JPS5965546U - 樹脂密封型半導体装置 - Google Patents
樹脂密封型半導体装置Info
- Publication number
- JPS5965546U JPS5965546U JP1982159987U JP15998782U JPS5965546U JP S5965546 U JPS5965546 U JP S5965546U JP 1982159987 U JP1982159987 U JP 1982159987U JP 15998782 U JP15998782 U JP 15998782U JP S5965546 U JPS5965546 U JP S5965546U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- resin
- semiconductor chip
- semiconductor device
- heat radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W74/00—
-
- H10W74/10—
-
- H10W90/756—
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982159987U JPS5965546U (ja) | 1982-10-22 | 1982-10-22 | 樹脂密封型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982159987U JPS5965546U (ja) | 1982-10-22 | 1982-10-22 | 樹脂密封型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5965546U true JPS5965546U (ja) | 1984-05-01 |
| JPS6246268Y2 JPS6246268Y2 (enExample) | 1987-12-12 |
Family
ID=30352023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982159987U Granted JPS5965546U (ja) | 1982-10-22 | 1982-10-22 | 樹脂密封型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5965546U (enExample) |
-
1982
- 1982-10-22 JP JP1982159987U patent/JPS5965546U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6246268Y2 (enExample) | 1987-12-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5965546U (ja) | 樹脂密封型半導体装置 | |
| JPS60172346U (ja) | 樹脂密封型半導体装置 | |
| JPS6064272U (ja) | 半導体試験治具 | |
| JPS5977241U (ja) | 樹脂封止型半導体装置 | |
| JPS60153531U (ja) | 樹脂密封型半導体装置 | |
| JPS5923748U (ja) | 半導体部品 | |
| JPS63105348U (enExample) | ||
| JPS594644U (ja) | 樹脂モ−ルド半導体装置 | |
| JPS58116241U (ja) | 半導体装置 | |
| JPS60141143U (ja) | 樹脂封止型半導体装置 | |
| JPH04133452A (ja) | 半導体装置 | |
| JPH03110853U (enExample) | ||
| JPS5834742U (ja) | 樹脂封止形半導体装置の放熱構造 | |
| JPS5998652U (ja) | Icの放熱器 | |
| JPS58147254U (ja) | 自動車搭載用三相ダイオ−ドブリツジ | |
| JPS59107157U (ja) | GaAs半導体装置 | |
| JPS5856446U (ja) | 樹脂封止半導体装置 | |
| JPS59182939U (ja) | ラジエ−タ付き半導体パツケ−ジ | |
| JPS5916152U (ja) | モ−ルドパツケ−ジ型半導体素子 | |
| JPS585347U (ja) | 樹脂封止型半導体装置 | |
| JPS6134742U (ja) | 集積回路 | |
| JPS60101749U (ja) | 集積回路装置 | |
| JPS5895641U (ja) | 樹脂封止半導体装置 | |
| JPS59169048U (ja) | 半導体装置 | |
| JPS63191644U (enExample) |