Ϊ260359 九、發明說明： 【發明所屬之技術領域】 本發明係關於—種 電路種應用於軟式積層 界面接著材的璟气社“ 硬°式積層電路板中作為 氧树月日含浸玻璃纖維布。 【先前技術】 目S在叙式、硬式或軟硬複合式& #感 ，通常會使用π 是°式的積層電路板製程中 接著材，故/ 含浸玻璃纖維布作為電路基板間的 妾者材，㈣環氧樹脂含浸玻璃 著力、耐化學柯呷關你者電路板的接 ί…、性及耐焊錫性等特性。 + ττ “㈣氧樹脂含浸玻璃纖維布應用於-般硬式 =板的積疊製程中，因其接著界面同為環氧樹脂，2 "rt力的材f ’彼此間的同f性冑，相容性高，故該 衣孔辦細含浸玻璃纖維布應用於一 為接著材時，卩以提供良好的接著力又/轉板積®間作 取匕然而’一般軟式電路板主要是使用聚亞醯胺(PI)、或 广：(PET、PEN)等材料製造而成，該聚亞醯胺(⑴或聚酿 φ Τ、PEN)等材料非屬環氧樹脂系列材料，故因彼此間材 j匹配性不佳’造成接著界面相容性差而降低彼此間的接 者力’以致於使環氧樹脂含浸玻璃纖維布應用軟性積層電 路板、或軟硬複合式積層電路板中作為接著材時，易因接 著力不佳而導致接著界面處有氣泡或接著力不均等情事， 而影響該電路板的品質。 【發明内容】 5 1260359 、之主要目的在於提供-種環氧樹脂含浸玻璃纖 用以心進％氧樹脂含浸玻璃纖維於 軟硬複合式積層雷踗祐由7认+ 硬式或 ， θ電路板中位於電路基材間接著強度、抗化 學性及耐熱性等。 為達成前揭目的，本發明所提出之技術方案主要传於 6亥％乳樹脂含浸破璃纖維布的一側或兩側面被覆—層 環氧樹脂接著層。 s 前述的改質環氧樹脂接著層是由環氧樹脂、柔軟,及 =劑:製而成，該柔軟劑可選自橡膠之類材料，該耐燃 刈則可遥用無機或有機的耐燃物質。 ‘ 、本發明以前揭技術方案之設計，將可達成之功效是本 ==被覆於環氧樹脂含浸玻璃纖維布上的改質環氧 -丨对月日接者層，使1靡田耖斗' ^ ^ ，、i八、硬八从軟硬複合式積層電路 H除其含有環氧官能基可與軟式、硬式的環氧樹脂基 谷，而維持既有環氧樹月旨含浸破璃 =的接著力夕卜，本發明更藉其改質環氧樹:::： j電路板之聚亞酿胺⑺）或聚糊Τ、ΡΕΝ)基板以及 裱氧樹脂基板之匹配性及高 土 璃纖維布不僅可庫用二該環氧樹脂含浸玻 板中，並可提供接著強度、耐化學：:式積層“ 等。 予注以及耐熱、耐焊錫性 【實施方式】 有關本發明環氧樹脂含浸玻璃纖維布具體實施例’如 1260359 第一圖所示，士西θ 要疋於該環氧樹脂含浸玻璃纖維布（Ϊ 260359 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to an oxygen tree-shaped impregnated glass fiber cloth in a hard-type laminated circuit board of a helium gas system in which a circuit type is applied to a soft laminated interface. [Prior Art] In the case of the Syrian, hard or soft-hard composite & feel, it is usually used in the laminated circuit board process of the π type, so that the impregnated glass fiber cloth is the leader among the circuit boards. (4) Epoxy resin impregnated with glass, chemical resistance, and the characteristics of soldering and soldering resistance of your circuit board. + ττ "(4) Oxygen resin impregnated glass fiber cloth is applied to - hard type = board In the stacking process, since the interface is the same as the epoxy resin, the material of the 2 "rt force is the same as the f-type, and the compatibility is high, so the fine-impregnated glass fiber cloth is applied to the hole. In the case of a backing material, the crucible is provided with a good adhesion and/or the inter-plate product. However, the general soft circuit board is mainly made of polyacrylamide (PI) or wide: (PET, PEN). Made of polytheneamine ((1) or poly brewing φ Τ, PEN) and other materials are not epoxy resin series materials, so the poor matching between the materials j is caused by the poor interface compatibility and the contact force between the two is reduced, so that the epoxy resin is impregnated with the glass fiber cloth. When a flexible laminated circuit board or a soft-hard composite laminated circuit board is used as a bonding material, it is easy to cause air bubbles or uneven force at the interface due to poor adhesion, which affects the quality of the circuit board. SUMMARY OF THE INVENTION 5 1260359, the main purpose is to provide a kind of epoxy resin impregnated glass fiber for centrifugation% oxygen resin impregnated glass fiber in soft and hard composite laminated layer Thunder Blessing by 7 hard + hard or θ circuit board It is located between the circuit substrate and the strength, chemical resistance and heat resistance. In order to achieve the foregoing object, the technical solution proposed by the present invention is mainly applied to one side or both sides of a 6 cc% latex resin impregnated glass cloth to cover a layer of epoxy resin. s The above modified epoxy resin adhesive layer is made of epoxy resin, soft, and agent: the softener may be selected from materials such as rubber, and the flame resistant ruthenium can be used for inorganic or organic flame resistant materials. . The design of the prior art solution of the present invention, the effect that can be achieved is that the modified epoxy-ruthenium layer coated on the epoxy resin impregnated glass fiber cloth is used to make the layer of the moon. ' ^ ^ , , i 八 , hard eight from the soft and hard composite layering circuit H except that it contains epoxy functional groups and soft and hard epoxy based valleys, while maintaining the existing epoxy tree impregnated glass = In addition, the present invention further improves the matching and high-strength glass of the epoxy resin tree:::: j circuit board poly-branched amine (7)) or poly-paste, ruthenium substrate and the epoxy resin substrate. The fiber cloth can be used not only in the impregnated glass plate of the epoxy resin, but also to provide the bonding strength and chemical resistance: "Laminating layer", etc. Pre-injection and heat resistance and solder resistance [Embodiment] Related to the epoxy resin impregnation of the present invention Glass fiber cloth specific embodiment 'as shown in the first figure of 1260359, the sigma θ is to be immersed in the epoxy resin impregnated glass fiber cloth (
Prepreg ) ( ι 〇 \ ^ 丄◦)的一側面被覆一預定厚度的改質璟4 樹脂接著層（]1、，—、土 — 叹貝¥虱 或者，如第二圖所示係該環氧推f γ 各沒：玻璃纖維布（1 Q 、曰 的改質… Μ上下兩側面分別被覆-預定厚度 貝衣乳樹脂接著芦f Ί Ί 、 纖維布（iow二述環氧樹脂含浸玻璃 不π 改貝％氧樹脂接著層（1 1 )的厚戶亿 不同的產品需求而設定。 厗度依 、’〔中亥改負裱氧樹脂接著層 有環氧樹脂之基礎材以及、、θ夂矛& 疋使用包括 扣多木权劑、耐燃劑等物質所配 :二成’其中該環氧樹脂的重量百分比為 的重量百分比為10〜45%、说+ 木軟劑 ，h “ 燃劑的重量百分比為10, 错此，使其可加強界 4b/0 反應中維持該接著並利用環氧樹赌交聯 耐燃劑改善其耐燃效果，藉此得到 ：〖生另以 性佳以及耐熱、耐焊錫性佳的P “ 、 耐化學 料。 、衣氧樹脂含浸玻璃纖維布材 質環氧樹脂接著，（11)中，混參於環氧科 中二柔軟劑可選用天然橡膠、合成橡膠、壓克力橡Γ 二寺柔軟“分子材料之—種或二種（含）；之 、、且5 ，該耐燃劑可選用如 抖之 一 π 虱虱化鋁、氫氧化鎂、三4扎 —銻、……等無機物質之一 虱化 合，或是選用切、氮、4 種（含）以上材料之組 種…以上材料之組合.等有機耐燃劑之-種或二 1260359 有關本發明的環氧樹脂含浸玻璃纖維布之應用情 以下即以數個應用例提出說明，其中： /， 第一種應用例主要係於一搢$批 於樹脂含浸破璃纖維布（ 1 〇)兩側面分別被覆一層10…改質環氧樹 (1 1 )，次經乾燥處理後得一接著基材（ 二曰 質環氧樹脂接著層（1"的材料組成分是取用重= 比35%的環氧樹脂（如：長春化玉BE-188:廳,T6〇= 、南帝-1 072 CTBN(合成橡膠）之·顧溶液（如. 體CTBN(合成橡膠）之順溶液）重量百分比⑽的 酮以及重量百分比 里力比15%的虱氧化链配製而成，前述 處理方式可採取逐段升溫的漸進乾燥方式進行: 基材（1 )貼合於二硬式環氧樹脂電路基板⑴：門者 如第三圖所示’經壓合機預熱2〇秒，再經19〇 壓力4〇kg/cm2麼合2分鐘處理後，再放置於供箱内⑽。广 分鐘進行熟化交聯反應，即可得到一硬式積層電路板 J式積層電路板的剝離強度（⑽如 值可達2.3一且該硬式積層電路板經甲乙： ；腿）中浸泡分鐘後取出， 再置於室溫環境下3Q分鐘自辭再㈣ ，其測試值仍可維持H.3kg/cm，且經2阶/ = 錫測試無爆板現象，另以該硬式積層電路板放置於17〇t /3小時的供箱中進行耐熱測試’其制離強度測試值仍维 =用T’c:’由此顯示本發明之環氧樹脂含浸玻璃纖維 布應用於二硬式環氧樹脂電路基板（2)間作為界 Ϊ260359 材日守’具有強度強以及良好的耐化學性、时熱性及耐 性等特性。 第-種應用例主要係於一環氧樹脂含浸玻璃纖維布（ 1 〇 )兩側面分別被覆一層25"m的改質環氧樹脂接著層 (11)(其組成分同第一種應用例），次經逐段升溫的 漸進乾燥處理後得一接著基材（1 )，又該接著基材（工 )貼合於二軟式銅電路基板（3 )之銅落面之間，如第四 圖所示，經壓合機190t龍20秒，再經190t/壓力 ^kg/cm |合2分鐘處理後取出，再作熟化交聯反應，即 y得到-軟式積層電路板，該軟式積層電路板的剝離強度 ^二1如咖）測試值可達2為/⑽，且該軟式積声 二路板=甲乙酮（Methy卜Ethyl㈣时；mek)中浸泡 为釦後取出，再置於室溫環境下3 0八ρ έ # 兄卜川分鐘自然乾燥， 剝離強度測試，其測試值 〇〇〇〇r .Qn 阻η」卓符於2· 4kg/cra，且經One side of Prepreg ) ( ι 〇 \ ^ 丄◦) is coated with a predetermined thickness of modified 璟 4 resin and then the layer (] 1, -, - soil - singular 虱 虱 or, as shown in the second figure, the epoxy Push f γ each: glass fiber cloth (1 Q, 曰 改 ... Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ Μ 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 、 、 、 、 、 、 、 、 Change the shell% oxygen resin and then set the layer (1 1 ) to meet the different product needs of the company. 厗度依, '[中海改负裱 树脂 树脂 接着 接着 接着 接着 有 有 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂& 疋 Uses a material including a lot of wood, a flame retardant, etc.: 20% of the weight percent of the epoxy resin is 10~45%, say + wood softener, h "burning agent The weight percentage is 10, which is the same, so that it can strengthen the boundary 4b / 0 reaction to maintain the subsequent and use the epoxy tree gambling cross-linking flame retardant to improve its flame resistance, thereby obtaining: "good quality and heat resistance, resistance P", chemical resistant material, and epoxy resin impregnated glass fiber cloth Epoxy resin, then, in (11), mixed with epoxy resin, two softeners can be selected from natural rubber, synthetic rubber, acrylic rubber, two temple soft "molecular material" or two (inclusive); And, 5, the flame retardant can be selected, such as one of π 虱虱 aluminum, magnesium hydroxide, three 4 扎 锑, ... and other inorganic substances, or cut, nitrogen, 4 ( The combination of the above materials...the combination of the above materials. The organic flame retardant-type or the two 1260359 The application of the epoxy resin impregnated glass fiber cloth of the present invention is described below in several application examples, wherein: The first application example is mainly based on a layer of 10 resin modified impregnated fiberglass cloth (1 〇) coated with a layer of 10... modified epoxy tree (1 1 ), which is dried to obtain a base. Material (2 曰 epoxy resin adhesive layer (1 " material composition is to take weight = 35% epoxy resin (such as: Changchun jade BE-188: Hall, T6 〇 =, Nandi-1 072 Percentage of CTBN (synthetic rubber) solution (eg, CTBN (synthetic rubber) solution) (10) The ketone and the weight percentage of the ruthenium are prepared by a 15% ruthenium oxidation chain, and the treatment can be carried out by a progressive drying method of stepwise heating: the substrate (1) is bonded to the two-hard epoxy circuit board (1): As shown in the third figure, the product is preheated by a press machine for 2 sec seconds, then treated with a pressure of 4 〇 kg/cm 2 for 2 minutes, and then placed in a supply box (10). The ripening cross-linking reaction is carried out in a wide range of minutes. The peel strength of a hard laminated circuit board J-type laminated circuit board can be obtained ((10) can be taken out after soaking for a minute in the hard laminated circuit board, and then placed in a room temperature environment 3Q Minutes from the remarks (4), the test value can still maintain H.3kg / cm, and the second-order / = tin test no explosion phenomenon, and the hard laminated circuit board placed in the 17〇t / 3 hours of the box Conducting the heat resistance test 'The test results of the separation strength are still dimensioned = T'c: 'This shows that the epoxy resin impregnated glass fiber cloth of the present invention is applied between the two-hard epoxy circuit substrate (2) as the boundary 260359 material day Shou' has strong strength and good chemical resistance, heat and resistance And other features. The first application example is mainly based on an epoxy resin impregnated glass fiber cloth (1 〇) coated with a layer of 25"m modified epoxy resin layer (11) (the composition of which is the same as the first application example) After the progressive drying process of the temperature-increasing step by step, the substrate (1) is obtained, and the substrate is bonded to the copper falling surface of the two-soft copper circuit substrate (3), as shown in the fourth figure. As shown in the figure, the machine is 190t long for 20 seconds, and then taken out after 190t/pressure ^kg/cm | for 2 minutes, and then matured and cross-linked, that is, y is obtained - soft laminated circuit board, the flexible laminated circuit board Peel strength ^ 2 1 such as coffee) test value up to 2 / (10), and the soft sound two-way board = methyl ethyl ketone (Methy Bu Ethyl (four); mek) immersed in the buckle after removal, and then placed at room temperature 3 0八ρ έ # 兄卜川 minute natural dry, peel strength test, the test value 〇〇〇〇r .Qn resistance η" Zhuo Fu at 2 · 4kg / cra, and
秒耐谭錫測試無爆板現象，另以該軟式積_ 路板放置⑨i㈣力小時的烘箱中進㈣ Z ^ 符在h9kg/cm，由此顯示本發明之产巧 树脂含浸玻璃纖維布岸 衣乳 界面接著材時，且有銅"電路板基材間作為 及对焊錫性等祕。 良好的耐化學性、耐熱性 第三種應用例主要係於一環氧樹 1 0 )兩側面分別祜萝M ln 又圾橘纖維布（ (η”…二層1Mm的改質環氧樹脂接著層 匕、！成分同弟一種應用例），次絲 漸進乾燥處理後得— 、^奴升溫的 接者基材（1) ’又該接著基材（] 1260359 )貼合於二硬式環氧樹脂電路基板（3)之間，同如第三 圖所示，經壓合機18(rc/壓力15kg/cm2預壓15分鐘: ，再經18(TC/壓力40kg/cm2壓合45分鐘處理後取出， 再作熟化交聯反應，即可得到一硬式積層電路板，該硬式 積層電路板的剝離強度（Peel strength )測試值可= 2.8kg/cm，且該硬式積層電路板經甲乙酮 K〜e ; MEK)中浸泡1G分鐘後取出，再置於室溫環境 J 30分鐘自然乾燥，再經剝離強度測試，其測試值仍可 f持於ukg/cm，且經288t/3G#、耐焊錫測試無爆板現 +、’另以該硬式積層電路板放置於17Gt/3小時的洪箱 t進仃对熱測言式，其剝離強度測試值仍維持在2·叫心， $,顯不本發明之環氧樹脂含浸玻璃纖維布應用於二硬式 環氧樹脂電路基板（2 )間作為界面接著材時，具有強度 金乂及良好的耐化學性、耐熱性及耐焊錫性等特性。 第四種應用例主要係於一環氧樹脂含浸玻璃纖維布（ 1 〇 )兩側面分別被覆-層1—的改質環氧樹脂接著層 1 1)(其組成分同第-種應用例），次經逐段升溫二 7進乾舞處理後得—接著基材（1)’又該接著基材（i 貼合於—硬式環氧樹脂電路基板（3)肖另—軟性 :路基板（3)之間’如第五圖所示，經壓合機19。。(:預 =〇屮秒後’再經19G°C^力概价㈣合2分鐘處理 二二再放入180t供箱中9°分鐘作熟化交聯反應，即 付$ &硬複合式積層電路板’該軟硬複合式積層電路 板的剝離強唐r P 】c λ 、 又（Peel strength)測試值可達 i 5kg/cm， 10 !26〇359 且遠軟硬複合式積層電路板經甲乙酮（Methyi—Ethyi e_e ; MEK)中浸泡1〇分鐘後取出，再置於室溫環境 30分鐘自然乾燥，再經剝離強度測試，其測試值仍可 意持於’且經288t/3〇秒耐痒錫測試無爆板現 象，另以該軟硬複合式積層電路板放置於17〇。〇/3小時 的烘箱中進行耐熱測試’其剝離強度測試值仍維持： •“以⑽，由此顯示本發明之環氧樹脂含浸玻璃纖維布應 二於該軟式mi電路基板（3 )與硬式環氧樹脂電路基板 2 )間作為界面接著材時’具有強度強以及良好的耐化 予性、耐熱性及耐焊錫性。 第五種應用例主要係於一環氧樹脂含浸玻璃纖維布（ 1 〇) -側面被覆一層25"的改質環氧樹脂接著層（丄 1)(組成分同應用例-），次經逐段升溫的漸進 理後得-接著基材（1)，又該接著基材（1)貼合二 硬式環氧樹脂電路基板（2)與另—軟性銅落電路基板（ 3 )之間’如第六圖所示’經壓合機I9rc預熱2〇秒後， 再經190°C/壓力40kg/cm2壓合2分鐘處理後取出，再放 入180°C烘箱中9G分鐘作熟化交聯反應，即可得到—軟硬 複合式積層電路板，該軟硬複合式積層電路板的剝離強产The second-resistant Tan tin test has no blasting phenomenon, and the soft product _ road board is placed in the oven of 9i (four) force hours. (4) The Z ^ symbol is at h9kg/cm, thereby showing the synthetic resin impregnated glass fiber cloth banknote of the present invention. At the interface of the milk interface, there is a secret between the copper "circuit board substrate and the solderability. Good chemical resistance, heat resistance The third application is mainly based on an epoxy tree 10) on both sides of the dill M ln and rubbing orange fiber cloth ((η"... two layers of 1Mm modified epoxy resin Layer 匕, !, a kind of application of the same brother), after the progressive drying process of the secondary yarn, the substrate of the heating substrate (1) and the substrate (1,260,359) are attached to the two-hard epoxy resin. Between the circuit boards (3), as shown in the third figure, pre-pressed by a press machine 18 (rc/pressure 15kg/cm2 for 15 minutes: and then after 18 (TC/pressure 40kg/cm2 for 45 minutes) After taking out and then curing the cross-linking reaction, a hard laminated circuit board having a Peel strength test value of 2.8 kg/cm and the hard laminated circuit board via methyl ethyl ketone K~e can be obtained. ; MEK) soaked for 1G minutes, then taken out, placed in a room temperature environment for 30 minutes, naturally dried, and then tested by peel strength, the test value can still be held at ukg / cm, and 288t / 3G #, solder resistance test Non-explosive plate is now +, 'Another hard-layered circuit board is placed in a 17Gt/3 hour flood box t into the heat test, which is stripped The strength test value is still maintained at 2, and the epoxy resin impregnated glass fiber cloth of the present invention is applied to the two-hard epoxy circuit board (2) as an interface backing material, and has strength and Good chemical resistance, heat resistance and solder resistance. The fourth application is mainly based on an epoxy resin impregnated glass fiber cloth (1 〇) coated on both sides - layer 1 - modified epoxy resin Layer 1 1) (the composition of which is the same as the first application), after the temperature is increased by 2 and 7 into the dry dance process, then the substrate (1)' is followed by the substrate (i is attached to the hard ring) Oxygen resin circuit board (3) Xiao-soft: between the road board (3) 'as shown in the fifth figure, through the press machine 19. (: pre-〇屮 after the second 'after 19G °C ^ force The estimated price (4) and 2 minutes for the second and second time, put 180t into the box for 9 ° minutes for the ripening cross-linking reaction, that is, pay $ & hard composite laminated circuit board 'the soft and hard composite laminated circuit board stripping strong Tang r P 】c λ, and (Peel strength) test value up to i 5kg / cm, 10 ! 26 〇 359 and far soft and hard composite laminated circuit board by methyl ethyl ketone Methyi—Ethyi e_e ; MEK) is taken out after soaking for 1 minute, then placed in a room temperature environment for 30 minutes to dry naturally, and then tested by peel strength, the test value can still be intended to be 'and itch is 288t/3 sec. The tin test has no blasting phenomenon, and the soft and hard composite laminated circuit board is placed at 17 〇. The heat resistance test is carried out in a 〇/3 hour oven. The peel strength test value is still maintained: • "(10), thus showing the present The epoxy resin impregnated glass fiber cloth of the invention has the strength and good chemical resistance and heat resistance as the interface between the soft mi circuit board (3) and the hard epoxy circuit board 2). Solder resistance. The fifth application example is mainly based on an epoxy resin impregnated glass fiber cloth (1 〇) - a side-coated layer of 25" modified epoxy resin back layer (丄1) (composition of the same application example), The progressive heating of the segment is followed by the substrate (1), and the substrate (1) is then bonded between the two-hard epoxy circuit substrate (2) and the other-soft copper-plated circuit substrate (3). The figure 6 shows that the pressurization machine I9rc is preheated for 2 sec seconds, then pressed at 190 ° C / pressure 40 kg / cm 2 for 2 minutes, and then taken out in a 180 ° C oven for 9 G minutes for ripening cross-linking. The reaction can be obtained as a soft-hard composite laminated circuit board, and the soft and hard composite laminated circuit board is stripped and produced.
Strength)測試值可達2·71ί_，且該軟硬複二 式積層電路板經曱乙_ (Methyl_Ethyl Ket〇ne ; 口 中浸泡Η)分鐘後取出，再置於室温環境下3q分鐘自 燥，再經剝離強度測試，其測試值仍可維持於2為心， 且經288°C/3G秒耐焊錫測試無爆板現象，另以該軟硬複 11 1260359 小時的烘箱中進行耐熱 2· lkg/cm，由此顯示本 用於軟式鋼箱電路基板 )間作為界面接著材時 、耐熱性及耐焊錫性等 合式積層電路板放置於1 70它/ 3 測試’其剝離強度測試值仍維持在 發明之環氧樹脂含浸玻璃纖維布應 (3 )及硬式環氧樹脂電路板（2 具有強度強以及良好的耐化學性 特性。 另，為證明本發明確可產生優於習用環氧樹脂含读 璃纖維布之功效，以下再列舉二比較例，與本發明前:之 應用例對照比較，其中： 第一比較例是將一習用環氧樹脂含浸玻璃纖維布（工 〇 )貼合於二軟性銅箱電路板（3 )之基板面之間，經塵 合機預熱2。秒後，再經19。口壓力4〇_壓合 :分鐘熱壓合處理後取出，再放入18(rc烘箱中9。分鐘作 A化父聯反應’即得到—軟式積層電路板，該軟式積層電 路板的剝離強度（Peel strength)測試值為G 5kg^， 且该軟式積層電路板經甲乙酮（—…，…Ke切狀； MEK )中/s:泡！ 〇分鐘後取出，再置於室溫環境下⑽分鐘 自然乾燥’再經剝離強度測試，其測試值為0.5kg/cm，且 备288口3()秒耐焊錫測試無爆板現象，另以該軟式積層 電路板放置於1 7 0。「/ q 1 η·±τ , / 小時的烘箱中進行耐熱測試，其 剝離強度測試值為〇. 5kg/cm。 ’、 第二比較例是將一習用環氧樹脂含浸玻璃纖維布㈠ 〇 )貼合於—硬性環氧樹脂電路板及一軟性銅羯電路板（ 3)之基板面之間’經壓合機19(rc預熱2"少後，再妳 12 1260359 190t/壓力40kg/cm2壓合2分鐘熱壓合處理後取出，再 放入1 80 C烘箱中90分鐘作熟化交聯反應，即得到一軟硬 複合式積層電路板，該軟硬複合式積層電路板的剝離強度 (Peel Strength)測試值為〇.7kg/cm，且該軟硬複合式 積層電路板經甲乙酮（Methy卜Ethyl Ket〇ne ; MEK)中 浸泡10分鐘後取出，再置於室溫環境下3〇分鐘乾燥，再 、、二剝離強度測试，其測試值為q· gkg/cm，且經288。(3 / 30 秒耐焊錫測試無爆板現象，另以該軟硬複合式積層電路板 放置於1 70°C / 3小時的烘箱中進行耐熱測試，其剝離強 度測試值為〇. 6kg/cm。 以上述二比較例與本發明應用於軟性、硬性或軟硬複 剝離強度 (kg/cm) 丨叫乂·。/rq '丨又丨J彳日孕父 經MEK浸泡後 剝離強度(kg/cm) ，戈口广衣尸；τ不· ~170°C /3Hr~ 剝離強度(kg/cm) 有無爆板 本發明 第一應用例 2.3 2.3 1.8 無 本發明 弟一應用例 2.4 2.4 1.9 無 本發明 第三應用例 2.8 2.8 2.3 Μ 本發明 第四應用例 1.5 1.4 1.2 無 本發明 第五應用例 2.7 2.5 2.1 無 習用 第一比較例 0.5 0.5 0.5 無 習用 第二比較例 0.7 0. 6 0.6 無 由上表的表列的數據當可看出 ，本發明具有改質環氧 13 1260359 樹脂接著層的環氧樹 軟硬複入式籍恩+ 3，又玻璃緘維布應用軟式、硬式或 =式積層電路板中作為界面接著 艮好的耐化學性、耐熱性及耐痒錫性。 本發明除前揭以第_岡％ 一 氧樹脂接著層。"J —圖所不兩側面設有改質環 X _ a 之私氧樹脂含浸破璃纖维布（1 〇 )貫施例應用於軟式、硬式或軟硬 ：：布（10 品外，本發明亦叮A ^ 更稷。式積層電路板之產 月亦可如弟六圖所揭示者，使。 一 i^}\ rSl ^ frfr ^ 圖所不早 玻璃#飨；^ f 1 Π1 1 )之環氧樹脂含浸 破离、I准布（1 〇)實施例應用 中，JL Φ LV Η 4 m > 干又攸口式積層電路板 ’、 疋^垓氧樹脂含浸破璃纖維布（1 〇)去Μ # 質環氧樹脂接著層之側面1 〇 )未a又改 h 面U硬式環氧樹脂電 )，另以改質環氧樹脂接著層 " A柘f q^ 1 1 )貼合軟式銅箔電路 基板（3)，再進行熱塵合以及熟化交聯反鹿 用該環氧樹脂含浸玻璃纖維布〜a此’利 路美〔 9〉^ Μ ^ ( 1 〇)與硬式環氧樹脂電 土板（2 )間的同質相容性， 層（1 1 )盥鈈々2 # 及以改貝環氧樹脂接著 層〔1 1 )與軟式銅箔電路基板 传盆可尸左 5 ^ ^ d )間的同質相容性， 使/、τ付知一項接者強度高，且耐化學性、耐⑽ 錫性良好之軟硬複合式積層式電路板。 干 綜上所述，本發明以其創新技術 習用環4科Η匕人、分士 1 八 雀可有效克服 …祕…璃纖維布之缺點，並可 硬式或軟硬複合式積層電路板中 業利用價值之創新設計’符合發明專利之要件:：：；ΐ 文提出申請。 犮依法具 【圖式簡單說明】 1260359Strength) test value up to 2·71ί_, and the soft and hard complex two-layer circuit board is taken out after 分钟(Methyl_Ethyl Ket〇ne; immersion 口 in the mouth), and then placed in a room temperature environment for 3q minutes self-drying, and then After the peel strength test, the test value can still be maintained at 2 cents, and the soldering test at 288 ° C / 3 G seconds is non-explosive, and the heat resistance is 2 · lkg / in the oven of 11 1260359 hours. Cm, which shows that the laminated circuit board used for the interface between the flexible steel box circuit board and the heat resistance and the solder resistance is placed at 1 70. The test results of the peel strength are still maintained in the invention. The epoxy resin impregnated glass fiber cloth should be (3) and the hard epoxy resin circuit board (2 has strong strength and good chemical resistance. In addition, in order to prove that the present invention can produce better than the conventional epoxy resin containing glass The effect of the fiber cloth, the following two comparative examples are listed, and compared with the application examples before the present invention, wherein: the first comparative example is to apply a conventional epoxy resin impregnated glass fiber cloth (worker) to the two soft copper. Box circuit board (3) Between the plates, preheated by the dust mixer 2. After 2 seconds, press the pressure of 4 〇 _ press: minute heat compression treatment, take out, then put into 18 (rc oven for 9. minutes for A The parent-link reaction is obtained as a soft laminated circuit board, and the peel strength (Peel strength) test value of the flexible laminated circuit board is G 5 kg^, and the soft laminated circuit board is subjected to methyl ethyl ketone (-..., ...Ke cut; MEK) Medium / s: bubble! Take out after 〇 minutes, then dry at room temperature (10 minutes), then peel strength test, the test value is 0.5kg / cm, and prepare 288 mouth 3 () seconds solder resistance test In the case of the blasting phenomenon, the soft laminated circuit board was placed in a heat resistance test in an oven of "1/q 1 η·±τ , /hour, and the peeling strength test value was 〇. 5 kg/cm. ', In the second comparative example, a conventional epoxy resin impregnated glass fiber cloth (1) is bonded between a hard epoxy circuit board and a substrate surface of a flexible copper enamel circuit board (3). Preheating 2" Less, then 妳12 1260359 190t/pressure 40kg/cm2 Press for 2 minutes After hot pressing, take out and put in 1 80 C The curing cross-linking reaction was carried out in an oven for 90 minutes to obtain a soft and hard composite laminated circuit board. The peel strength (Peel Strength) test value of the soft and hard composite laminated circuit board was 〇.7 kg/cm, and the soft and hard composite The laminated circuit board was taken out after being immersed in methyl ethyl ketone (Methy Ethyl Ket〇ne; MEK) for 10 minutes, and then dried at room temperature for 3 minutes, and then, the peel strength test was performed, and the test value was q· Gkg/cm, and passed 288. (3 / 30 seconds solder resistance test without blasting phenomenon, the soft and hard composite laminated circuit board was placed in an oven at 1 70 ° C / 3 hours for heat resistance test, the peel strength test value is 〇. 6kg / cm Applying the above two comparative examples and the present invention to soft, hard or soft and hard peeling strength (kg/cm) 丨 乂 · · /rq '丨 丨 彳 J彳 day pregnant father after MEK immersion peel strength (kg / Cm), Gekou Guangyi corpse; τ not·~170°C /3Hr~ Peeling strength (kg/cm) With or without blasting board The first application example of the invention 2.3 2.3 1.8 No application of the present invention 2.4 2.4 1.9 Invention Third Application Example 2.8 2.8 2.3 第四 Fourth Application Example 1.5 1.4 1.2 No fifth application example of the present invention 2.7 2.5 2.1 No-use first comparative example 0.5 0.5 0.5 No-use second comparative example 0.7 0. 6 0.6 No As can be seen from the table of the above table, the present invention has a modified epoxy 13 1260359 resin followed by a layer of epoxy tree soft and hard re-entrants genius + 3, and glass 缄 缄 应用 application soft, hard or = In the laminated circuit board, the chemical resistance, heat resistance and itch resistance of the interface are improved. In addition to the first embodiment of the present invention, the first layer is provided with a modified oxygen ring impregnated glass fiber cloth (1 〇). Applied to soft, hard or soft:: cloth (10 products, the invention is also A ^ more 稷. The production month of the laminated circuit board can also be as disclosed in the six figures. One i ^} \ rSl ^ frfr ^ 图所早早玻璃#飨;^ f 1 Π1 1 ) Epoxy resin impregnation, I quasi-cloth (1 〇) Example application, JL Φ LV Η 4 m > Dry and mouthwash Laminated circuit board ', 疋 垓 垓 垓 含 破 破 破 破 破 破 破 Μ Μ Μ 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂 环氧树脂Epoxy resin adhesive layer " A柘fq^ 1 1 ) adhere to the soft copper foil circuit board (3), and then carry out thermal dusting and curing cross-linking anti-deer with the epoxy resin impregnated glass fiber cloth ~ a this The homogenous compatibility between Lilumei [9>^ Μ ^ (1 〇) and hard epoxy resin earthboard (2), layer (1 1 ) 盥鈈々 2 # and modified shell epoxy [1 1 ) and soft The homogenous compatibility between the foil circuit substrate and the left 5 ^ ^ d of the corpse can make /, τ a high-hard composite laminated circuit with high strength, chemical resistance and good resistance to (10) tin. board. In summary, the present invention can effectively overcome the shortcomings of the glass fiber cloth by using the innovative technology of the ring 4, and the division of the 1st bird can be hard or soft and hard composite laminated circuit board industry. Innovative design of the use of value 'in accordance with the requirements of the invention patent:::; ΐ text filed an application.犮Legal according to the law [Simple description] 1260359
第-圖是本發明於環氧樹脂含浸玻璃纖維布—I 復改質％氧樹脂接著層實施例的平面示立1面破 第二圖是本發明於環氧樹脂含浸玻璃纖維布。 別被覆改質環氧樹脂接著層實施例的平側面分 ^ J十面$立Fig. 1 is a plan view showing an embodiment of the present invention in which an epoxy resin impregnated glass fiber cloth - I is a modified epoxy resin. The flat side of the embodiment of the modified epoxy resin is not coated.
第一圖是本务明第二圖所示實施例貼合於 樹脂電路板之間之第一應用例及第 平面示意圖。 硬式環氧 二應用例之 第四圖是本發明第：圖所示實施例貼合於：軟式銅$ 電路之間之第二應用例平面示意圖。 第五圖是本發明第二圖所示實施例貼合於—硬式環! 樹脂電路板及-軟式銅電路板之間之第四屬 用例平面示意圖。 第六圖是本發明第一圖所示實施例應用於一硬式環氧The first figure is a first application example and a plan view showing the embodiment shown in the second figure of the present invention attached to a resin circuit board. The fourth embodiment of the hard epoxy application example is a plan view of the second application example of the embodiment of the present invention attached to the circuit of the soft copper. Fig. 5 is a plan view showing the fourth exemplification of the embodiment shown in Fig. 2 of the present invention which is bonded to a hard ring! resin circuit board and a soft copper circuit board. Figure 6 is a view of the first embodiment of the present invention applied to a hard epoxy
樹脂電路板及-軟式路板之間之第五應 用例平面示意圖。 【主要元件符號說明】 (1 )接著基材 2 )硬式ί衣氧樹脂電路板 3)軟式銅箔電路板 1 〇)環氧樹脂含浸玻璃纖維I 1 1)改質環氧樹脂接著層 15A schematic plan view of a fifth application between a resin circuit board and a flexible circuit board. [Main component symbol description] (1) Substrate 2) Hard oxy-resin circuit board 3) Flexible copper foil circuit board 1 〇) Epoxy resin impregnated glass fiber I 1 1) Modified epoxy resin layer 15