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1975-03-26 |
1976-10-01 |
Hitachi Ltd |
Semiconductor device
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1975-08-04 |
1980-04-15 |
General Electric Company |
Method for providing substantially hermetic sealing means for electronic components
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1975-10-27 |
1984-06-20 |
Siemens AG, 1000 Berlin und 8000 München |
Halbleitervorrichtung und Verfahren zu ihrer Herstellung
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1975-12-10 |
1980-01-22 |
Tokyo Shibaura Electric Co., Ltd. |
Semiconductor device and a method for manufacturing the same
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1975-12-11 |
1981-05-25 |
Gen Electric |
Halvledarelement med ett skikt av ett polymert siloxan-innehallande membranmaterial med variabel permeabilitet anbringat pa utvalda ytomraden av elementet
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1975-12-11 |
1981-05-25 |
Gen Electric |
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1976-01-26 |
1981-03-04 |
Gen Electric |
Semiconductors
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1976-02-28 |
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JPS5519850A
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1978-07-31 |
1980-02-12 |
Hitachi Ltd |
Semiconductor
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1978-11-20 |
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Semiconductor device and manufacturing method thereof
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1978-11-20 |
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Hatachi, Ltd. |
Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate
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1978-12-08 |
1980-06-13 |
Toray Ind Inc |
Manufacture of semiconductor
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1979-06-04 |
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1979-06-18 |
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1980-04-25 |
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Semiconductor device
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1980-12-18 |
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1981-02-12 |
1982-08-18 |
Nec Corp |
Manufacture of semiconductor device
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1981-04-30 |
1982-11-08 |
Hitachi Ltd |
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1981-06-30 |
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Adhesion of a photoresist to a substrate
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1982-07-29 |
1984-02-02 |
Siemens AG, 1000 Berlin und 8000 München |
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1982-09-21 |
1984-03-22 |
Siemens AG, 1000 Berlin und 8000 München |
Verfahren zum herstellen einer monolithisch integrierten schaltung
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1982-09-24 |
1984-03-29 |
Hitachi Ltd |
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1983-04-22 |
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1983-07-01 |
1985-01-23 |
Hitachi Ltd |
半導体装置
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1983-07-28 |
1985-02-15 |
Toshiba Corp |
半導体装置
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1984-03-22 |
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Nitride bonding layer
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Eastman Kodak Company |
Semiconductor material on a substrate, said substrate comprising, in order, a layer of organic polymer, a layer of metal or metal alloy and a layer of dielectric material
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1984-12-13 |
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United Kingdom Atomic Energy Authority |
Spacecraft materials
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1985-02-22 |
1987-09-15 |
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Electrical isolation and leveling of patterned surfaces
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1985-05-28 |
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Method of manufacturing an integrated circuit chip and integrated circuit chip produced thereby
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1985-08-09 |
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1987-06-20 |
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1987-12-03 |
1989-04-25 |
General Motors Corporation |
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1988-04-14 |
1990-10-30 |
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Method for making borderless contacts
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1990-03-28 |
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