JPS596549A - 半導体装置の製造用金型 - Google Patents

半導体装置の製造用金型

Info

Publication number
JPS596549A
JPS596549A JP11652882A JP11652882A JPS596549A JP S596549 A JPS596549 A JP S596549A JP 11652882 A JP11652882 A JP 11652882A JP 11652882 A JP11652882 A JP 11652882A JP S596549 A JPS596549 A JP S596549A
Authority
JP
Japan
Prior art keywords
resin
mold
parts
cavities
metal mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11652882A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6258656B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Kaoru Sonobe
薫 園部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11652882A priority Critical patent/JPS596549A/ja
Publication of JPS596549A publication Critical patent/JPS596549A/ja
Publication of JPS6258656B2 publication Critical patent/JPS6258656B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2703—Means for controlling the runner flow, e.g. runner switches, adjustable runners or gates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP11652882A 1982-07-05 1982-07-05 半導体装置の製造用金型 Granted JPS596549A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11652882A JPS596549A (ja) 1982-07-05 1982-07-05 半導体装置の製造用金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11652882A JPS596549A (ja) 1982-07-05 1982-07-05 半導体装置の製造用金型

Publications (2)

Publication Number Publication Date
JPS596549A true JPS596549A (ja) 1984-01-13
JPS6258656B2 JPS6258656B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-12-07

Family

ID=14689355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11652882A Granted JPS596549A (ja) 1982-07-05 1982-07-05 半導体装置の製造用金型

Country Status (1)

Country Link
JP (1) JPS596549A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818204A (en) * 1985-05-31 1989-04-04 Osamu Nakagawa Mold for molding semiconductor devices
JPH01165256A (ja) * 1987-12-21 1989-06-29 Toshiba Corp 電話機用電源回路
CN106217755A (zh) * 2016-08-30 2016-12-14 无锡市科虹标牌有限公司 一种改善进浇冲片材的装置
JP2016213239A (ja) * 2015-04-30 2016-12-15 アピックヤマダ株式会社 半導体装置の製造方法、樹脂モールド金型、およびリードフレーム
CN106239798A (zh) * 2016-08-29 2016-12-21 无锡市科虹标牌有限公司 一种大面板背面覆膜的模具

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS503567U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-05-04 1975-01-14
JPS5330726A (en) * 1976-09-02 1978-03-23 Fuji Electric Co Ltd Slip frequency detector for induction motor
JPS6258656A (ja) * 1985-09-06 1987-03-14 Matsushita Electric Ind Co Ltd 半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS503567U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-05-04 1975-01-14
JPS5330726A (en) * 1976-09-02 1978-03-23 Fuji Electric Co Ltd Slip frequency detector for induction motor
JPS6258656A (ja) * 1985-09-06 1987-03-14 Matsushita Electric Ind Co Ltd 半導体装置の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818204A (en) * 1985-05-31 1989-04-04 Osamu Nakagawa Mold for molding semiconductor devices
US4908178A (en) * 1985-05-31 1990-03-13 Mitsubishi Denki Kabushiki Kaisha Method of molding a semiconductor device
JPH01165256A (ja) * 1987-12-21 1989-06-29 Toshiba Corp 電話機用電源回路
JP2016213239A (ja) * 2015-04-30 2016-12-15 アピックヤマダ株式会社 半導体装置の製造方法、樹脂モールド金型、およびリードフレーム
CN106239798A (zh) * 2016-08-29 2016-12-21 无锡市科虹标牌有限公司 一种大面板背面覆膜的模具
CN106217755A (zh) * 2016-08-30 2016-12-14 无锡市科虹标牌有限公司 一种改善进浇冲片材的装置

Also Published As

Publication number Publication date
JPS6258656B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-12-07

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