JPS5953680A - スパツタ装置 - Google Patents

スパツタ装置

Info

Publication number
JPS5953680A
JPS5953680A JP16308182A JP16308182A JPS5953680A JP S5953680 A JPS5953680 A JP S5953680A JP 16308182 A JP16308182 A JP 16308182A JP 16308182 A JP16308182 A JP 16308182A JP S5953680 A JPS5953680 A JP S5953680A
Authority
JP
Japan
Prior art keywords
target
targets
opposing
film
magnetic field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16308182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6335710B2 (enrdf_load_stackoverflow
Inventor
Sadao Kadokura
貞夫 門倉
Kazuhiko Honjo
本圧　和彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teijin Ltd
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Priority to JP16308182A priority Critical patent/JPS5953680A/ja
Publication of JPS5953680A publication Critical patent/JPS5953680A/ja
Publication of JPS6335710B2 publication Critical patent/JPS6335710B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
JP16308182A 1982-09-21 1982-09-21 スパツタ装置 Granted JPS5953680A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16308182A JPS5953680A (ja) 1982-09-21 1982-09-21 スパツタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16308182A JPS5953680A (ja) 1982-09-21 1982-09-21 スパツタ装置

Publications (2)

Publication Number Publication Date
JPS5953680A true JPS5953680A (ja) 1984-03-28
JPS6335710B2 JPS6335710B2 (enrdf_load_stackoverflow) 1988-07-15

Family

ID=15766817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16308182A Granted JPS5953680A (ja) 1982-09-21 1982-09-21 スパツタ装置

Country Status (1)

Country Link
JP (1) JPS5953680A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4784739A (en) * 1986-12-26 1988-11-15 Teijin Limited Method of producing a thin film by sputtering and an opposed target type sputtering apparatus
US4842708A (en) * 1982-02-16 1989-06-27 Teijin Limited Perpendicular magnetic recording medium, method for producing the same, and sputtering device
US4874497A (en) * 1986-10-11 1989-10-17 Nippon Telegraph And Telephone Corporation Thin film forming apparatus
JP2007080806A (ja) * 2005-09-13 2007-03-29 Samsung Sdi Co Ltd 有機発光表示装置及び蒸着方法
CN100432286C (zh) * 2003-12-31 2008-11-12 天津大学 多副对向靶薄膜溅射仪
US8147657B2 (en) * 2006-01-25 2012-04-03 Ulvac, Inc. Sputtering device and film forming method
US20140158531A1 (en) * 2012-12-06 2014-06-12 Samsung Display Co., Ltd. Sputtering apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS573831A (en) * 1980-06-10 1982-01-09 Matsushita Electric Ind Co Ltd Vacuum metallizing method
JPS5743986A (en) * 1980-08-30 1982-03-12 Shimadzu Corp Film forming apparatus
JPS58189371A (ja) * 1982-04-28 1983-11-05 Teijin Ltd スパツタ装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS573831A (en) * 1980-06-10 1982-01-09 Matsushita Electric Ind Co Ltd Vacuum metallizing method
JPS5743986A (en) * 1980-08-30 1982-03-12 Shimadzu Corp Film forming apparatus
JPS58189371A (ja) * 1982-04-28 1983-11-05 Teijin Ltd スパツタ装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4842708A (en) * 1982-02-16 1989-06-27 Teijin Limited Perpendicular magnetic recording medium, method for producing the same, and sputtering device
US4874497A (en) * 1986-10-11 1989-10-17 Nippon Telegraph And Telephone Corporation Thin film forming apparatus
US4784739A (en) * 1986-12-26 1988-11-15 Teijin Limited Method of producing a thin film by sputtering and an opposed target type sputtering apparatus
CN100432286C (zh) * 2003-12-31 2008-11-12 天津大学 多副对向靶薄膜溅射仪
JP2007080806A (ja) * 2005-09-13 2007-03-29 Samsung Sdi Co Ltd 有機発光表示装置及び蒸着方法
US8147657B2 (en) * 2006-01-25 2012-04-03 Ulvac, Inc. Sputtering device and film forming method
US20140158531A1 (en) * 2012-12-06 2014-06-12 Samsung Display Co., Ltd. Sputtering apparatus

Also Published As

Publication number Publication date
JPS6335710B2 (enrdf_load_stackoverflow) 1988-07-15

Similar Documents

Publication Publication Date Title
TW495827B (en) A cylindrical carriage sputtering system
JP2003141719A (ja) スパッタリング装置及び薄膜形成方法
JPS6256575B2 (enrdf_load_stackoverflow)
JP2921874B2 (ja) 高効率シートプラズマスパタリング装置
JPS5953680A (ja) スパツタ装置
WO2003009394A1 (fr) Procede de formation d'une couche d'electrode transparente et dispositif correspondant
WO2002041363A2 (en) System and methods for laser assisted deposition
US20150060262A1 (en) Sputtering systems for liquid target materials
CN110344018B (zh) 一种多阴极连续镀膜腔室
JPH034621B2 (enrdf_load_stackoverflow)
KR101299755B1 (ko) 스퍼터링 장치, 박막 형성 방법 및 전계 효과형 트랜지스터의 제조 방법
TWI499681B (zh) 產生高密度外包層的方法與裝置
US20120097525A1 (en) Method and apparatus to control ionic deposition
JP4229803B2 (ja) 透明導電膜の製造方法
CN201169619Y (zh) 一种用于快速制备氮化镓薄膜的装置
CN117364050A (zh) 一种涂层装置及卷绕真空镀膜系统
CN103074586B (zh) 一种低温低损伤多功能复合镀膜的装置和方法
JPH0617248A (ja) スパッタリング装置
Cord et al. Future media manufacturing-more than just conventional sputtering
JPS59116376A (ja) 対向タ−ゲツト式スパツタ装置
JPS6086272A (ja) スパツタ装置
US10748571B2 (en) Mechanically balanced and magnetically unbalanced device
Joshi et al. Fabrication of Thin Targets of 92,100 Mo
JPS6230876A (ja) 対向タ−ゲツト式スパツタ装置
JP2011063823A (ja) スパッタ源およびスパッタ装置ならびにこれを用いた多層膜の製造方法