JPS5972746A - フイルムマウント形集積回路の保護方法および装置 - Google Patents

フイルムマウント形集積回路の保護方法および装置

Info

Publication number
JPS5972746A
JPS5972746A JP58171031A JP17103183A JPS5972746A JP S5972746 A JPS5972746 A JP S5972746A JP 58171031 A JP58171031 A JP 58171031A JP 17103183 A JP17103183 A JP 17103183A JP S5972746 A JPS5972746 A JP S5972746A
Authority
JP
Japan
Prior art keywords
frame
micropack
short
circuit
shorting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58171031A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6334624B2 (OSRAM
Inventor
オツトマ−ル・フリツツ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of JPS5972746A publication Critical patent/JPS5972746A/ja
Publication of JPS6334624B2 publication Critical patent/JPS6334624B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58171031A 1982-09-20 1983-09-16 フイルムマウント形集積回路の保護方法および装置 Granted JPS5972746A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3234745.6 1982-09-20
DE3234745A DE3234745C2 (de) 1982-09-20 1982-09-20 Verfahren zur Handhabung von filmmontierten integrierten Schaltkreisen und Vorrichtung zu seiner Durchführung

Publications (2)

Publication Number Publication Date
JPS5972746A true JPS5972746A (ja) 1984-04-24
JPS6334624B2 JPS6334624B2 (OSRAM) 1988-07-11

Family

ID=6173640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58171031A Granted JPS5972746A (ja) 1982-09-20 1983-09-16 フイルムマウント形集積回路の保護方法および装置

Country Status (5)

Country Link
US (1) US4575747A (OSRAM)
EP (1) EP0103888B1 (OSRAM)
JP (1) JPS5972746A (OSRAM)
AT (1) ATE43029T1 (OSRAM)
DE (2) DE3234745C2 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5338973A (en) * 1990-08-22 1994-08-16 Nec Corporation Carrier for film carrier type semiconductor device

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4832612A (en) * 1986-10-31 1989-05-23 Amp Incorporated Protective carrier and securing means therefor
US4744009A (en) * 1986-10-31 1988-05-10 Amp Incorporated Protective carrier and securing means therefor
JPH0526746Y2 (OSRAM) * 1987-07-14 1993-07-07
US4953002A (en) * 1988-03-31 1990-08-28 Honeywell Inc. Semiconductor device housing with magnetic field protection
US5008614A (en) * 1988-10-11 1991-04-16 Hewlett-Packard Company TAB frame and process of testing same
US4999700A (en) * 1989-04-20 1991-03-12 Honeywell Inc. Package to board variable pitch tab
JPH0727927B2 (ja) * 1990-03-12 1995-03-29 株式会社東芝 テープキャリア
EP0468275B1 (de) * 1990-07-23 1996-06-12 Siemens Nixdorf Informationssysteme Aktiengesellschaft Filmträger zur bandautomatischen Verdrahtung
US5400219A (en) * 1992-09-02 1995-03-21 Eastman Kodak Company Tape automated bonding for electrically connecting semiconductor chips to substrates
US5396032A (en) * 1993-05-04 1995-03-07 Alcatel Network Systems, Inc. Method and apparatus for providing electrical access to devices in a multi-chip module
US6127196A (en) * 1995-09-29 2000-10-03 Intel Corporation Method for testing a tape carrier package
DE19635732A1 (de) * 1996-09-03 1998-03-05 Siemens Ag Trägerelement für einen Halbleiterchip
DE19620025A1 (de) * 1996-05-17 1997-11-20 Siemens Ag Trägerelement für einen Halbleiterchip
KR20000010876A (ko) 1996-05-17 2000-02-25 칼 하인쯔 호르닝어 반도체칩용 기판 부재
JP2004505442A (ja) * 2000-07-21 2004-02-19 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 改善されたいわゆるソーボーを有する集積回路を製造する方法
WO2010099217A1 (en) 2009-02-25 2010-09-02 Braincells, Inc. Modulation of neurogenesis using d-cycloserine combinations
USD984397S1 (en) * 2021-03-16 2023-04-25 Yidong Cai Circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5338838U (OSRAM) * 1976-09-09 1978-04-05

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3027004A (en) * 1957-08-13 1962-03-27 Ind Electronic Hardware Corp Pin-receiving contacts for printed circuit board
US3774075A (en) * 1970-09-23 1973-11-20 Motorola Inc Package including electrical equipment lead shorting element
US3746157A (en) * 1971-10-26 1973-07-17 Motorola Inc Protective carrier for semiconductor devices
GB1326437A (en) * 1971-12-22 1973-08-15 Bowthorpe Hellermann Ltd Retaining clips
US3784960A (en) * 1972-05-01 1974-01-08 Bunker Ramo Carrier for integrated circuit packages
DE2315711B2 (de) * 1973-03-29 1980-07-17 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Kontaktieren einer integrierten Schaltungsanordnung
US3820152A (en) * 1973-04-24 1974-06-25 Du Pont Circuit package with fugitive shorting bar
US3823350A (en) * 1973-09-05 1974-07-09 Atomic Energy Commission Protective carrier for semiconductor chips
US4007479A (en) * 1976-03-29 1977-02-08 Honeywell Information Systems, Inc. Fixture for an integrated circuit chip
US4069496A (en) * 1976-12-30 1978-01-17 Honeywell Information Systems Inc. Reusable fixture for an integrated circuit chip
US4132856A (en) * 1977-11-28 1979-01-02 Burroughs Corporation Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby
DE2830937A1 (de) * 1978-07-14 1980-01-24 Bosch Gmbh Robert Vorrichtung zum schutz einer elektronischen schaltgruppe
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
DE3035125C2 (de) * 1980-09-17 1986-07-31 Siemens AG, 1000 Berlin und 8000 München Integrierter Schaltkreis
DE3207458C1 (de) * 1982-03-02 1983-06-09 Siemens AG, 1000 Berlin und 8000 München Halterung fuer die Einzelverarbeitung von filmmotierten integrierten Schaltkreisen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5338838U (OSRAM) * 1976-09-09 1978-04-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5338973A (en) * 1990-08-22 1994-08-16 Nec Corporation Carrier for film carrier type semiconductor device

Also Published As

Publication number Publication date
US4575747A (en) 1986-03-11
ATE43029T1 (de) 1989-05-15
DE3234745C2 (de) 1986-03-06
EP0103888B1 (de) 1989-05-10
EP0103888A3 (en) 1985-11-21
DE3234745A1 (de) 1984-03-22
DE3379856D1 (en) 1989-06-15
EP0103888A2 (de) 1984-03-28
JPS6334624B2 (OSRAM) 1988-07-11

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