JPS5965546U - 樹脂密封型半導体装置 - Google Patents

樹脂密封型半導体装置

Info

Publication number
JPS5965546U
JPS5965546U JP1982159987U JP15998782U JPS5965546U JP S5965546 U JPS5965546 U JP S5965546U JP 1982159987 U JP1982159987 U JP 1982159987U JP 15998782 U JP15998782 U JP 15998782U JP S5965546 U JPS5965546 U JP S5965546U
Authority
JP
Japan
Prior art keywords
lead wire
resin
semiconductor chip
semiconductor device
heat radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982159987U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6246268Y2 (enExample
Inventor
石川 才司
一夫 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP1982159987U priority Critical patent/JPS5965546U/ja
Publication of JPS5965546U publication Critical patent/JPS5965546U/ja
Application granted granted Critical
Publication of JPS6246268Y2 publication Critical patent/JPS6246268Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/00
    • H10W74/10
    • H10W90/756

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1982159987U 1982-10-22 1982-10-22 樹脂密封型半導体装置 Granted JPS5965546U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982159987U JPS5965546U (ja) 1982-10-22 1982-10-22 樹脂密封型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982159987U JPS5965546U (ja) 1982-10-22 1982-10-22 樹脂密封型半導体装置

Publications (2)

Publication Number Publication Date
JPS5965546U true JPS5965546U (ja) 1984-05-01
JPS6246268Y2 JPS6246268Y2 (enExample) 1987-12-12

Family

ID=30352023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982159987U Granted JPS5965546U (ja) 1982-10-22 1982-10-22 樹脂密封型半導体装置

Country Status (1)

Country Link
JP (1) JPS5965546U (enExample)

Also Published As

Publication number Publication date
JPS6246268Y2 (enExample) 1987-12-12

Similar Documents

Publication Publication Date Title
JPS5965546U (ja) 樹脂密封型半導体装置
JPS60172346U (ja) 樹脂密封型半導体装置
JPS6064272U (ja) 半導体試験治具
JPS5977241U (ja) 樹脂封止型半導体装置
JPS60153531U (ja) 樹脂密封型半導体装置
JPS5923748U (ja) 半導体部品
JPS63105348U (enExample)
JPS594644U (ja) 樹脂モ−ルド半導体装置
JPS58116241U (ja) 半導体装置
JPS60141143U (ja) 樹脂封止型半導体装置
JPH04133452A (ja) 半導体装置
JPH03110853U (enExample)
JPS5834742U (ja) 樹脂封止形半導体装置の放熱構造
JPS5998652U (ja) Icの放熱器
JPS58147254U (ja) 自動車搭載用三相ダイオ−ドブリツジ
JPS59107157U (ja) GaAs半導体装置
JPS5856446U (ja) 樹脂封止半導体装置
JPS59182939U (ja) ラジエ−タ付き半導体パツケ−ジ
JPS5916152U (ja) モ−ルドパツケ−ジ型半導体素子
JPS585347U (ja) 樹脂封止型半導体装置
JPS6134742U (ja) 集積回路
JPS60101749U (ja) 集積回路装置
JPS5895641U (ja) 樹脂封止半導体装置
JPS59169048U (ja) 半導体装置
JPS63191644U (enExample)