JPS6246268Y2 - - Google Patents

Info

Publication number
JPS6246268Y2
JPS6246268Y2 JP1982159987U JP15998782U JPS6246268Y2 JP S6246268 Y2 JPS6246268 Y2 JP S6246268Y2 JP 1982159987 U JP1982159987 U JP 1982159987U JP 15998782 U JP15998782 U JP 15998782U JP S6246268 Y2 JPS6246268 Y2 JP S6246268Y2
Authority
JP
Japan
Prior art keywords
resin
heat sink
lead wire
semiconductor chip
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982159987U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5965546U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982159987U priority Critical patent/JPS5965546U/ja
Publication of JPS5965546U publication Critical patent/JPS5965546U/ja
Application granted granted Critical
Publication of JPS6246268Y2 publication Critical patent/JPS6246268Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/00—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1982159987U 1982-10-22 1982-10-22 樹脂密封型半導体装置 Granted JPS5965546U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982159987U JPS5965546U (ja) 1982-10-22 1982-10-22 樹脂密封型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982159987U JPS5965546U (ja) 1982-10-22 1982-10-22 樹脂密封型半導体装置

Publications (2)

Publication Number Publication Date
JPS5965546U JPS5965546U (ja) 1984-05-01
JPS6246268Y2 true JPS6246268Y2 (enExample) 1987-12-12

Family

ID=30352023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982159987U Granted JPS5965546U (ja) 1982-10-22 1982-10-22 樹脂密封型半導体装置

Country Status (1)

Country Link
JP (1) JPS5965546U (enExample)

Also Published As

Publication number Publication date
JPS5965546U (ja) 1984-05-01

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