JPS5954298A - 印刷配線用銅張り積層板の製造法 - Google Patents

印刷配線用銅張り積層板の製造法

Info

Publication number
JPS5954298A
JPS5954298A JP57164424A JP16442482A JPS5954298A JP S5954298 A JPS5954298 A JP S5954298A JP 57164424 A JP57164424 A JP 57164424A JP 16442482 A JP16442482 A JP 16442482A JP S5954298 A JPS5954298 A JP S5954298A
Authority
JP
Japan
Prior art keywords
bath
printedcircuit
heat
molding
laminated board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57164424A
Other languages
English (en)
Japanese (ja)
Other versions
JPS639760B2 (enrdf_load_stackoverflow
Inventor
正美 新井
星 郁夫
横地 潔
藤岡 厚
中川 武寿
康夫 宮寺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP57164424A priority Critical patent/JPS5954298A/ja
Publication of JPS5954298A publication Critical patent/JPS5954298A/ja
Publication of JPS639760B2 publication Critical patent/JPS639760B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Moulding By Coating Moulds (AREA)
JP57164424A 1982-09-21 1982-09-21 印刷配線用銅張り積層板の製造法 Granted JPS5954298A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57164424A JPS5954298A (ja) 1982-09-21 1982-09-21 印刷配線用銅張り積層板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57164424A JPS5954298A (ja) 1982-09-21 1982-09-21 印刷配線用銅張り積層板の製造法

Publications (2)

Publication Number Publication Date
JPS5954298A true JPS5954298A (ja) 1984-03-29
JPS639760B2 JPS639760B2 (enrdf_load_stackoverflow) 1988-03-01

Family

ID=15792883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57164424A Granted JPS5954298A (ja) 1982-09-21 1982-09-21 印刷配線用銅張り積層板の製造法

Country Status (1)

Country Link
JP (1) JPS5954298A (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54110466A (en) * 1978-02-17 1979-08-29 Kanegafuchi Chemical Ind Flexible printed circuit board with improved bend proofing strength
JPS55145159A (en) * 1979-04-12 1980-11-12 Furukawa Kinzoku Kogyo Kk Manufacture of copper foil with superior flexibility for printed wiring plate
JPS568227A (en) * 1979-06-29 1981-01-28 Kanegafuchi Chem Ind Co Ltd Continuous preparation of laminate covered by metal foil

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54110466A (en) * 1978-02-17 1979-08-29 Kanegafuchi Chemical Ind Flexible printed circuit board with improved bend proofing strength
JPS55145159A (en) * 1979-04-12 1980-11-12 Furukawa Kinzoku Kogyo Kk Manufacture of copper foil with superior flexibility for printed wiring plate
JPS568227A (en) * 1979-06-29 1981-01-28 Kanegafuchi Chem Ind Co Ltd Continuous preparation of laminate covered by metal foil

Also Published As

Publication number Publication date
JPS639760B2 (enrdf_load_stackoverflow) 1988-03-01

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