JPS6218796A - Laminated circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] With the recent increase in performance and density of devices, a multilayer circuit board is required to have an increased capacity for accommodating wiring within the board.

In view of the above-mentioned requirements, the present invention proposes a means for configuring a power bus pattern that improves positional variations in impedance or non-uniformity in impedance distribution, particularly for power supply circuits in a laminated circuit board.

[Industrial application field]

The present invention relates to a laminated circuit board related to a power supply circuit that coexists with various signal line circuits.

A laminated circuit board called a multilayer printed wiring board is
A thin copper film is most often used as the wiring conductor, and an epoxy resin board with a glass base is used as the glabellar insulating material, and interlayer circuit connections are made with conductive through holes. In order to cope with the increase in the wiring capacity of multilayer circuit boards such as signal path lines for highly integrated components such as LSIs mounted on these boards, the number of multilayer circuit boards is generally increasing and the size of the boards is increasing. .

Furthermore, in addition to the wiring capacity, the laminated circuit board also has characteristics such that, in order to guarantee signal transmission characteristics and operational reliability of mounted components, for example, a power supply path line provided on an inner layer of the board must have low impedance. is required. However, with the increase in the wiring capacity, it is no longer possible to provide a wide-area, low-impedance power supply circuit, which has been provided in the past, which poses a problem in stabilizing the power supply of the board, and countermeasures are required.

[Prior art and problems to be solved by the invention] FIG. 1 shows a perspective view of a laminated substrate on which a power lotus pattern (circuit) is formed.

The circuit configuration in the perspective view is as follows.

In the figure, reference numeral 12 denotes a power circuit pattern (an inverted U-shaped pattern) formed by etching the wl thickness of one substrate 10 inside the stack. 13 is a power supply side connection portion of the power bus pattern 12; 14 is a component mounted on the front substrate side (not shown); and 15 is a component 14 connected to the bus pattern 12.
A lead that means through-hole ventilation.

and 16, 17 and 18 are signal wiring patterns formed on the respective substrate surfaces. The signal wiring pattern 16 is formed on the same substrate as the power lotus pattern substrate 10,
Wiring patterns 17 and 18 are through-hole conductive leads 1
9 and 20, and is formed on another circuit board.

By the way, the power supply to the mounted components 14 via the two exemplary through-hole conductive leads 15 and 15 is performed by arranging the area of the signal wiring pattern 16, even though both should be supplied at the same potential. The power supply bus pattern 12 becomes a detour as shown by the dashed line 21 in the figure, and furthermore, the bus pattern circuit 22 becomes partially narrow, making it difficult to stabilize the power supply potential (power supply impedance becomes high). As a result.

This also interferes with the operation of components mounted on the laminated circuit board, and countermeasures are required.

[Means for solving problems]

FIG. 1 is a perspective view of a laminated circuit board as an embodiment of the configuration of the power supply bus pattern of the present invention.

The present invention provides a circuit board 1 in which at least a power bus pattern 12 and a wiring pattern area 9 coexist. and pattern connecting parts 3, 4 and 5 which are connected through-hole to a single (or plural) board different from the circuit board 1 on which the bus pattern 12 is formed and which compensate for uneven positional potential distribution of the power bus pattern 12. This is a laminated circuit board comprising a circuit board 2 (the figure shows one laminated board) on which is formed.

[For production]

A signal wiring pattern area is set on the same substrate l on which the power bus pattern 12 is formed, and the wiring capacity accommodated within the substrate is increased, so that it is possible to meet the recent demand for high-density multilayer substrates.

Furthermore, the stability and reliability of the operation of components mounted on the laminated board are improved.

(Example) Although the example of the power supply bus pattern circuit shown in FIG. 1 is exemplified by the same U-shaped pattern as shown in FIG. 2, the pattern of the diagonal lines is not limited to this.

A power bus pattern 12 is provided that provides a wide area pattern to any circuit board 1 other than the front side substrate to be laminated. The impedance of the eight-dimensional pattern 12 is as low as possible compared to the signal wiring formed in the pattern region 9.

In the figure, reference numeral 7 denotes a power supply electrode connected to an edge connector formed on the end surface of the circuit board on the front side of the laminated circuit.

The power feeding electrode 7 is connected to a power bus pattern 12 through a through hole connection 8. In addition, power bus pattern 12
The pattern connecting portions 3 and 4 of the bus pattern 12 are formed on a circuit board different from the substrate 1 on which the bus pattern 12 is provided. The bus connectors 3 and 4 are connected to the power bus pattern 12 through through holes.

The pattern connecting parts 3 and 4 are not necessarily limited to the same board, and may be set to a plurality of board circuits as necessary.

Furthermore, if the low impedance of the power supply cannot be ensured by the two pattern connection parts 3 and 4, it is also possible to set the pattern connection part 5 to the power supply bus pattern 12 and make a through-hole connection with the bus pattern 12. do not have.

〔Effect of the invention〕

As described above, the laminated board having the power bus pattern configuration of the present invention has the advantage that the operation of the board circuit becomes stable because the power supply impedance distribution for driving components mounted on the board becomes uniform.

From this point of view, the industrial effects of the present invention are significant.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a laminated circuit board as an embodiment of the circuit configuration of the power supply lotus pattern of the present invention. FIG. 2 is a perspective view of a conventional laminated board. In the figure, ■ is a board on which a wiring pattern area and a power bus pattern coexist. 2 is a substrate on which a pattern connection portion is formed. 3.4.5 are both pattern connection parts. 9 is a wiring pattern connection part.

Claims (1)

[Claims] At least a substrate (1) on which a wiring pattern region (9) and a power bus pattern (12) coexist, and a pattern connection that is through-hole connected to the bus pattern (12) and compensates for the potential of the bus pattern (12). Part (3), (
4) and a substrate (2) on which (5) are formed.