JPS5972166A - モノリシツク半導体集積回路デバイス用複数導体層構造 - Google Patents
モノリシツク半導体集積回路デバイス用複数導体層構造Info
- Publication number
- JPS5972166A JPS5972166A JP16911383A JP16911383A JPS5972166A JP S5972166 A JPS5972166 A JP S5972166A JP 16911383 A JP16911383 A JP 16911383A JP 16911383 A JP16911383 A JP 16911383A JP S5972166 A JPS5972166 A JP S5972166A
- Authority
- JP
- Japan
- Prior art keywords
- junction
- integrated circuit
- layer
- collector
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 239000004065 semiconductor Substances 0.000 claims description 25
- 238000009792 diffusion process Methods 0.000 claims description 23
- 238000001465 metallisation Methods 0.000 claims description 18
- 230000015556 catabolic process Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 241001156002 Anthonomus pomorum Species 0.000 description 1
- 241000772415 Neovison vison Species 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000002211 methanization Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41681682A | 1982-09-13 | 1982-09-13 | |
US416816 | 1982-09-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5972166A true JPS5972166A (ja) | 1984-04-24 |
Family
ID=23651425
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16911383A Pending JPS5972166A (ja) | 1982-09-13 | 1983-09-13 | モノリシツク半導体集積回路デバイス用複数導体層構造 |
JP754393U Pending JPH0585054U (ja) | 1982-09-13 | 1993-02-26 | モノリシック半導体集積回路デバイス用複数導体層構造 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP754393U Pending JPH0585054U (ja) | 1982-09-13 | 1993-02-26 | モノリシック半導体集積回路デバイス用複数導体層構造 |
Country Status (2)
Country | Link |
---|---|
JP (2) | JPS5972166A (de) |
DE (1) | DE3333242C2 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3641299A1 (de) * | 1986-12-03 | 1988-06-16 | Philips Patentverwaltung | Integrierte halbleiter-schaltung mit mehrlagenverdrahtung |
DE3728979A1 (de) * | 1987-08-29 | 1989-03-09 | Bosch Gmbh Robert | Planare schaltungsanordnung |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50153579A (de) * | 1974-05-29 | 1975-12-10 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3302076A (en) * | 1963-06-06 | 1967-01-31 | Motorola Inc | Semiconductor device with passivated junction |
US3363152A (en) * | 1964-01-24 | 1968-01-09 | Westinghouse Electric Corp | Semiconductor devices with low leakage current across junction |
CA956038A (en) * | 1964-08-20 | 1974-10-08 | Roy W. Stiegler (Jr.) | Semiconductor devices with field electrodes |
GB1245765A (en) * | 1967-10-13 | 1971-09-08 | Gen Electric | Surface diffused semiconductor devices |
-
1983
- 1983-09-12 DE DE19833333242 patent/DE3333242C2/de not_active Expired - Lifetime
- 1983-09-13 JP JP16911383A patent/JPS5972166A/ja active Pending
-
1993
- 1993-02-26 JP JP754393U patent/JPH0585054U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50153579A (de) * | 1974-05-29 | 1975-12-10 |
Also Published As
Publication number | Publication date |
---|---|
DE3333242C2 (de) | 1995-08-17 |
DE3333242A1 (de) | 1984-03-15 |
JPH0585054U (ja) | 1993-11-16 |
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