JPS5940555A - 電子部品の製造方法 - Google Patents
電子部品の製造方法Info
- Publication number
- JPS5940555A JPS5940555A JP57149334A JP14933482A JPS5940555A JP S5940555 A JPS5940555 A JP S5940555A JP 57149334 A JP57149334 A JP 57149334A JP 14933482 A JP14933482 A JP 14933482A JP S5940555 A JPS5940555 A JP S5940555A
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- glass tube
- lead
- electronic components
- large diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57149334A JPS5940555A (ja) | 1982-08-30 | 1982-08-30 | 電子部品の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57149334A JPS5940555A (ja) | 1982-08-30 | 1982-08-30 | 電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5940555A true JPS5940555A (ja) | 1984-03-06 |
JPH0129070B2 JPH0129070B2 (enrdf_load_stackoverflow) | 1989-06-07 |
Family
ID=15472831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57149334A Granted JPS5940555A (ja) | 1982-08-30 | 1982-08-30 | 電子部品の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5940555A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62201945U (enrdf_load_stackoverflow) * | 1986-06-12 | 1987-12-23 |
-
1982
- 1982-08-30 JP JP57149334A patent/JPS5940555A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62201945U (enrdf_load_stackoverflow) * | 1986-06-12 | 1987-12-23 |
Also Published As
Publication number | Publication date |
---|---|
JPH0129070B2 (enrdf_load_stackoverflow) | 1989-06-07 |
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