JPS5940555A - 電子部品の製造方法 - Google Patents

電子部品の製造方法

Info

Publication number
JPS5940555A
JPS5940555A JP57149334A JP14933482A JPS5940555A JP S5940555 A JPS5940555 A JP S5940555A JP 57149334 A JP57149334 A JP 57149334A JP 14933482 A JP14933482 A JP 14933482A JP S5940555 A JPS5940555 A JP S5940555A
Authority
JP
Japan
Prior art keywords
manufacturing
glass tube
lead
electronic components
large diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57149334A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0129070B2 (enrdf_load_stackoverflow
Inventor
Hajime Terakado
寺門 肇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57149334A priority Critical patent/JPS5940555A/ja
Publication of JPS5940555A publication Critical patent/JPS5940555A/ja
Publication of JPH0129070B2 publication Critical patent/JPH0129070B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57149334A 1982-08-30 1982-08-30 電子部品の製造方法 Granted JPS5940555A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57149334A JPS5940555A (ja) 1982-08-30 1982-08-30 電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57149334A JPS5940555A (ja) 1982-08-30 1982-08-30 電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPS5940555A true JPS5940555A (ja) 1984-03-06
JPH0129070B2 JPH0129070B2 (enrdf_load_stackoverflow) 1989-06-07

Family

ID=15472831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57149334A Granted JPS5940555A (ja) 1982-08-30 1982-08-30 電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPS5940555A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62201945U (enrdf_load_stackoverflow) * 1986-06-12 1987-12-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62201945U (enrdf_load_stackoverflow) * 1986-06-12 1987-12-23

Also Published As

Publication number Publication date
JPH0129070B2 (enrdf_load_stackoverflow) 1989-06-07

Similar Documents

Publication Publication Date Title
JPS5940555A (ja) 電子部品の製造方法
JPH01315167A (ja) 半導体装置
JPH04222109A (ja) 電子部品の接続構造およびその構造を用いた水晶発振器
JPS6240439Y2 (enrdf_load_stackoverflow)
JPH06349561A (ja) リード端子の配線基板への半田付け方法
JPS6112095A (ja) 混成集積回路装置
JPH04163864A (ja) 混成集積回路のクリップ端子
JP3174975B2 (ja) 電子部品搭載装置
JPS6123391A (ja) チツプ状回路部品の取付装置
JP2973687B2 (ja) ラジアルリード電子部品
JPH0120559B2 (enrdf_load_stackoverflow)
JPS5940556A (ja) ガラス封止型電子部品およびその製造方法
JPS5950595A (ja) 電子部品実装構造および実装方法
JPS6011469U (ja) 混成集積回路
JPS58118188A (ja) 印刷配線基板装置
JPS59225553A (ja) 半導体装置
JPS59204265A (ja) 混成集積回路の製造方法
JPH0378288A (ja) 半導体装置
JPS6160575B2 (enrdf_load_stackoverflow)
JPS63102306A (ja) セラミツクコンデンサ
JPS5832602U (ja) 厚膜回路用サ−ミスタ
JPS6116594A (ja) 半導体装置
JPH1076U (ja) 両面実装形基板用ヒューズ
JPS58131654U (ja) 厚膜電極構造
JPS6033456U (ja) 半導体装置