JPS5948981A - High density printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to a high-density printed wiring board in which a hole or through hole for inserting a component is formed in a board pattern to which a signal pattern is connected. Regarding.

[Technical background of the invention]

With the recent increase in the density of semiconductor integrated circuits, there are also detailed rules for increasing the density of printed wiring boards.

For example, conventionally, if the diameter of the land pattern is 1.5 mm,
Ha D I P (Dual-Inline I'ack
ge) type IC (Integrated C1rcu)
It) between the bins (2,54mu+) with a width of 0.
35 mm O,) From the one that had been passed through a single tree,
There is a tendency to make the width of the land pattern smaller and finer by reducing the line width to 0.25 mIn.

[Problems with background technology]

However, this pattern miniaturization can be traced to two or three ICC bins Jζ lines on the mask, even though it is Z.

In manufacturing the printed wiring board, problems such as those shown in FIG. 1 occur, making it difficult to realize this. -In other words, when drilling the hole 2 for IC insertion in the land pattern 1, there was one slope where only one color was rubbed, resulting in a disconnection accident between the land pattern 1 and the signal pattern 3. This is because it becomes easier to purify. Such accidents increase as the diameter of the land pattern J and the width of the No. 46 V-turn 3 become smaller.

[Object of the Invention] [This invention was made in view of the above circumstances] The seventh object of the present invention is to prevent miniaturization of land patterns and signal patterns and hole openings due to positional misalignment during manufacturing. An object of the present invention is to provide a high-density printed wiring board that can prevent a disconnection accident between a land pattern and an immum turn.

[Summary of the invention]

The present invention provides a high-density printed wiring board in which a hole or through hole for inserting one component is formed in a land pattern connected to a signal pattern. It branches in multiple directions immediately before connecting to the land pattern, and connects to the land pattern from multiple directions.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

In the second factor, %11.12 is the land pattern in the high-density printed wiring board, respectively. Signal patterns (including power supply lines and GND lines) 13 and 14 are connected to these land patterns 11 and 12, respectively.

Signal patterns 13 and 14 are land patterns '1, respectively.
It branches in three directions in front of No. 1 and No. 12, and l'f Mc is formed from three directions into Runto No., Turn No. 1 No., and No. 2.

In such a configuration, the land pattern 11.12
For example, when forming holes 15 and 16 for inserting IC pins, turn 1 of hole 15 so that
Even if a 1'f circle shift occurs, there will be no failure. In other words, the signal pattern 1 is caused by a 1iij shift in hole J5.
In 3, there is a disconnection between the branch pattern 13a of the 1st tree and J in the land pattern! Even if llη1 is caused by ζ, the sacral branching pattern 13b, 1. ic and lantono S
There is no abnormality in the circuit operation because there is a connection between the turn 1) and the turn 1). 'jj knee 4
It is something. ,).

The shape of the public corporation of the begging pattern 13 may be the shape shown in FIG. 2, or the shape shown in FIG. 3,
Further, as shown in FIG. 4, the shape of the land pattern J7 is made into a rectangle, and the molecular directions of -718 are set in two directions (branch pattern 18a).

18b). Furthermore, in FIG. 4, the one-branch patterns 18a and 18b are connected to the center portions of the two sides of the land pattern 17, respectively.
As shown in FIG. 5, the branch patterns 1sa and 18b are connected to portions near the corners of the land pattern J7.

This can effectively prevent wire breakage accidents due to misalignment of the holes 19.

〔Effect of the invention〕

As described above, this invention effectively prevents disconnection accidents between the land pattern and the signal pattern even if the land pattern and the signal hole or turn become finer and the position of the hole is misaligned during manufacturing. Therefore, it is possible to provide a high-density printed wiring board that enables high-density pattern design.

[Brief explanation of drawings]

Fig. 1 shows a wiring pattern on a conventional high-density printed wiring board; Fig. 2 shows a wiring pattern on a high-density printed wiring board according to an embodiment of the present invention;
5 through 5 are diagrams showing other embodiments of the present invention, respectively. 11. No. 2...Land pattern, 13.14...
・No. 46 pattern, 13a, 13b, J,? c,
14a, no 4b. 14c...branch pattern, 15, no6...hole.

Claims (1)

[Claims] In the high-density printed wiring system in which a hole is formed in the land pattern to which the signal pattern is connected, the above pattern (No. 8 pattern branches in multiple directions immediately before being connected to the land pattern, A high-density printed wiring board, characterized in that the board is connected to the land pattern.