JPS597213B2 - ポリイミド−シリコン共重合体接合コ−テングで被覆されたシリコン半導体接合における表面状態と表面電荷の調節法 - Google Patents

ポリイミド−シリコン共重合体接合コ−テングで被覆されたシリコン半導体接合における表面状態と表面電荷の調節法

Info

Publication number
JPS597213B2
JPS597213B2 JP51149313A JP14931376A JPS597213B2 JP S597213 B2 JPS597213 B2 JP S597213B2 JP 51149313 A JP51149313 A JP 51149313A JP 14931376 A JP14931376 A JP 14931376A JP S597213 B2 JPS597213 B2 JP S597213B2
Authority
JP
Japan
Prior art keywords
silicon
selected surface
polymeric material
polyimide
polymeric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51149313A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5272578A (en
Inventor
アレキサンダー・ジヨン・ヤーマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPS5272578A publication Critical patent/JPS5272578A/ja
Publication of JPS597213B2 publication Critical patent/JPS597213B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10P50/00—
    • H10W74/01—
    • H10W74/137—

Landscapes

  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP51149313A 1975-12-11 1976-12-10 ポリイミド−シリコン共重合体接合コ−テングで被覆されたシリコン半導体接合における表面状態と表面電荷の調節法 Expired JPS597213B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US63986875A 1975-12-11 1975-12-11

Publications (2)

Publication Number Publication Date
JPS5272578A JPS5272578A (en) 1977-06-17
JPS597213B2 true JPS597213B2 (ja) 1984-02-17

Family

ID=24565898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51149313A Expired JPS597213B2 (ja) 1975-12-11 1976-12-10 ポリイミド−シリコン共重合体接合コ−テングで被覆されたシリコン半導体接合における表面状態と表面電荷の調節法

Country Status (5)

Country Link
JP (1) JPS597213B2 (enExample)
DE (1) DE2655803C2 (enExample)
FR (1) FR2335042A1 (enExample)
GB (1) GB1571999A (enExample)
SE (1) SE418432B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0395021U (enExample) * 1990-01-16 1991-09-27

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE418433B (sv) * 1975-12-11 1981-05-25 Gen Electric Halvledarelement med ett skikt av ett polymert siloxan-innehallande membranmaterial med variabel permeabilitet anbringat pa utvalda ytomraden av elementet
GB1585477A (en) * 1976-01-26 1981-03-04 Gen Electric Semiconductors
CH661932A5 (en) * 1978-09-18 1987-08-31 Gen Electric Process for the preparation of a coating composition for semiconductor components, this composition, and the use thereof
CH661933A5 (en) * 1978-09-18 1987-08-31 Gen Electric Process for the preparation of a coating composition for the surface of a semiconductor component, this composition, and the use thereof for preventing surface breakdown
DE19500235A1 (de) * 1995-01-05 1996-07-11 Roth Technik Gmbh Abdeckschicht für elektrische Leiter oder Halbleiter
JP6833864B2 (ja) * 2015-11-05 2021-02-24 アーベーベー・シュバイツ・アーゲーＡＢＢ Ｓｃｈｗｅｉｚ ＡＧ パワー半導体装置およびパワー半導体装置を作製するための方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1464602B2 (de) * 1962-11-30 1970-11-26 Fuji Denki Seizo K.K., Tokio Verfahren zur Oberflächenbehandlung ..on Halbleiteranordnungen
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating
US3553282A (en) * 1969-09-08 1971-01-05 Gen Electric Siloxane containing polyamide acid blends
US3598784A (en) * 1970-03-11 1971-08-10 Gen Electric Polysiloxane amides
US3740305A (en) * 1971-10-01 1973-06-19 Gen Electric Composite materials bonded with siloxane containing polyimides
JPS5421073B2 (enExample) * 1974-04-15 1979-07-27

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0395021U (enExample) * 1990-01-16 1991-09-27

Also Published As

Publication number Publication date
DE2655803C2 (de) 1986-04-17
DE2655803A1 (de) 1977-06-16
GB1571999A (en) 1980-07-23
SE418432B (sv) 1981-05-25
FR2335042A1 (fr) 1977-07-08
SE7613875L (sv) 1977-06-12
JPS5272578A (en) 1977-06-17
FR2335042B1 (enExample) 1982-10-29

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