JPS5961917A - 複合電子部品 - Google Patents

複合電子部品

Info

Publication number
JPS5961917A
JPS5961917A JP57173415A JP17341582A JPS5961917A JP S5961917 A JPS5961917 A JP S5961917A JP 57173415 A JP57173415 A JP 57173415A JP 17341582 A JP17341582 A JP 17341582A JP S5961917 A JPS5961917 A JP S5961917A
Authority
JP
Japan
Prior art keywords
layer
dielectric constant
composite electronic
conductor
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57173415A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0125218B2 (pm
Inventor
片田　恒春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57173415A priority Critical patent/JPS5961917A/ja
Publication of JPS5961917A publication Critical patent/JPS5961917A/ja
Publication of JPH0125218B2 publication Critical patent/JPH0125218B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP57173415A 1982-10-01 1982-10-01 複合電子部品 Granted JPS5961917A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57173415A JPS5961917A (ja) 1982-10-01 1982-10-01 複合電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57173415A JPS5961917A (ja) 1982-10-01 1982-10-01 複合電子部品

Publications (2)

Publication Number Publication Date
JPS5961917A true JPS5961917A (ja) 1984-04-09
JPH0125218B2 JPH0125218B2 (pm) 1989-05-16

Family

ID=15960010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57173415A Granted JPS5961917A (ja) 1982-10-01 1982-10-01 複合電子部品

Country Status (1)

Country Link
JP (1) JPS5961917A (pm)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012182486A (ja) * 2005-06-02 2012-09-20 Koninkl Philips Electronics Nv Ｌｅｄアセンブリ及びモジュール
JP2013179261A (ja) * 2012-01-31 2013-09-09 Aisin Aw Co Ltd スイッチング素子ユニット
WO2014021112A1 (ja) * 2012-07-31 2014-02-06 アイシン・エィ・ダブリュ株式会社 スイッチング素子ユニット

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012182486A (ja) * 2005-06-02 2012-09-20 Koninkl Philips Electronics Nv Ｌｅｄアセンブリ及びモジュール
JP2013179261A (ja) * 2012-01-31 2013-09-09 Aisin Aw Co Ltd スイッチング素子ユニット
CN104160501A (zh) * 2012-01-31 2014-11-19 爱信艾达株式会社 开关元件单元
US9177948B2 (en) 2012-01-31 2015-11-03 Aisin Aw Co., Ltd. Switching element unit
WO2014021112A1 (ja) * 2012-07-31 2014-02-06 アイシン・エィ・ダブリュ株式会社 スイッチング素子ユニット
JP2014029944A (ja) * 2012-07-31 2014-02-13 Aisin Aw Co Ltd スイッチング素子ユニット
CN104335307A (zh) * 2012-07-31 2015-02-04 爱信艾达株式会社 开关元件单元

Also Published As

Publication number Publication date
JPH0125218B2 (pm) 1989-05-16

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