JPS5961917A - 複合電子部品 - Google Patents

複合電子部品

Info

Publication number
JPS5961917A
JPS5961917A JP57173415A JP17341582A JPS5961917A JP S5961917 A JPS5961917 A JP S5961917A JP 57173415 A JP57173415 A JP 57173415A JP 17341582 A JP17341582 A JP 17341582A JP S5961917 A JPS5961917 A JP S5961917A
Authority
JP
Japan
Prior art keywords
layer
dielectric constant
composite electronic
conductor
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57173415A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0125218B2 (enExample
Inventor
片田　恒春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57173415A priority Critical patent/JPS5961917A/ja
Publication of JPS5961917A publication Critical patent/JPS5961917A/ja
Publication of JPH0125218B2 publication Critical patent/JPH0125218B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP57173415A 1982-10-01 1982-10-01 複合電子部品 Granted JPS5961917A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57173415A JPS5961917A (ja) 1982-10-01 1982-10-01 複合電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57173415A JPS5961917A (ja) 1982-10-01 1982-10-01 複合電子部品

Publications (2)

Publication Number Publication Date
JPS5961917A true JPS5961917A (ja) 1984-04-09
JPH0125218B2 JPH0125218B2 (enExample) 1989-05-16

Family

ID=15960010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57173415A Granted JPS5961917A (ja) 1982-10-01 1982-10-01 複合電子部品

Country Status (1)

Country Link
JP (1) JPS5961917A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012182486A (ja) * 2005-06-02 2012-09-20 Koninkl Philips Electronics Nv Ｌｅｄアセンブリ及びモジュール
JP2013179261A (ja) * 2012-01-31 2013-09-09 Aisin Aw Co Ltd スイッチング素子ユニット
WO2014021112A1 (ja) * 2012-07-31 2014-02-06 アイシン・エィ・ダブリュ株式会社 スイッチング素子ユニット

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012182486A (ja) * 2005-06-02 2012-09-20 Koninkl Philips Electronics Nv Ｌｅｄアセンブリ及びモジュール
JP2013179261A (ja) * 2012-01-31 2013-09-09 Aisin Aw Co Ltd スイッチング素子ユニット
CN104160501A (zh) * 2012-01-31 2014-11-19 爱信艾达株式会社 开关元件单元
US9177948B2 (en) 2012-01-31 2015-11-03 Aisin Aw Co., Ltd. Switching element unit
WO2014021112A1 (ja) * 2012-07-31 2014-02-06 アイシン・エィ・ダブリュ株式会社 スイッチング素子ユニット
JP2014029944A (ja) * 2012-07-31 2014-02-13 Aisin Aw Co Ltd スイッチング素子ユニット
CN104335307A (zh) * 2012-07-31 2015-02-04 爱信艾达株式会社 开关元件单元

Also Published As

Publication number Publication date
JPH0125218B2 (enExample) 1989-05-16

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