for electrical components
US4890383A (en) * 1988-01-15 1990-01-02 Simens Corporate Research & Support, Inc. Method for producing displays and modular components
US4843280A (en) * 1988-01-15 1989-06-27 Siemens Corporate Research & Support, Inc. A modular surface mount component for an electrical device or led's
US5023993A (en) * 1988-09-30 1991-06-18 Grumman Aerospace Corporation Method for manufacturing a high-performance package for monolithic microwave integrated circuits
GB2223354B (en) * 1988-09-30 1992-10-14 Marconi Electronic Devices Semiconductor devices
EP0496491A1 (en) * 1991-01-22 1992-07-29 National Semiconductor Corporation Leadless chip resistor capacitor carrier for hybrid circuits and a method of making the same
EP0535399B1 (en) * 1991-09-30 1995-12-27 Gisulfo Baccini Device to process electrical circuits
US5216277A (en) * 1991-10-31 1993-06-01 National Semiconductor Corporation Lead frames with location eye point markings
US5404047A (en) * 1992-07-17 1995-04-04 Lsi Logic Corporation Semiconductor die having a high density array of composite bond pads
JPH07240479A (ja) * 1993-09-21 1995-09-12 Texas Instr Inc <Ti> 集積回路パッケージ化の方法およびパッケージ
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
JP3097569B2 (ja) * 1996-09-17 2000-10-10 株式会社村田製作所 積層チップインダクタの製造方法
US6675472B1 (en) * 1999-04-29 2004-01-13 Unicap Electronics Industrial Corporation Process and structure for manufacturing plastic chip carrier
US6105246A (en) * 1999-05-20 2000-08-22 International Business Machines Corporation Method of making a circuit board having burr free castellated plated through holes
JP3901427B2 (ja) * 1999-05-27 2007-04-04 松下電器産業株式会社 電子装置とその製造方法およびその製造装置
JP4674397B2 (ja) * 2000-11-09 2011-04-20 パナソニック株式会社 セラミック素体の製造方法
US6534338B1 (en) * 2001-06-29 2003-03-18 Amkor Technology, Inc. Method for molding semiconductor package having a ceramic substrate
CN1291519C (zh) * 2003-08-19 2006-12-20 株式会社村田制作所 线路变换器、高频组件及线路变换器的制造方法
JP4827808B2 (ja) * 2007-08-15 2011-11-30 パナソニック株式会社 半導体デバイス
JP2017073411A (ja) * 2015-10-05 2017-04-13 ソニー株式会社 発光装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374533A (en) * 1965-05-26 1968-03-26 Sprague Electric Co Semiconductor mounting and assembly method
US3404215A (en) * 1966-04-14 1968-10-01 Sprague Electric Co Hermetically sealed electronic module
US3404214A (en) * 1967-07-17 1968-10-01 Alloys Unltd Inc Flat package for semiconductors
US3483308A (en) * 1968-10-24 1969-12-09 Texas Instruments Inc Modular packages for semiconductor devices
US4366342A (en) * 1978-06-21 1982-12-28 Minnesota Mining And Manufacturing Company Conductively coated embossed articles

Also Published As

Publication number Publication date
JPS6312383B2 (en, 2012) 1988-03-18
US4525597A (en) 1985-06-25

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