JPS5958851A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS5958851A JPS5958851A JP57168932A JP16893282A JPS5958851A JP S5958851 A JPS5958851 A JP S5958851A JP 57168932 A JP57168932 A JP 57168932A JP 16893282 A JP16893282 A JP 16893282A JP S5958851 A JPS5958851 A JP S5958851A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- pattern
- ceramic
- leads
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W70/635—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W90/754—
-
- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57168932A JPS5958851A (ja) | 1982-09-28 | 1982-09-28 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57168932A JPS5958851A (ja) | 1982-09-28 | 1982-09-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5958851A true JPS5958851A (ja) | 1984-04-04 |
| JPS638620B2 JPS638620B2 (enExample) | 1988-02-23 |
Family
ID=15877214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57168932A Granted JPS5958851A (ja) | 1982-09-28 | 1982-09-28 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5958851A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6437842A (en) * | 1987-08-03 | 1989-02-08 | Shinko Electric Ind Co | Package for pga type semiconductor device |
| JPH01117084A (ja) * | 1987-10-29 | 1989-05-09 | Nec Corp | プラスチックピングリッドアレイパッケージ |
| US4890152A (en) * | 1986-02-14 | 1989-12-26 | Matsushita Electric Works, Ltd. | Plastic molded chip carrier package and method of fabricating the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56126951A (en) * | 1980-03-12 | 1981-10-05 | Hitachi Ltd | Semicondutor device |
| JPS56137645A (en) * | 1980-03-31 | 1981-10-27 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Semiconductor device |
| JPS5759454U (enExample) * | 1980-09-26 | 1982-04-08 |
-
1982
- 1982-09-28 JP JP57168932A patent/JPS5958851A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56126951A (en) * | 1980-03-12 | 1981-10-05 | Hitachi Ltd | Semicondutor device |
| JPS56137645A (en) * | 1980-03-31 | 1981-10-27 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Semiconductor device |
| JPS5759454U (enExample) * | 1980-09-26 | 1982-04-08 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4890152A (en) * | 1986-02-14 | 1989-12-26 | Matsushita Electric Works, Ltd. | Plastic molded chip carrier package and method of fabricating the same |
| JPS6437842A (en) * | 1987-08-03 | 1989-02-08 | Shinko Electric Ind Co | Package for pga type semiconductor device |
| JPH01117084A (ja) * | 1987-10-29 | 1989-05-09 | Nec Corp | プラスチックピングリッドアレイパッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS638620B2 (enExample) | 1988-02-23 |
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