JPS5948945A - 半導体用リ−ドフレ−ムの製造方法 - Google Patents
半導体用リ−ドフレ−ムの製造方法Info
- Publication number
- JPS5948945A JPS5948945A JP16019882A JP16019882A JPS5948945A JP S5948945 A JPS5948945 A JP S5948945A JP 16019882 A JP16019882 A JP 16019882A JP 16019882 A JP16019882 A JP 16019882A JP S5948945 A JPS5948945 A JP S5948945A
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- metal strip
- mask
- coated
- composite metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 5
- 238000004519 manufacturing process Methods 0.000 title description 7
- 229910052751 metal Inorganic materials 0.000 claims description 42
- 239000002184 metal Substances 0.000 claims description 42
- 239000002131 composite material Substances 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 235000008708 Morus alba Nutrition 0.000 claims description 5
- 240000000249 Morus alba Species 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 239000007779 soft material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 11
- 239000007788 liquid Substances 0.000 description 8
- 239000002689 soil Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000010953 base metal Substances 0.000 description 3
- 238000005253 cladding Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 101150110330 CRAT gene Proteins 0.000 description 1
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 1
- 241000257465 Echinoidea Species 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4828—Etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16019882A JPS5948945A (ja) | 1982-09-14 | 1982-09-14 | 半導体用リ−ドフレ−ムの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16019882A JPS5948945A (ja) | 1982-09-14 | 1982-09-14 | 半導体用リ−ドフレ−ムの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5948945A true JPS5948945A (ja) | 1984-03-21 |
| JPS6347345B2 JPS6347345B2 (enrdf_load_stackoverflow) | 1988-09-21 |
Family
ID=15709922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16019882A Granted JPS5948945A (ja) | 1982-09-14 | 1982-09-14 | 半導体用リ−ドフレ−ムの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5948945A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7790048B2 (en) | 2004-03-10 | 2010-09-07 | S.O.I.Tec Silicon On Insulator Technologies | Treatment of the working layer of a multilayer structure |
-
1982
- 1982-09-14 JP JP16019882A patent/JPS5948945A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7790048B2 (en) | 2004-03-10 | 2010-09-07 | S.O.I.Tec Silicon On Insulator Technologies | Treatment of the working layer of a multilayer structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6347345B2 (enrdf_load_stackoverflow) | 1988-09-21 |
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