JPS5969910A - 積層キヤパシタ及びその製造方法 - Google Patents

積層キヤパシタ及びその製造方法

Info

Publication number
JPS5969910A
JPS5969910A JP58109440A JP10944083A JPS5969910A JP S5969910 A JPS5969910 A JP S5969910A JP 58109440 A JP58109440 A JP 58109440A JP 10944083 A JP10944083 A JP 10944083A JP S5969910 A JPS5969910 A JP S5969910A
Authority
JP
Japan
Prior art keywords
capacitor
solder
metal
tabs
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58109440A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0218573B2 (enExample
Inventor
ダツドレ−・オ−ガスタス・チヤンス
チユング・ウエン・ホウ
テイモシイ・クラ−ク・ライレイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5969910A publication Critical patent/JPS5969910A/ja
Publication of JPH0218573B2 publication Critical patent/JPH0218573B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
JP58109440A 1982-10-07 1983-06-20 積層キヤパシタ及びその製造方法 Granted JPS5969910A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US433329 1982-10-07
US06/433,329 US4430690A (en) 1982-10-07 1982-10-07 Low inductance MLC capacitor with metal impregnation and solder bar contact

Publications (2)

Publication Number Publication Date
JPS5969910A true JPS5969910A (ja) 1984-04-20
JPH0218573B2 JPH0218573B2 (enExample) 1990-04-26

Family

ID=23719770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58109440A Granted JPS5969910A (ja) 1982-10-07 1983-06-20 積層キヤパシタ及びその製造方法

Country Status (4)

Country Link
US (1) US4430690A (enExample)
EP (1) EP0108211B1 (enExample)
JP (1) JPS5969910A (enExample)
DE (1) DE3376913D1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001185441A (ja) * 1999-12-27 2001-07-06 Murata Mfg Co Ltd 積層コンデンサ、配線基板、デカップリング回路および高周波回路
JP2007515068A (ja) * 2003-12-19 2007-06-07 アドバンパック・ソリューションズ・ピーティーイー・リミテッド ウェーハーレベルチップスケールパッケージ用の各種構造と高さを有するバンプ構造体

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2576139B1 (fr) * 1985-01-17 1987-02-20 Eurofarad Condensateur ceramique multicouches haute frequence de forte capacite
EP0191668B1 (fr) * 1985-01-17 1990-03-14 Eurofarad-Efd Condensateur céramique multicouche haute fréquence de forte capacité
US4996584A (en) * 1985-01-31 1991-02-26 Gould, Inc. Thin-film electrical connections for integrated circuits
US4705606A (en) * 1985-01-31 1987-11-10 Gould Inc. Thin-film electrical connections for integrated circuits
US4684446A (en) * 1985-09-26 1987-08-04 General Electric Company Secondary metallization by glass displacement in ceramic substrate
US4732780A (en) * 1985-09-26 1988-03-22 General Electric Company Method of making hermetic feedthrough in ceramic substrate
US4833039A (en) * 1985-09-26 1989-05-23 General Electric Company Hermetic feedthrough in ceramic substrate
FR2599546B1 (fr) * 1986-05-30 1990-01-12 Cimsa Sintra Condensateur multicouche
ES2023384B3 (es) * 1986-08-18 1992-01-16 Siemens Ag Procedimiento para preparar componentes de capas de relleno
US4945399A (en) * 1986-09-30 1990-07-31 International Business Machines Corporation Electronic package with integrated distributed decoupling capacitors
US4744008A (en) * 1986-11-18 1988-05-10 International Business Machines Corporation Flexible film chip carrier with decoupling capacitors
US4831494A (en) * 1988-06-27 1989-05-16 International Business Machines Corporation Multilayer capacitor
US4852227A (en) * 1988-11-25 1989-08-01 Sprague Electric Company Method for making a multilayer ceramic capacitor with buried electrodes and terminations at a castellated edge
US4862318A (en) * 1989-04-04 1989-08-29 Avx Corporation Method of forming thin film terminations of low inductance ceramic capacitors and resultant article
US5367430A (en) * 1992-10-21 1994-11-22 Presidio Components, Inc. Monolithic multiple capacitor
US5375035A (en) * 1993-03-22 1994-12-20 Compaq Computer Corporation Capacitor mounting structure for printed circuit boards
US5880925A (en) 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor
US6266229B1 (en) 1997-11-10 2001-07-24 Murata Manufacturing Co., Ltd Multilayer capacitor
JP2991175B2 (ja) 1997-11-10 1999-12-20 株式会社村田製作所 積層コンデンサ
US6266228B1 (en) 1997-11-10 2001-07-24 Murata Manufacturing Co., Ltd Multilayer capacitor
US6292350B1 (en) 1997-11-10 2001-09-18 Murata Manufacturing, Co., Ltd Multilayer capacitor
US6549395B1 (en) 1997-11-14 2003-04-15 Murata Manufacturing Co., Ltd Multilayer capacitor
US6678927B1 (en) * 1997-11-24 2004-01-20 Avx Corporation Miniature surface mount capacitor and method of making same
JP3548821B2 (ja) 1999-05-10 2004-07-28 株式会社村田製作所 積層コンデンサ、ならびにこれを用いた電子装置および高周波回路
JP3476127B2 (ja) 1999-05-10 2003-12-10 株式会社村田製作所 積層コンデンサ
US6327134B1 (en) 1999-10-18 2001-12-04 Murata Manufacturing Co., Ltd. Multi-layer capacitor, wiring board, and high-frequency circuit
JP3489729B2 (ja) 1999-11-19 2004-01-26 株式会社村田製作所 積層コンデンサ、配線基板、デカップリング回路および高周波回路
US6477032B2 (en) * 2001-01-31 2002-11-05 Avx Corporation Low inductance chip with center via contact
US7462942B2 (en) * 2003-10-09 2008-12-09 Advanpack Solutions Pte Ltd Die pillar structures and a method of their formation
US6951139B2 (en) * 2003-12-05 2005-10-04 The Goodyear Tire & Rubber Company Tire sensor and method of assembly
US7408763B2 (en) * 2005-07-19 2008-08-05 Apurba Roy Low inductance multilayer capacitor
US7645675B2 (en) * 2006-01-13 2010-01-12 International Business Machines Corporation Integrated parallel plate capacitors
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
JP7673788B2 (ja) * 2021-02-22 2025-05-09 株式会社村田製作所 セラミック電子部品の製造方法
CN115475797B (zh) * 2022-09-30 2024-04-05 肇庆绿宝石电子科技股份有限公司 一种叠层电容器及其制造方法、载条清洗液及制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3235939A (en) 1962-09-06 1966-02-22 Aerovox Corp Process for manufacturing multilayer ceramic capacitors
US3852877A (en) 1969-08-06 1974-12-10 Ibm Multilayer circuits
US3679950A (en) 1971-04-16 1972-07-25 Nl Industries Inc Ceramic capacitors
US4030004A (en) 1971-04-16 1977-06-14 Nl Industries, Inc. Dielectric ceramic matrices with end barriers
US3778532A (en) * 1972-07-03 1973-12-11 Illinois Tool Works Electrical circuit component having solder preform connection means
US3965552A (en) 1972-07-24 1976-06-29 N L Industries, Inc. Process for forming internal conductors and electrodes
US3784887A (en) 1973-04-26 1974-01-08 Du Pont Process for making capacitors and capacitors made thereby
US4189760A (en) 1973-05-13 1980-02-19 Erie Technological Products, Inc. Monolithic capacitor with non-noble metal electrodes and method of making the same
US3879645A (en) 1973-09-24 1975-04-22 Nl Industries Inc Ceramic capacitors
US4297773A (en) 1978-11-16 1981-11-03 Avx Corporation Method of manufacturing a monolithic ceramic capacitor
US4246625A (en) 1978-11-16 1981-01-20 Union Carbide Corporation Ceramic capacitor with co-fired end terminations
US4328530A (en) * 1980-06-30 1982-05-04 International Business Machines Corporation Multiple layer, ceramic carrier for high switching speed VLSI chips

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001185441A (ja) * 1999-12-27 2001-07-06 Murata Mfg Co Ltd 積層コンデンサ、配線基板、デカップリング回路および高周波回路
JP2007515068A (ja) * 2003-12-19 2007-06-07 アドバンパック・ソリューションズ・ピーティーイー・リミテッド ウェーハーレベルチップスケールパッケージ用の各種構造と高さを有するバンプ構造体

Also Published As

Publication number Publication date
JPH0218573B2 (enExample) 1990-04-26
US4430690A (en) 1984-02-07
EP0108211A2 (en) 1984-05-16
DE3376913D1 (en) 1988-07-07
EP0108211B1 (en) 1988-06-01
EP0108211A3 (en) 1984-09-12

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